TR7700QE_Software_ch-v3.0_20180328 - 第5页

Test Research, Inc. TR7700Q E User Gu ide – S o f twar e v 3.6.5 逐點匹配 (CorMatch) 框 ............................................................... 100 3.6.6 引腳檢測 (Lead) 框 .................................................…

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目錄
前言 _________________________________________________________ 1
1 簡介 ______________________________________________________ 2
1.1 關於 TR7700QE ............................................................................................. 2
1.2 TRAOI 檔案格式 ............................................................................................ 2
1.3 選配裝置 ........................................................................................................ 2
2 基本專案製作 _______________________________________________ 4
2.1 開啟 TRAOI 主程式 ........................................................................................ 4
2.2 專案製作流程圖 ............................................................................................. 7
2.3 影像圖區的操作方式 ...................................................................................... 8
2.4 掃描全圖 ........................................................................................................ 9
2.5 設定參考座標點 ........................................................................................... 10
2.6 載入 CAD ................................................................................................ 14
2.7 產生多板資訊 ............................................................................................... 22
2.8 設定板子尺寸 ............................................................................................... 26
2.9 設定對位標記 ............................................................................................... 27
2.10 教程模式 ...................................................................................................... 30
2.10.1 第一階段:擷取影像 ....................................................................31
2.10.2 第二階段:座標對位 ....................................................................33
2.10.3 第三階段:佈局設定 ....................................................................35
2.10.4 第四階段:附加配置 ....................................................................37
3 編輯元件資料庫 ____________________________________________ 39
3.1 製作元件資料庫 ........................................................................................... 40
3.2 檢測的燈光 .................................................................................................. 52
3.3 代料影像影像處理方 ................................................................................. 55
3.4 檢測框的比對方式 ........................................................................................ 71
3.5 影像編輯區 .................................................................................................. 72
3.6 檢測框原理與參數說 ................................................................................. 78
3.6.1 高度量測(3D) ............................................................................78
3.6.2 焊錫高度(3DSolder) .................................................................83
3.6.3 錫橋檢測(Bridge) ......................................................................89
3.6.4 本體檢測(Chip) .........................................................................91
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TR7700QE User GuideSoftware v
3.6.5 逐點匹配(CorMatch) ............................................................... 100
3.6.6 引腳檢測(Lead) ...................................................................... 101
3.6.7 字元驗證(OCV) ...................................................................... 108
3.6.8 特徵匹配(PatMatch) ............................................................... 111
3.6.9 極性檢測(PolarPair) ................................................................ 113
3.6.10 顏色檢測(Void) ....................................................................... 116
3.6.11 平整檢測(Caliper) ................................................................... 124
3.6.12 圓形檢測(Circle) ..................................................................... 133
3.6.13 色碼檢測(Color Bar) ............................................................... 138
3.6.14 輪廓檢測(Contour) .................................................................. 140
3.6.15 邊緣計數(Edge) ...................................................................... 144
3.6.16 點偵測(Featurepoint) .......................................................... 145
3.6.17 前景比對(GoldenEye) ............................................................. 148
3.6.18 浮腳檢測(LiftLead) .................................................................. 155
3.6.19 字元辨別(OCR) ...................................................................... 155
3.6.20 焊盤定位(Pad) ........................................................................ 159
3.6.21 焊盤量測(PadMeasure) .......................................................... 162
3.7 常見元件所需的檢測框 ................................................................................167
3.7.1 晶片(Chip) .................................................................................. 167
3.7.2 排阻(Array) ................................................................................. 168
3.7.3 三角晶體(SOT) ........................................................................... 169
3.7.4 二極體、鉭質電容 ...................................................................... 170
3.7.5 三極管(TO) ................................................................................. 171
3.7.6 積體電路(IC) ............................................................................... 172
3.7.7 四方平面無引腳封裝(QFN) ......................................................... 173
3.7.8 球閘陣列封裝(BGA) .................................................................... 174
3.7.9 鋁質電容(CAE) ........................................................................... 175
4 開始檢測 ________________________________________________ 176
4.1 生產模式視窗 ..............................................................................................176
4.2 檢測結果視窗 ..............................................................................................177
5 使用介面項目說明 _________________________________________ 179
5.1 TRI 按鈕與快捷工具欄 ................................................................................179
5.2 狀態視窗與專案製作流程頁籤 .....................................................................182
5.3 頁籤面板 .....................................................................................................182
5.3.1 開始 ........................................................................................... 182
5.3.2 系統 ........................................................................................... 198
5.3.3 周邊設備 .................................................................................... 210
5.3.4 工具 ........................................................................................... 212
5.3.5 掃圖 ........................................................................................... 225
5.3.6 設定 ........................................................................................... 225
5.3.7 對位 ........................................................................................... 226
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5.3.8 新增 ........................................................................................... 231
5.3.9 編輯(全圖模式) ........................................................................... 251
5.3.10 編輯(原圖模式) ........................................................................... 255
5.3.11 編輯資料庫 ................................................................................ 263
5.3.12 結果(僅顯示在生產模式) ............................................................. 269
5.4 框屬性 ........................................................................................................270
5.5 模組化資料庫 ..............................................................................................272
5.6 影像圖區 .....................................................................................................273
5.7 檢測條件設定面板 .......................................................................................276
5.8 檢測框參數設定面板 ...................................................................................278
6 功能設定 ________________________________________________ 279
6.1 控制系統功能 ..............................................................................................279
6.1.1 可程式控制器(PLC) ..................................................................... 279
6.1.2 軌道寬度設定 ............................................................................. 289
6.2 條碼裝置功能 ..............................................................................................292
6.2.1 條碼裝置設定 ............................................................................. 292
6.2.2 條碼設定應用 ............................................................................. 299
6.3 GRR/Cpk 功能 ............................................................................................305
6.4 KAPPA 功能 ...............................................................................................308
6.5 距離量測 .....................................................................................................312
6.5.1 使用須知 .................................................................................... 314
6.5.2 操作介面說明 ............................................................................. 317
6.5.3 參數說明 .................................................................................... 324
6.6 診斷功能 .....................................................................................................326
6.6.1 介面說明 .................................................................................... 326
6.6.2 規格報告(Spec Report) ............................................................... 328
6.6.3 運動控制(Motion) ........................................................................ 329
6.6.4 運動&光學複合(Integration) ........................................................ 330
6.6.5 燈光(Lighting) ............................................................................. 331
6.6.6 相機(Camera) ............................................................................. 332
6.6.7 精度補償狀態(Precision Compensation) ..................................... 333
7 選配功能(3D AOI 標配功能) ________________________________ 334
7.1 3D檢測功能 ...............................................................................................334
8 特殊功能 ________________________________________________ 340
8.1 2D異物檢測功能 ........................................................................................340
8.2 Laser3D 框自動學習功能 ............................................................................343