(TI)对半导体器件的长期存储评估.pdf - 第4页

T able 5-1. Product Samples (continued) Sample Batch # Product Name Shelf Storage Age (Y ears) (2) T erminal Finish Package T ype Pin Count Soldering Results. Units T ested/Fail Moisture Sensitivity Level 42 LOG21 12AIDW…

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In addition to the studies performed on the long term storage products, package qualifications include humidity
testing tests to evaluate the effect of moisture on die metallization (galvanic corrosion). Devices routinely pass
high temperature and high humidity testing. All products are stored in a properly controlled environment prior
to being shipped. Moisture sensitive products are packaged with appropriate MBB and desiccant based on
TI internal specification for moisture sensitivity which aligns with JEDEC J-STD-033C. Packaging material and
cover tape was evaluated using Tribocharge testing and showed no issues. Any failure of the MBB would be
detected immediately by the HIC discolorations upon opening the package.
5 Products Samples Included in the Evaluation
Table 5-1 lists the evaluated device samples.
Table 5-1. Product Samples
Sample
Batch #
Product Name Shelf Storage Age
(Years)
(2)
Terminal
Finish
Package
Type
Pin Count Soldering Results.
Units Tested/Fail
Moisture Sensitivity
Level
1 CC2530F64RHAR 11 NiPdAuAg VQFN 40 5 / 0 MSL3
2 CC2531F256RHAR 10 NiPdAuAg VQFN 40 7 / 0 MSL3
3 TPS51621RHAR 10 NiPdAu VQFN 40 7 / 0 MSL3
4 TPS65182RGZR 10 NiPdAu VQFN 48 8 / 0 MSL3
5 BQ25015RHLR 11 NiPdAu VQFN 20 9 / 0 MSL3
6 TRF3761-GIRHAR 13 NiPdAuAg VQFN 40 9 / 0 MSL3
7 TPS65810RTQR 11 NiPdAu VQFN 56 9 / 0 MSL3
8 LP3906SQ-VPFP/NOPB 10 Matte Sn WQFN 24 9 / 0 MSL1
9 TS3L500RHUR 15 NiPdAuAg WQFN 56 8 / 0 MSL1
10 DS92LV0411SQE/NOPB 10 Matte Sn WQFN 36 8 / 0 MSL3
11 TS3L500RHUR 10 NiPdAuAg WQFN 56 8 / 0 MSL1
12 TLV70029DSER 10 NiPdAuAg WSON 6 8 / 0 MSL 1
13 TPS73418DRVR 12 NiPdAu WSON 6 10 / 0 MSL 1
14 TPS62750DSKR 11 NiPdAu WSON 10 10 / 0 MSL 1
15 TPS71926-15DRVR 13 NiPdAu WSON 6 8 / 0 MSL 1
16 TPS79425DCQR 15 NiPdAu SOT-223 6 9 / 0 MSL2
17 TPS73233DCQR 11 NiPd Au SOT-223 6 9 / 0 MSL2
18 TPS73233DCQR 16 Sn SOT-223 6 9 / 0 MSL2
19 OPA343NA/3K 20 Sn SOT-23 5 9 / 0 MSL 1
20 TLV431AIDBVR 20 Sn SOT-SC70 5 9 / 0 MSL 1
21 SN74AHC1G00DBVR 17 NiPdAu SOT-23 5 9 / 0 MSL 1
22 LMV331IDCKR 15 NiPdAuAg SOT-SC70 3 9 / 0 MSL 1
23 TL431CDBVR 15 NiPdAu SOT-23 5 9 / 0 MSL 1
24 REF3112AIDBZT 14 NiPdAuAg SOT-23 3 10 / 0 MSL 1
25 TL431QDBVT 10 NiPdAu SOT-23 5 10 / 0 MSL 1
26 TLV809J25DBZT 10 NiPdAu SOT-23 3 10 / 0 MSL 1
27 SN74LVC1G06DBVR 10 NiPdAu SOT-23 5 10 / 0 MSL 1
28 SN74AHCT1G86DBVR 10 NiPdAu SOT-23 5 10 / 0 MSL 1
29 ADS7868IDBVR 10 NiPdAu SOT-23 6 10 / 0 MSL2
30 OPA2337EA/3K 11 Sn SOT-23 8 10 / 0 MSL2
31 SN74LVC1G08DCKR 10 NiPdAu SOT-SC70 5 10 / 0 MSL 1
32 SN74AHCT1G04DCKR 15 NiPdAu SOT-SC70 5 10 / 0 MSL 1
33 SN74AHC1G02DCKR 15 NiPdAu SOT-SC70 5 10 / 0 MSL 1
34 LMV321IDCKT 10 NiPdAuAg SOT-SC70 5 10 / 0 MSL 1
35 TXS0206YFPR 10 N/A DSBGA 20 10 / 0 MSL 1
36 TLV320AIC3107IYZFR 10 N/A DSBGA 42 10 / 0 MSL 1
37 WL1251B2LYFBR 11 N/A DSBGA 104 10 / 0 MSL 1
38 PCM1870YZFR 12 n/a DSBGA 24 10 / 0 MSL 1
39 LMV641MAX/NOPB 11 Sn SOIC 8 9 / 0 MSL 1
40 SN74HC595DR 11 NiPdAu SOIC 16 10 / 0 MSL 1
41 USBN9604-28MX 10 Sn SOIC 28 10 / 0 MSL3
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Table 5-1. Product Samples (continued)
Sample
Batch #
Product Name Shelf Storage Age
(Years)
(2)
Terminal
Finish
Package
Type
Pin Count Soldering Results.
Units Tested/Fail
Moisture Sensitivity
Level
42 LOG2112AIDWR 11 NiPdAu SOIC 16 9 / 0 MSL3
43 TL1451ACDR 16 NiPdAu SOIC 16 9 / 0 MSL 1
44 SN94754IDR 15 NiPdAu SOIC 8 10 / 0 MSL3
45 LOG101AIDR 19 NiPdAu SOIC 8 10 / 0 MSL3
46 SN74AHC00D 21 NiPdAu SOIC 14 9 / 0 MSL 1
47 SN74HC02DR 21 NiPdAu SOIC 14 9 / 0 MSL 1
S1
(1)
BQ24202DGNR 18 Sn HVSSOP 8 6 / 0 MSL1
S2
(1)
MSC1210Y3PAGT 18 Sn TQFP 64 6 / 0 MSL3
S3
(1)
OPA2822U/2K5 18 NiPdAu SOIC 8 6 / 0 MSL3
S4
(1)
REG101NA-2.85/250 18 NiPdAu SOT-23 5 6 / 0 MSL3
S5
(1)
SN75LVDS179D 18 NiPdAu SOIC 8 5 / 0 MSL1
S6
(1)
TLV2463CDGSR 18 Sn VSSOP 10 6 / 0 MSL1
S7
(1)
TPS75933KTTT 18 Sn VSSOP 5 6 / 0 MSL2
S8
(1)
TSB12LV31PZ 19 Sn LQFP 100 6 / 0 MSL3
S9
(1)
SH6950DAAOPFP 17 NiPdAu HTQFP 80 6 / 0 MSL3
(1) The products S1 through S9 were the original 2008 risk assessment and were continuously stored in the Singapore Product
Distribution Center (PDC) and retested for this paper.
(2) Age determined as of March 2021.
6 Packaging Materials Evaluation
The sample products used in this study were retrieved from storage warehouses and shipped to the evaluating
TI reliability lab. Original packing materials from the actual production time were preserved and evaluated. Upon
receiving the material in the evaluating lab, the outer cardboard box, also referred to as shipping box, was
inspected and documented. Device information labels continued to properly adhere to the box after 20 years of
warehouse storage and were readable.
Figure 6-1. Sample #47 Image of Shipping Box as
Received
Figure 6-2. Sample #10 Image of Shipping Box as
Received
Figure 6-3. Sample #47 Label on Box
Figure 6-4. Sample #10 Label on Box
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Figure 6-5. Sample #47 Opened Box, MSL 1
Figure 6-6. Sample #42 Opened Box, MSL 3 Packing
Figure 6-7. Sample #10 Opened MBB, HIC,
Desiccant and Reel
Figure 6-8. Sample #10 HIC Detail View
The Humidity Identification Card (HIC) had been checked immediately after opening the MBB. No HIC samples
showed a change in the color dots indicating a change of the moisture content inside the MBB.
The functionality of the HIC samples had been checked by storing the cards at room conditions for 15 minutes
and in a 30°C/60% humidity oven for 15 minutes. The color dots from the tested HIC turned pink as expected for
the environment conditions they had been exposed to during the test. This proves that the HIC cards were still
functional after the long storage time in the MBB.
Figure 6-9. HIC Card Out of Sealed
MBB
Figure 6-10. HIC After 15 Minutes
at 30°C / 60% Rh
Figure 6-11. HIC After 15 Minutes
at Room Air Condition of 23°C/
≈30% Rh
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