Specification SIPLACE CS-Speed - 第17页

15 Description The SIPLACE CS has a number of vision module s and a cent ral vision system to evaluate the recorded image data ensur ing high place- ment accur acy. At the machine´s X-ga ntry the PCB vision module i s mo…

Description

The component changeover tables

can be set up and checked at an

external SIPLACE set-up station

quickly and without machine idle

time. The costs for production in-

volving a wide variety of compo-

nents are greatly reduced. During

the bar code check outside the

machine, 10 minutes of machine

standstill are eliminated per set-up

change. All current data from up to

4 lines are accessible over a link to

the line computer via a Local Area

Network (LAN).

In the case of the SIPLACE CS a

component changeover table is

part of the standard equipment.

Additional changeover tables are

required for optimal use

of the set-up station.

Component Supply:

SIPLACE External Set-Up Station (Option)

Technical Data

Operating system Windows XP

Set-up check Per bar code scanner

Component table change Time expanded: 2 min / table side

Example for SIPLACE Set-Up Station

Line

LAN

SIPLACE C Pro

PC for External set-up

LAN Scanner

Serial Interface

Tape Reel

with

Bar Code

Mobile

Changeover

Table

Mobile

Changeover

Tables

Description

The SIPLACE CS has a number of

vision modules and a central vision

system to evaluate the recorded

image data ensuring high place-

ment accuracy.

At the machine´s X-gantry the PCB

vision module is mounted. It is

used to find the PCBs´ positioning-

offsets within the conveyor sys-

tem.

This vision module is also required

to measure the machine origin

and/or the feeder positions on one

side of the table. It consists of a

single CCD camera with integrated

lighting and optics.

The offsets in the position of the

PCBs are determined with the

help of at least two but generally

three reference fiducial marks on

the PCB. When the PCB arrives at

the placement area the positioning

system with its PCB vision module

moves to the programmed mark

position.

Using the Geometrical Alignment

allows to choose predefined marks

from a menu (e.g. cross, circle,

square). The size of the mark is

programmed at the Station Com-

puter. From this time on form and

size of the mark is defined and

known.

With this data the PCB vision

module is able to search and rec-

ognize the mark at the predefined

position on the PCB or ceramic

substrate without further assis-

tance. For this reason it places

several small evaluation windows

at the assumed border of the

mark. Within these evaluation

windows the vision system looks

for contrast transitions between

bright and dark. After finding such

contrasts the actual position of the

mark can be assigned by compari-

sion with the predefined – and

thus known – form and size.

Evaluation operations calculate

possible PCB offsets against given

values of X-, Y- and Theta-axis.

Saving the mark by teaching is not

necessary any more.

Additional functions of the PCB

vision module are recognition of

the position of the feeders and

ceramic substrate (optional) and

recording of the machine data in-

cluding mapping.

In addition, the bad board recogni-

tion unit handles “ink spots” with

the aid of the PCB vision module.

Vision Sensor Technology:

PCB Vision Module

Technical Data

Reference marks

Local marks

Library memory

Recognition of bad boards

up to 3 (subpanels and multiple panels)

up to 2 per component

(may be of different type)

up to 255 types of reference marks

per subpanel

Image analysis Correlation principle (geometric

alignment) based on gray-scale values

Lighting method Front lighting

Recognition time fiducial/

bad board marks

0.4 s

Camera’s field of view 5.7 x 5.7 mm

a) Software 502.xx required.

Geometrical Alignment

Camera’s field of view

Pixel

Ink spot, e.g. square

Evaluation window

Description

Different reference mark shapes

prove to be optimal depending on

the condition of the surface.

Particularly advisable for bare cop-

per surfaces with little oxidation is

the single cross. Maximum recog-

nition reliability is achieved due to

the high information content. Rec-

tangle, square and circle are less

“informative” but save space, are

rugged, and can even be used

when oxidation is at an advanced

stage.

Advisable for tinned structures are

circle or square because in this

case the ratio of the mark dimen-

sions to the presolder thickness is

particularly favorable.

Vision Sensor Technology:

PCB Position Recognition

Reference Mark Criteria

Locate 2 marks

Locate 3 marks in addition

X-/Y-position, rotation angle, mean distortion

Shear, distortion in X- and Y-direction

Mark shapes Synthetic marks e.g., circle, cross, square,

rectangle, rhombus, circular ring, square

ring, octagonal ring (choose from menu)

Mark surface:

Copper

Tin

Without oxidation and solder resist

Warp

≤ 1/10 of structure width,

both with good contrast to environment

Mark dimensions

Circle

Cross

Rectangle/square

Rhombus

Diameter: 0.3 - 3 mm

Length and width: 0.3 - 3 mm

Line thickness: 0.1 - 1.5 mm

Edge length: 0.3 - 3 mm

Transversal length: 0.3 - 3 mm

Mark environment Clearance around reference mark not

necessary if there is no similar mark

structure in the search area

Teach Synthetic Fiducial

Fiducial Editor