Specification SIPLACE CS-Speed - 第19页

17 Description In the cluster technology each subpanel is assigned an ink spot. If this is pres ent during the meas- urement via the PCB vision mod- ule, the corresponding subpanel is populated. It is also possible to ac…

Description

Different reference mark shapes

prove to be optimal depending on

the condition of the surface.

Particularly advisable for bare cop-

per surfaces with little oxidation is

the single cross. Maximum recog-

nition reliability is achieved due to

the high information content. Rec-

tangle, square and circle are less

“informative” but save space, are

rugged, and can even be used

when oxidation is at an advanced

stage.

Advisable for tinned structures are

circle or square because in this

case the ratio of the mark dimen-

sions to the presolder thickness is

particularly favorable.

Vision Sensor Technology:

PCB Position Recognition

Reference Mark Criteria

Locate 2 marks

Locate 3 marks in addition

X-/Y-position, rotation angle, mean distortion

Shear, distortion in X- and Y-direction

Mark shapes Synthetic marks e.g., circle, cross, square,

rectangle, rhombus, circular ring, square

ring, octagonal ring (choose from menu)

Mark surface:

Copper

Tin

Without oxidation and solder resist

Warp

≤ 1/10 of structure width,

both with good contrast to environment

Mark dimensions

Circle

Cross

Rectangle/square

Rhombus

Diameter: 0.3 - 3 mm

Length and width: 0.3 - 3 mm

Line thickness: 0.1 - 1.5 mm

Edge length: 0.3 - 3 mm

Transversal length: 0.3 - 3 mm

Mark environment Clearance around reference mark not

necessary if there is no similar mark

structure in the search area

Teach Synthetic Fiducial

Fiducial Editor

Description

In the cluster technology each

subpanel is assigned an ink spot.

If this is present during the meas-

urement via the PCB vision mod-

ule, the corresponding subpanel is

populated. It is also possible to ac-

complish the population of the

subpanel when the ink spot is

missing. With this function it is

possible to eliminate costs due to

unnecessary population of faulty

subpanels.

Global Ink Spot

Global Ink SpotGlobal Ink Spot

Global Ink Spot

Each bad board evaluation needs

time, so naturally the consumed

time increases with the number of

subpanels per PCB. Using a global

ink spot can result in a significant

reduction of these secondary

times.

The PCB vision module searches

at positions taught before for the

defined fiducial. In case of recogni-

tion there is no following evalua-

tion of subpanels. The system al-

lows the customer to choose also

the opposite interpretation.

Position Recognition of Feeder

Position Recognition of FeederPosition Recognition of Feeder

Position Recognition of Feeder

The pick-up position of the com-

ponents can be determined pre-

cisely with the aid of the position

recognition of the feeder. It is acti-

vated each time after a change of

feeder or component table. The

offset in position relative to the

stored ideal position is determined

on the basis of fiducials on the

feeder modules using the PCB vi-

sion module. This provides a very

high pick-up reliability even for the

very first component. This is par-

ticularly important with small com-

ponents.

Vision Sensor Technology:

Bad Board Recognition

Position Recognition of Feeder

Ink Spot Criteria

Evaluation method

for fiducials

for structures

brightness method

contrast method

Shapes and sizes of

fiducials/structures for

brightness method

contrast method

square or circular forms

edge length/diameter 0.3 - 5 mm

rectangular forms

edge length 0.3 - 5 mm

Masking material mat dark (light-absorbing)

not recommended: white or shiny

Ink spot recognition time 0.3 s for each method

Description

The standard component vision

module is directly integrated into

the Collect & Place Head. While

the component is cycling into the

next station of the Collect & Place

Head, the recorded image is eva-

luated by the central vision sys-

tem. The component rotation is

then corrected by the appropriate

angle based on the position off-

sets determined with vision in-

spection.

Vision Sensor Technology:

Standard Component Vision Modules for the 6-Nozzle

Collect & Place Head

Standard Component Vision Module for the 6-Nozzle C & P Head

Component size

minimum

maximum

0.6 x 0.3 mm

(0201)

18.7 x 18.7 mm

Component range See table on page 6

Camera’s field of view 24 x 24 mm

Illumination Front light

(3 freely programmable planes)

Pixel size 50 µm