IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第204页
This Page Intentionally Left Blank IPC-SM-782 Subject 1.5 mm Pitch PBGA JEDEC MO-151 Date 4/99 Section 14.1.1 Revision — P a g e6o f6 电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
RLP Component Identifier
Contact
Array
Rows x
Cols.
Max.
Contact
Count C D X E
Placement
Grid
1043 PBGA 21X21 FO169 13x13 196 18.00 18.00 0.60 1.50 44X44
1044 PBGA 23X23 FO225 15x15 225 21.00 21.00 0.60 1.50 48X48
1045 PBGA 23X23 FE196 14x14 196 19.50 19.50 0.60 1.50 48X48
1046 PBGA 25X25 FE256 16x16 256 22.50 22.50 0.60 1.50 52X52
1047 PBGA 25X25 FO225 15x15 225 21.00 21.00 0.60 1.50 52X52
1048 PBGA 27X27 FE324 18x18 324 25.50 25.50 0.60 1.50 56X56
1049 PBGA 27X27 FO289 17x17 289 24.00 24.00 0.60 1.50 56X56
1050 PBGA 29X29 FO361 19x19 361 27.00 27.00 0.60 1.50 60X60
1051 PBGA 29X29 FE324 18x18 324 25.50 25.50 0.60 1.50 60X60
1052 PBGA 31X31 FE400 20x20 400 28.50 28.50 0.60 1.50 64X64
1053 PBGA 31X31 FO361 19x19 361 27.00 27.00 0.60 1.50 64X64
1054 PBGA 33X33 FE484 22x22 484 31.50 31.50 0.60 1.50 68X68
1055 PBGA 33X33 FO441 21x21 441 30.00 30.00 0.60 1.50 68X68
1056 PBGA 35X35 FO529 23x23 529 33.00 33.00 0.60 1.50 72X72
1057 PBGA 35X35 FE484 22x22 484 31.50 31.50 0.60 1.50 72X72
1058 PBGA 37.5X37.5 FO625 25x25 625 36.00 36.00 0.60 1.50 78X78
1059 PBGA 37.5X37.5 FE576 24x24 576 34.50 34.50 0.60 1.50 78X78
1060 PBGA 40X40 FE676 26x26 676 37.50 37.50 0.60 1.50 82X82
1061 PBGA 40X40 FO625 25x25 625 36.00 36.00 0.60 1.50 82X82
1062 PBGA 42.5X42.5 FE784 28x28 784 40.50 40.50 0.60 1.50 88X88
1063 PBGA 42.5X42.5 FO729 27x27 729 39.00 39.00 0.60 1.50 88X88
1064 PBGA 45X45 FE900 30x30 900 43.50 43.50 0.60 1.50 92X92
1065 PBGA 45X45 FO841 29x29 841 42.00 42.00 0.60 1.50 92X92
1066 PBGA 47.5X47.5 FO961 31x31 961 45.00 45.00 0.60 1.50 98X98
1067 PBGA 47.5X47.5 FE900 30x30 900 43.50 43.50 0.60 1.50 98X98
1068 PBGA 50X50 FO1089 33x33 1089 48.00 48.00 0.60 1.50 102X102
1069 PBGA 50X50 FE1024 32x32 1024 46.50 46.50 0.60 1.50 102X102
Figure 2b PBGA land pattern dimensions
FE = Full Even Matrix
FO = Full Odd Matrix
For land pattern tolerance analysis,
see Section 14.0, Subsection 6.
IPC-SM-782
Subject
1.5 mm Pitch PBGA JEDEC MO-151
Date
4/99
Section
14.1.1
Revision
—
Page5of6
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
This Page Intentionally Left Blank
IPC-SM-782
Subject
1.5 mm Pitch PBGA JEDEC MO-151
Date
4/99
Section
14.1.1
Revision
—
Page6of6
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0 SCOPE
This subsection provides the component and land pattern
dimensions for square 1.27 mm pitch Plastic Ball Grid Arrays
(PBGA).
2.0 APPLICABLE DOCUMENTS
See Section 14.0 for documents applicable to the subsection.
3.0 COMPONENT DESCRIPTION
These components are all on 1.27 mm pitch. They are avail-
able in a wide variety of body sizes. The data supplied in the
detail and table reflect a full matrix. Specific contact and
depopulation and pin assignment must be furnished by the
device manufacturer (see Section 14.0 for more information
on depopulation methods).
IPC-SM-782
Surface Mount Design
and Land Pattern Standard
Date
4/99
Section
14.1.2
Revision
—
Subject
1.27 mm Pitch PBGA
JEDEC MO-151
Page1of6
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ