IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第210页
This Page Intentionally Left Blank IPC-SM-782 Subject 1.27 mm Pitch PBGA JEDEC MO-151 Date 4/99 Section 14.1.2 Revision — P a g e6o f6 电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
RLP Component Identifier
Contact
Array
Rows x
Cols.
Max.
Contact
Count C D X E
Placement
Grid
983 PBGA 21X21 FO225 15x15 225 17.78 17.78 0.60 1.27 44X44
984 PBGA 23X23 FE324 18x18 324 21.59 21.59 0.60 1.27 48X48
985 PBGA 23X23 FO289 17x17 289 20.32 20.32 0.60 1.27 48X48
986 PBGA 25X25 FO361 19x19 361 22.86 22.86 0.60 1.27 52X52
987 PBGA 25X25 FE324 18x18 324 21.59 21.59 0.60 1.27 52X52
988 PBGA 27X27 FO441 21x21 441 25.40 25.40 0.60 1.27 56X56
989 PBGA 27X27 FE400 20x20 400 24.13 24.13 0.60 1.27 56X56
990 PBGA 29X29 FE484 22x22 484 26.67 26.67 0.60 1.27 60X60
991 PBGA 29X29 FO441 21x21 441 25.40 25.40 0.60 1.27 60X60
992 PBGA 31X31 FE576 24x24 576 29.21 29.21 0.60 1.27 64X64
993 PBGA 31X31 FO529 23x23 529 27.94 27.94 0.60 1.27 64X64
994 PBGA 33X33 FO625 25x25 625 30.48 30.48 0.60 1.27 68X68
995 PBGA 33X33 FE576 24x24 576 29.21 29.21 0.60 1.27 68X68
996 PBGA 35X35 FO729 27x27 729 33.02 33.02 0.60 1.27 72X72
997 PBGA 35X35 FE676 26x26 676 31.75 31.75 0.60 1.27 72X72
998 PBGA 37.5X37.5 FO841 29x29 841 35.56 35.56 0.60 1.27 78X78
999 PBGA 37.5X37.5 FE784 28x28 784 34.29 34.29 0.60 1.27 78X78
1000 PBGA 40X40 FO961 31x31 961 38.10 38.10 0.60 1.27 82X82
1001 PBGA 40X40 FE900 30x30 900 36.83 36.83 0.60 1.27 82X82
1002 PBGA 42.5X42.5 FO1089 33x33 1089 40.64 40.64 0.60 1.27 88X88
1003 PBGA 42.5X42.5 FE1024 32x32 1024 39.37 39.37 0.60 1.27 88X88
1004 PBGA 45X45 FO1225 35x35 1225 43.18 43.18 0.60 1.27 92X92
1005 PBGA 45X45 FO1156 34x34 1156 41.91 41.91 0.60 1.27 92X92
1006 PBGA 47.5X47.5 FO1369 37x37 1369 45.72 45.72 0.60 1.27 98X98
1007 PBGA 47.5X47.5 FE1296 36x36 1296 44.45 44.45 0.60 1.27 98X98
1008 PBGA 50X50 FO1521 39x39 1521 48.26 48.26 0.60 1.27 102X102
1009 PBGA 50X50 FE1444 38x38 1444 46.99 46.99 0.60 1.27 102X102
Figure 2b PBGA land pattern dimensions
FE = Full Even Matrix
FO = Full Odd Matrix
For land pattern tolerance analysis,
see Section 14.0, Subsection 6.
IPC-SM-782
Subject
1.27 mm Pitch PBGA JEDEC MO-151
Date
4/99
Section
14.1.2
Revision
—
Page5of6
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
This Page Intentionally Left Blank
IPC-SM-782
Subject
1.27 mm Pitch PBGA JEDEC MO-151
Date
4/99
Section
14.1.2
Revision
—
Page6of6
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0 SCOPE
This subsection provides the component and land pattern
dimensions for square 1.0 mm pitch Plastic Ball Grid Arrays
(PBGA).
2.0 APPLICABLE DOCUMENTS
See Section 14.0 for documents applicable to the subsection.
3.0 COMPONENT DESCRIPTION
These components are all on 1.0 mm pitch. They are available
in a wide variety of body sizes. The data supplied in the detail
and table reflect a full matrix. Specific contact and depopula-
tion and pin assignment must be furnished by the device
manufacturer (see Section 14.0 for more information on
depopulation methods).
IPC-SM-782
Surface Mount Design
and Land Pattern Standard
Date
4/99
Section
14.1.3
Revision
—
Subject
1.0 mm Pitch PBGA
JEDEC MO-151
Page1of6
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ