IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第219页

5.0 LAND PATTERN DIMENSIONS Figure 2 provides the land pattern dimensions for square PBGA components. These numbers represent industry con- sensus on the best dimensions based on empirical knowledge of fabricated land pa…

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4.0 COMPONENT DIMENSIONS
Figure 1 provides the component dimensions for rectangular PBGAs.
Component ABCDWPHFG
Identifier max max max max nom. basic max nom. nom.
R-PBGA 22x14 14.00 22.00 7.62 20.32 0.75 1.27 3.50 3.19 0.84
R-PBGA 22x14 14.00 22.00 10.16 20.32 0.75 1.27 3.50 1.92 0.84
R-PBGA 25x21 21.00 25.00 12.70 22.86 0.75 1.27 3.50 4.15 1.07
FE = Full Even Matrix
FO = Full Odd Matrix
Figure 1 R-PBGA component dimensions
IPC-SM-782
Subject
1.27 mm Pitch Rectangular PBGA JEDEC MS-028
Date
4/99
Section
14.2
Revision
Page2of4
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5.0 LAND PATTERN DIMENSIONS
Figure 2 provides the land pattern dimensions for square
PBGA components. These numbers represent industry con-
sensus on the best dimensions based on empirical knowledge
of fabricated land patterns.
Note: The data supplied in the detail and table reflect a full
matrix. Specific contact and depopulation and pin assignment
must be furnished by the device manufacturer.
The dotted line in Figure 2 shows the grid placement court-
yard which is the area required to place land patterns and
their respective components in adjacent proximity without
interference or shorting. Numbers in the table represent the
number of grid elements (each element is 0.5 by 0.5 mm) in
accordance with the international grid detailed in IEC publica-
tion 97.
RLP Component Identifier
Contact
Array
Rows x
Cols.
Contact
Count C D X E
Placement
Grid
1080 R-PBGA 22x14 17x7 119 7.62 20.32 0.60 1.27 46X30
1081 R-PBGA 22x14 17x9 153 10.16 20.32 0.60 1.27 46X30
1082 R-PBGA 25x21 19x11 209 12.70 22.86 0.60 1.27 52X44
FE = Full Even Matrix
FO = Full Odd Matrix
For land pattern tolerance analysis,
see Section 14.0, Subsection 6.
Figure 2 R-PBGA land pattern dimensions
IPC-SM-782
Subject
1.27 mm Pitch Rectangular PBGA JEDEC MS-028
Date
4/99
Section
14.2
Revision
Page3of4
电子技术应用     www.ChinaAET.com
This Page Intentionally Left Blank
IPC-SM-782
Subject
1.27 mm Pitch Rectangular PBGA JEDEC MS-028
Date
4/99
Section
14.2
Revision
Page4of4
电子技术应用     www.ChinaAET.com