IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第226页
ANSI/IPC-T -50 T erms and Definitions for Interconnecting and Packaging Electronic Circuits Definition Submission/Approval Sheet The purpose of this form is to keep current with terms routinely used in the industry and the…
Standard Improvement Form
IPC-SM-782A
The purpose of this form is to provide the
Technical Committee of IPC with input
from the industry regarding usage of
the subject standard.
Individuals or companies are invited to
submit comments to IPC. All comments
will be collected and dispersed to the
appropriate committee(s).
If you can provide input, please complete
this form and return to:
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Fax 847 509.9798
1. I recommend changes to the following:
Requirement, paragraph number
Test Method number , paragraph number
The referenced paragraph number has proven to be:
Unclear Too Rigid In Error
Other
2. Recommendations for correction:
3. Other suggestions for document improvement:
Submitted by:
Name Telephone
Company E-mail
Address
City/State/Zip Date
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
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ANSI/IPC-T-50 Terms and Definitions for
Interconnecting and Packaging Electronic Circuits
Definition Submission/Approval Sheet
The purpose of this form is to keep
current with terms routinely used in
the industry and their definitions.
Individuals or companies are
invited to comment. Please
complete this form and return to:
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Fax: 847 509.9798
SUBMITTOR INFORMATION:
Name:
Company:
City:
State/Zip:
Telephone:
Date:
❑ This is a NEW term and definition being submitted.
❑ This is an ADDITION to an existing term and definition(s).
❑ This is a CHANGE to an existing definition.
Term Definition
If space not adequate, use reverse side or attach additional sheet(s).
Artwork: ❑ Not Applicable ❑ Required ❑ To be supplied
❑ Included: Electronic File Name:
Document(s) to which this term applies:
Committees affected by this term:
Office Use
IPC Office Committee 2-30
Date Received:
Comments Collated:
Returned for Action:
Revision Inclusion:
Date of Initial Review:
Comment Resolution:
Committee Action: ❑ Accepted ❑ Rejected
❑ Accept Modify
IEC Classification
Classification Code • Serial Number
Terms and Definition Committee Final Approval Authorization:
Committee 2-30 has approved the above term for release in the next revision.
Name:
Committee: Date:
IPC 2-30
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
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Revision History for IPC-SM-782 Standard
The following is a listing of major alterations and additions
to the IPC-SM-782 Standard since its initial publication in
March 1987. The standard went through a comprehensive
revision in August 1993, followed by an amendment in
October 1996.
Changes addressed within Revision A:
• Complete revision of document to establish independent
sections (8.0 - 13.0) representing requirements for fami-
lies of surface-mountable components. Each section,
in turn, was broken down into four subsections high-
lighting component description, component dimensions,
land pattern dimensions, and finally, tolerance analysis.
• Listing of all registered land pattern numbers for com-
ponent types in both existing and future sections.
• Inclusion of a dedicated section (3.3) establishing
dimensional criteria for components, land patterns, and
positional accuracy of component placement capabilities.
Also contains examples of typical package styles and
their respective double letter designators.
• Inclusion of a dedicated section (3.5) highlighting envi-
ronmental constraints. Addresses worst-case use envi-
ronments for surface mount electronic assemblies in
nine major use categories. Includes discussion of both
design service life and acceptable cumulative failure
probability for each of these categories.
Changes addressed within Amendment 1:
• Alteration of formulas within Section 3.3.1 on Compo-
nent Tolerancing.
• Corrections to technical and typographical errors
throughout Section 3.6 on Component Spacing.
• Corrections to technical and typographical errors
throughout Section 3.7 on Outer Layer Finishes.
• Replacement of 15 figures throughout the first seven
sections, as well as a subsequent replacement of 39
tables in Sections 8 through 13 that address corrections
to component and land pattern dimensions for various
component families.
Changes addressed within Amendment 2:
• Inclusion of Section 14.0 addressing land patterns for
components with ball grid array contacts.
December 1999 IPC-SM-782A
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