00195941-03-UM SiplaceCA-EN - 第156页
3 Technical Data User Manual SIPLACE CA 3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN 156 3.7.4.3 Die Att ach T ransfer Position 3 Fig. 3.7 - 8 Die Attach T ransfer Position (1) The die attach rotates to the transfer…
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS)
155
3.7.4.2 Flip Chip Segment 1 (z-direction)
3
Fig. 3.7 - 7 Flip Chip Segment 1 (z-direction)
(1) The x-axis of the flip chip swivel segment 1 is moved to the transfer position.
3 Technical Data User Manual SIPLACE CA
3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN
156
3.7.4.3 Die Attach Transfer Position
3
Fig. 3.7 - 8 Die Attach Transfer Position
(1) The die attach rotates to the transfer position.
(2) The SIPLACE head picks the chip up from the die attach segment and rotates to the next star
position.
(3) At the same time the X axis retracts the segment nr. 1 back into the home position.
(4) The flip chip unit - segment nr. 1 rotates to the transfer position and picks up the next chip.
NOTE 3
While using the die attach unit only the segment nr.1 of the flip chip unit is ative.
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS)
157
3.7.4.4 Flip Chip Coded Positions (after Calibration)
3
3
Fig. 3.7 - 9 Flip Chip Coded Positions (after calibration)
0°
Home sensor position
180°
Transfer position, segment 1
125°
Camera "free" position
96°
Discharge position, segment 1
90°
Home offset position
83°
Discharge position, segment 2
58°
Camera "free" position