00195941-03-UM SiplaceCA-EN - 第166页
3 Technical Data User Manual SIPLACE CA 3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN 166 The flip unit can use sta ndard SIPLACE nozzles (9xx) an d together with special adapters die bonding tools as well. As in the…
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS)
165
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Fig. 3.7 - 17 Flip head - front view
(1) Nozzle take up, segment 1
(2) Nozzle take up, segment 2
(3) Motor for linear movement
(4) Motor for 180° rotation
The flip unit takes the ejected die from the wafer foil. In flip chip mode, it rotates the die by 180°
into the pickup position for the placement head. In die attach mode the flip unit rotates the die by
approx. 130° into the handover position to the die attach unit.
The flip unit is equipped with two nozzles that are arranged in opposite positions by 180°. This
enables the system in flip chip mode to pick up a new die from the wafer at the same time as the
placement head performs pickup.
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3 Technical Data User Manual SIPLACE CA
3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN
166
The flip unit can use standard SIPLACE nozzles (9xx) and together with special adapters die
bonding tools as well. As in the case of other SIPLACE placement machines, the dies are attached
to the nozzles by a vacuum.
The flip unit is equipped with a rotational axis and a Z-axis driven by a linear motor. In the optional
die attach mode, a further linear motor transfers the dies to the die attach head. The rotary axis is
responsible for the rotation into the 180° position (flip chip mode) or 130° position (die attach
mode). The Z-axis moves the segment during the pick process. The optional linear motor in the
die attach mode moves the segment for transfer of the die to the die attach head.
3.7.6.3 Wafer Camera System
The wafer camera is directed on the wafer surface. The camera picture is used for the vision sys-
tem to recognize the defined pattern for the to be placed die (also reference die), the inkdot rec-
ognition (for ooperation without wafer map), the calculation of the die position and for the wafer
edge recognition. After positioning the wafer on the next to be ejected die, the visionmodel is
tested and the position of the die established. If the pitch from the set value is to big (tolerance
can be defined) the wafer table is repositioned, to optimize the ejection position.
The wafer edge position recognition is necessary to adjust the variations of the wafer position rel-
ativly to the wafer frame between wafers of the same type.
Specification standard camera system
The standard camera system is used for dies of size 1 to 12 mm.
The camera's field of vision is around 10.5 x 6.7 mm.
Specification high resolution camera system
The high resolution camera system is part of the small die kit and is used for dies which are under
1 mm in size.
The camera's field of vision is around 16.0 x 12.8 mm.
3.7.6.4 Wafer Table
The wafer table consists of a XY-unit (motion system with 2 linear axis) and the wafer pick up.
The wafer table moves the wafer support with the wafer to the required positions in the processing
area.
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS)
167
Wafer table
Fig. 3.7 - 18 Wafer table
(1) Clamping unit
(2) Wafer camera
(3) Flip unit
(4) Wafer support
(5) Guide
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