00195941-03-UM SiplaceCA-EN - 第170页
3 Technical Data User Manual SIPLACE CA 3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN 170 3.7.6.5 Die Ejector According to the location (2 a nd 4 or 1 and 3) ther e are two dif ferent variants that only d iffer in th…
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS)
169
Fig. 3.7 - 20 Wafer support with a wafer inserted (example for 12")
(1) Recess for the defined positioning at the pins of the locking bar
(2) Wafer locking bar
(3) Wafer
(4) Rail
NOTE 3
In case of 8"wafer supports care must be taken to ensure, that the wafer locking bar (2) is
installed so that the pins of the locking bar fit correctly into the recess of the wafer frame. Other-
wise the frame is not properly recognised during clamping.
3
1
4
2
1
3 Technical Data User Manual SIPLACE CA
3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN
170
3.7.6.5 Die Ejector
According to the location (2 and 4 or 1 and 3) there are two different variants that only differ in their
mirror-inverted arrangement of the modules.
3
Fig. 3.7 - 21 Main modules of the die ejector
(1) Ejector tool
(2) Z axis
1
2
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS)
171
Fig. 3.7 - 22 Die ejector base unit
(1) Z axis
(2) Z-axis movement (pneumatic)
1
2