00195941-03-UM SiplaceCA-EN - 第477页
User Manual SIPLACE CA 7 Station Enlargements Edition 08/2011 EN 7.11 Compo nent Sensor for the C&P12 Head 477 NOTE 7 If you are placing 0201 component s with the 906 nozzle, it is essential to use the component sen-…
7 Station Enlargements User Manual SIPLACE CA
7.11 Component Sensor for the C&P12 Head Edition 08/2011 EN
476
7.11.1 Description of the Functions of the Component Sensor
The component sensor is fixed to the underside of the 12 segment Collect&Place CA head hous-
ing (see fig. 7.11 - 1
). It scans the outline of a component and checks whether there is a compo-
nent at the nozzle. It also determines the height of the component. This data can be used to
determine whether the component is in the normal position or on edge at the nozzle. Component
heights from 0.1 to 4 mm can be checked. For larger components, only the presence of the com-
ponent at the nozzle is checked.
The component sensor is configured in the package form editor on the SIPLACE Pro computer.
Every nozzle, including the special nozzles, can be scanned by the component sensor.
7.11.2 Measurement Conditions
The two following conditions must be fulfilled in order to obtain a valid measurement:
– The light beam must touch the empty nozzle tip during the calibration process.
– The nozzle tip must be inside the light beam when it is holding a component.
– Minimum nozzle length 13 mm
– Nozzle length + component height + tolerance < 17 mm
If these conditions are fulfilled, it is possible to determine whether a component is present or ab-
sent, or to measure the component height. The minimum difference in height is 100 µm.
7
Fig. 7.11 - 2 Component sensor, working principle
Incremental disk
Component
Nozzle
IR LED PhototransistorCross-section through
component sensor
User Manual SIPLACE CA 7 Station Enlargements
Edition 08/2011 EN 7.11 Component Sensor for the C&P12 Head
477
NOTE 7
If you are placing 0201 components with the 906 nozzle, it is essential to use the component sen-
sor since no vacuum measurements are possible. 7
Using the component sensor can improve the dpm rate even when placing other small compo-
nents, such as 0402 or 0603 components. When you select a component sensor from the pack-
age form list, remember that the component can only be placed on machines that are equipped
with that component sensor.
If you wish to test components with the component sensor, then it must be configured on the line.
The following alternatives are then available:
New set-up The setup optimization automatically assigns the components to the
component sensor, if the sensor is installed.
Old set-up A new GF number is assigned to components to be checked with the
component sensor.
Central data management If not every machine on the line is equipped with the component sen-
sor, then a new package form number is assigned for every compo-
nent to be checked with the component sensor.
NOTE 7
– Only service technicians of the ASM Assembly Systems GmbH & Co.KG may retrofit the PCB
sensor.
– Use the SITEST program to recalibrate the 12 segment C&P head after installing the compo-
nent sensor.
7 Station Enlargements User Manual SIPLACE CA
7.12 High-Resolution CO Camera for the 12 Segment C&P Head, Type 29 Edition 08/2011 EN
478
7.12 High-Resolution CO Camera for the 12 Segment C&P Head, Type 29
[00119779] High resolution camera, C&P12, digital
7.12.1 Structure
7
Fig. 7.12 - 1 C&P component camera, type 29, 27 x 27, digital
(1) Component camera lens and illumination
(2) Camera amplifier
(3) Illumination control
7.12.2 Technical Data
7
Component dimensions 0,3 mm x 0,3 mm to 18,7 mm x 18,7 mm
Range of components 0201
a
18,7 mm 18,7 mm to flip chip, bare die, PLCC44, BGA, µBGA,
TSOP, QFP, SO to SO32, DRAM
Min. lead pitch 0.3 mm
Min. lead width 0.15 mm
Min. ball pitch 0.25 mm
Min. ball diameter 0.14 mm
Field of vision 32 mm x 32 mm
Illumination method Front-illumination (5 levels, programable as required)
a) With 0201 package