ASM锡膏检查机_ProcessLens_EN性能参数 - 第10页
ASM ProcessLens Technical data 10 Technical data Solder paste inspection capabilities Measurement Shadow-free Paste measurement functions Volume, area, height, X-and Y-offset, shape, bridging, coplanarity Maximum paste h…
ASM ProcessLens
Technical data
9
Conveyor specifications
Single conveyor Flexible dual conveyor Dual conveyor in "single
conveyor" mode
Minimum PCB size L x W 50 mm x 50 mm 50 mm x 45 mm 50 mm x 45 mm
Maximum PCB size L x W 610 mm x 560 mm 375 mm x 260 mm 375 mm x 460 mm
PCB thickness range 0.5 mm to 4.5 mm
PCB warpage
See "PCB warpage" [}12]
Maximum PCB weight Max. 3.0 kg Max. 3.0 kg
Underside PCB clearance:
Along the stopper bar
Outside the stopper bar
25 mm
25 mm
PCB conveyor height:
Option
Standard
Option SMEMA
900 mm
930 mm
950 mm
Type of interface SMEMA or IPC-HERMES-9852
Conveyor communication inter-
face
Left to right
Right to left
Outer / outer
Right / right
Left / left
Inspection capabilities
Pixel size (camera resolution) 15 μm x 15 μm
PCB Warpage compensation range ±6.5 mm (incl. Z-axis travel range)
FoV size 30 mm x 30 mm
Inspection speed Up to 30 cm
2
/s
Height resolution 0.37 μm
Height accuracy on calibration target ≤ 1 μm
X/Y gantry accuracy ±12.5 µm at 3 σ
ASM ProcessLens
Technical data
10
Technical data
Solder paste inspection capabilities
Measurement Shadow-free
Paste measurement functions Volume, area, height, X-and Y-offset, shape,
bridging, coplanarity
Maximum paste height 1000 μm
Minimum paste size 90 μm x 130 μm
Minimum paste pitch 75 μm
Height repeatability on solder paste ≤ 1 μm at ± 3 σ
Volume repeatability on solder paste ≤ 3 % at ± 3 σ
Area repeatability on solder paste ≤ 3 % at ± 3 σ
Gage Repeatability and Reproducibility (GRR) ≤ 10 %
Program generation specifications
Program generation < 10 min.
Offline programming available
Supported Gerber formats RS-274X
The Hermes Standard
IPC-Hermes-9852
A protocol for advanced development of Industry 4.0 in electronics produc-
tion
The Hermes Standard, also published as IPC-HERMES-9852, is a non-proprietary
open protocol, based on TCP / IP and XML. This boosts the exchange of PCB-rel-
evant data between the various machines in the electronics production lines. The
Hermes Standard was initiated, developed and established and is still managed by
a group of leading equipment manufacturers, who share their know-how to
achieve a significant step towards advanced process integration. It has been re-
cognized by IPC as the next generation solution for IPC-SMEMA-9851, normally
known as "SMEMA standard".
The founding and defining body The Hermes Standard Initiative is available to all
equipment providers wanting to actively participate in using the benefits of Industry
4.0 for their customers.
ASM ProcessLens
PCB warpage
11
PCB warpage
PCB warpage on the conveyor
PCB warpage across the direction of travel max. 1% of the PCB diagonal, but not exceeding ±5mm.
1. Fixed clamped edge
2. Printed circuit board
3. Movable clamping device
4. Conveyor rail
5. +/- 4.5 mm
PCB warpage in the direction of transport + PCB thickness < 5.5 mm. Bending up of board edge max. 2.5 mm.
1. Fixed clamped edge
2. Front board edge
3. Max. 2.5 mm
4. Conveyor belt
5. PCB transport direction
6. 5.5 mm
1. Front board edge
2. Max. 2.5 mm
3. Conveyor rail
4. PCB transport direction
5. Max. 2.5 mm
6. Max. 3 mm