ASM锡膏检查机_ProcessLens_EN性能参数 - 第11页

ASM ProcessLens PCB warpage 11 PCB warpage PCB warpage on the conveyor PCB warpage across the direction of travel max. 1% of the PCB diagonal, but not exceeding ±5mm. 1. Fixed clamped edge 2. Printed circuit board 3. M…

ASM ProcessLens

Technical data

Solder paste inspection capabilities

Measurement Shadow-free

Paste measurement functions Volume, area, height, X-and Y-offset, shape,

bridging, coplanarity

Maximum paste height 1000 μm

Minimum paste size 90 μm x 130 μm

Minimum paste pitch 75 μm

Height repeatability on solder paste ≤ 1 μm at ± 3 σ

Volume repeatability on solder paste ≤ 3 % at ± 3 σ

Area repeatability on solder paste ≤ 3 % at ± 3 σ

Gage Repeatability and Reproducibility (GRR) ≤ 10 %

Program generation specifications

Program generation < 10 min.

Offline programming available

Supported Gerber formats RS-274X

The Hermes Standard

IPC-Hermes-9852

A protocol for advanced development of Industry 4.0 in electronics produc-

tion

The Hermes Standard, also published as IPC-HERMES-9852, is a non-proprietary

open protocol, based on TCP / IP and XML. This boosts the exchange of PCB-rel-

evant data between the various machines in the electronics production lines. The

Hermes Standard was initiated, developed and established and is still managed by

a group of leading equipment manufacturers, who share their know-how to

achieve a significant step towards advanced process integration. It has been re-

cognized by IPC as the next generation solution for IPC-SMEMA-9851, normally

known as "SMEMA standard".

The founding and defining body The Hermes Standard Initiative is available to all

equipment providers wanting to actively participate in using the benefits of Industry

4.0 for their customers.

ASM ProcessLens

PCB warpage

PCB warpage on the conveyor

PCB warpage across the direction of travel max. 1% of the PCB diagonal, but not exceeding ±5mm.

1. Fixed clamped edge

2. Printed circuit board

3. Movable clamping device

4. Conveyor rail

5. +/- 4.5 mm

PCB warpage in the direction of transport + PCB thickness < 5.5 mm. Bending up of board edge max. 2.5 mm.

1. Fixed clamped edge

2. Front board edge

3. Max. 2.5 mm

4. Conveyor belt

5. PCB transport direction

6. 5.5 mm

1. Front board edge

2. Max. 2.5 mm

3. Conveyor rail

4. PCB transport direction

5. Max. 2.5 mm

6. Max. 3 mm

ASM ProcessLens

PCB warpage

Maximum PCB warpage allowed during processing of the board

There is active PCB warpage measurement and tracking during the inspection so that images remain in sharp

focus, ensuring best height measurement accuracy on the market.

1. Fixed clamped edge

2. Printed circuit board

3. ≤ 2 mm

4. Movable clamping device

5. Conveyor rail

PCB warpage down, max. 4.5 mm

1. Fixed clamped edge

2. 0.5 mm

3. Printed circuit board

4. Magnetic pin support

5. Movable clamping device

6. Conveyor rail

► Use magnetic pin supports to achieve this value.