ASM锡膏检查机_ProcessLens_EN性能参数 - 第9页
ASM ProcessLens Technical data 9 Conveyor specifications Single conveyor Flexible dual conveyor Dual conveyor in "single conveyor" mode Minimum PCB size L x W 50 mm x 50 mm 50 mm x 45 mm 50 mm x 45 mm Maximum P…
ASM ProcessLens
Technical data
8
Technical data
Center of Gravity
Fig.1: Center of gravity of the ASM ProcessLens solder paste inspection machine
1 550 mm 2 610 mm
3 730 mm
Electrical Ratings
Supply voltage Fuses
Main power supply 1/N/PE
Current rating: 110 V
1)
- 9.1 A, 240 V - 4.2 A, 50/60Hz
2 x 15 A
Power consumption 1 kW
Power supply 100 ~ 240 VAC, Single Phase 50/60 Hz
Short circuit rating of
machine (SCCR)
2)
10 kA
Power connector MENNEKES: 32 A 230 V 2 P+E STRAIGHT
Technical data
1)
110 V~ as an option
2)
With the original mains connection cable. The marked short circuit rating (SCCR) relates to the beginning of
the original mains cable. In the case of customer modifications, the factory-set length of the mains cable to
the machine may not be shortened nor the factory-set conductor cross-section increased, as this would
have a negative impact on the short circuit rating (SCCR).
ASM ProcessLens
Technical data
9
Conveyor specifications
Single conveyor Flexible dual conveyor Dual conveyor in "single
conveyor" mode
Minimum PCB size L x W 50 mm x 50 mm 50 mm x 45 mm 50 mm x 45 mm
Maximum PCB size L x W 610 mm x 560 mm 375 mm x 260 mm 375 mm x 460 mm
PCB thickness range 0.5 mm to 4.5 mm
PCB warpage
See "PCB warpage" [}12]
Maximum PCB weight Max. 3.0 kg Max. 3.0 kg
Underside PCB clearance:
Along the stopper bar
Outside the stopper bar
25 mm
25 mm
PCB conveyor height:
Option
Standard
Option SMEMA
900 mm
930 mm
950 mm
Type of interface SMEMA or IPC-HERMES-9852
Conveyor communication inter-
face
Left to right
Right to left
Outer / outer
Right / right
Left / left
Inspection capabilities
Pixel size (camera resolution) 15 μm x 15 μm
PCB Warpage compensation range ±6.5 mm (incl. Z-axis travel range)
FoV size 30 mm x 30 mm
Inspection speed Up to 30 cm
2
/s
Height resolution 0.37 μm
Height accuracy on calibration target ≤ 1 μm
X/Y gantry accuracy ±12.5 µm at 3 σ
ASM ProcessLens
Technical data
10
Technical data
Solder paste inspection capabilities
Measurement Shadow-free
Paste measurement functions Volume, area, height, X-and Y-offset, shape,
bridging, coplanarity
Maximum paste height 1000 μm
Minimum paste size 90 μm x 130 μm
Minimum paste pitch 75 μm
Height repeatability on solder paste ≤ 1 μm at ± 3 σ
Volume repeatability on solder paste ≤ 3 % at ± 3 σ
Area repeatability on solder paste ≤ 3 % at ± 3 σ
Gage Repeatability and Reproducibility (GRR) ≤ 10 %
Program generation specifications
Program generation < 10 min.
Offline programming available
Supported Gerber formats RS-274X
The Hermes Standard
IPC-Hermes-9852
A protocol for advanced development of Industry 4.0 in electronics produc-
tion
The Hermes Standard, also published as IPC-HERMES-9852, is a non-proprietary
open protocol, based on TCP / IP and XML. This boosts the exchange of PCB-rel-
evant data between the various machines in the electronics production lines. The
Hermes Standard was initiated, developed and established and is still managed by
a group of leading equipment manufacturers, who share their know-how to
achieve a significant step towards advanced process integration. It has been re-
cognized by IPC as the next generation solution for IPC-SMEMA-9851, normally
known as "SMEMA standard".
The founding and defining body The Hermes Standard Initiative is available to all
equipment providers wanting to actively participate in using the benefits of Industry
4.0 for their customers.