SIPLACE X-Series (SIPLACE X-Series S, from SC 708.1) Edition 05/2015 EN User manual - 第166页
3 Technical data and assemblies User manual SIPLACE X-Series 3.7 PCB conveyor system From software version 708.1 Version 05/2015 166 PCB warp age in the direction of tran sport + PC B th ickness < 5.5 mm. Be nding up …
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 708.1 Version 05/2015 3.7 PCB conveyor system
165
3.7.5 Definition of PCB warpage
3.7.5.1 PCB warpage on the conveyor
PCB warpage across the direction of travel max. 1 % of the PCB diagonal, but not exceeding 2 mm
3
Fixed clamped edge
Movable clamping device
Printed circuit board
Conveyor side wall
3 Technical data and assemblies User manual SIPLACE X-Series
3.7 PCB conveyor system From software version 708.1 Version 05/2015
166
PCB warpage in the direction of transport + PCB thickness < 5.5 mm. Bending up of board edge
max. 2.5 mm.
3
3
Fixed clamped edge
Conveyor belt
PCB transport direction
Front board edge
Front board edge
Left conveyor belt
Right conveyor belt
PCB transport direction
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 708.1 Version 05/2015 3.7 PCB conveyor system
167
3.7.5.2 PCB warpage during placement
A warpage of 2 mm can lead to problems focussing on local fiducials and ink spots in the middle
of the PCB. The digital camera's focus is 2 mm. When all the tolerances are taken into account,
this value is reduced to 1.5 mm. Also note that the component height is reduced by the warpage.
3
3
PCB warpage down, max. 0.5 mm
3
Use magnetic pin supports to achieve this value.
Movable clamping device
Fixed clamped edge
Printed circuit board
Conveyor side wall
Printed circuit board
Magnetic pin
support
Movable clamping device
Fixed clamped edge
Conveyor side wall
0.5 mm