KE-2030使用说明书 - 第19页

1 − 10 Description of abbreviations ATC : Automatic Tool Chang er OCC : Offset Co rrection Camera EPU : External Progra mming Unit HLC : Host Line Computer HOD : Handheld Operating Device MTC : M atrix T ray Changer PW B…

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1.1.3 System configuration
Color liquid-crystal display (LCD)
Keyboard
Track ball
FDD
HDD
100 Base/10 Base Ethernet board
Rear side operation unit *1
Area sensor
(
for the rear side only)
Signal tower
Emergency stop button
Optional
Spare feeder change truck (30)
Signal tower with the buzzer
Placing head L
Laser recognition head (MNLA)
Offset correction camera
Bad mark reader (30)
Height Measurement System 30 (HMS)
Automatic tool changer (ATC)
Feeder float detecting function
Pneumatic piping system
Vision Centering System (VCS)
Batch feeder change function (30)
Placing head R
Laser recognition head (MNLA)
Offset correction camera
Bad mark reader
Height Measurement System (HMS)
Feeder bank driver
Verification function (30)
Vision monitor
Feeder table
PWB conveyor unit
Power unit
CPU board
I/O control CPU
Motor control unit
Cabinet
X-Y positioning unit
Placement station L
Placement station R
Automatic PWB transportation width adjustment device
UPS
Feeder position indicator function (30)
Automatic tape cutter (short tape length type)
Bulk feeder
Tape feeder
Stick feeder
Host Line Computer (HLC)
Stack stick feeder
Non-stop operation function
Host Line Computer (HLC)
External Programming Unit (EPU)
KE-2030M /KE-2030L/KE-2030E
Pin reference
Outline reference
Pin reference
Outline reference
*1
*1
*1
*1
*1
*1
*1
*1
*1
SOT Direction Check Function
*1
Note:
Options marked with an asterisk "*" are to be installed onto the main
unit at the factory.
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Description of abbreviations
ATC : Automatic Tool Changer
OCC : Offset Correction Camera
EPU : External Programming Unit
HLC : Host Line Computer
HOD : Handheld Operating Device
MTC : Matrix Tray Changer
PWB : Printed Wiring Board
VCS : Visual Centering System
HMS : Height Measurement System
CVS : Component Verification System
FPI : Feeder Position Indicator
MNLA : Multi Nozzle laser Align
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1.1.4 Mechanical specifications
(1) Placement accuracy
The following table lists the placement accuracy data for different types of
components. A poorer accuracy results depending on the components that may
have an edge or plastic mold burrs at the area detected with the laser align
function, and that may have a moving part to be detected with respect to the pick
port.
Table 1.1.4.1
Unit: mm
Component type KE-2030
LAHD heads (Laser recognition correction)
Component size 20 or less
Square chip (0603)
Square chip (other than 0603) ± 0.8
MELF ± 0.1
SOT ± 0.15
Aluminum electrolytic capacitor ± 0.3
SOP ± 0.15 in the right angle direction against
the lead (Burr on one side: 0.15 or less)
±0.2 in the direction parallel to the lead
PLCC, SOJ ± 0.2
QFP, TSOP (Pitch: 0.8 or more) ± 0.12
QFP, TSOP (Pitch: 0.65 or more) ± 0.09
BGA ± 0.2
Other large-size components ± 0.3
(2) Placement cycle time
The optimized placement cycle time is shown below. The cycle time required
when a component is placed on a board actually varies depending on the board
size or how many times a nozzle is replaced.
When eight nozzles (two heads x 4 nozzles) pick up and place components
simultaneously and center them with laser
(3) Small chip component
20,000 components/hour (0.18 seconds/component)
The value above is a rough estimate calculated on the assumption that eight
components are simultaneously picked up and two components are
simultaneously placed on the almost entire area of a 330 mm x 250 mm
board.
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Definition
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