KE-2030使用说明书 - 第24页
1 − 15 1.1.6 A pplicable components and packages (1) Applicable component sizes (For laser recognit ion) Component heig ht : Min. 0.2 mm Ma x. 6mm Component size : Min. 1.0 X 0.5 mm Max . M 23.5 mm Lead pitch : Min. 0.65…
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(8) UPS
This machine is equipped with the uninterruptible power supply (UPS) to prevent
data from being damaged or lost due to power failure.
Batteries are used as the back-up power supply of the UPS, so the UPS is
designed to stop the system before these batteries run down. Therefore, even
during power failure, the system can be terminated safely so that any data cannot
be damaged or lost even when a power failure occurs.
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1.1.6 Applicable components and packages
(1) Applicable component sizes (For laser recognition)
Component height : Min. 0.2 mm
Max. 6mm
Component size : Min. 1.0 X 0.5 mm
Max. M 23.5 mm
Lead pitch : Min. 0.65 mm
(2) Applicable component sizes
Table 1.1.6.1
Component Name Shape Package
Square chip resistor 0603, 1005, 1608, 2012, 3216, 3225 (5025, 6432)
Network resistor (Excluding SOP, SOJ, PLCC types)
MELF resistor 1.6 x φ1.0mm, 2.0 x φ1.25mm, 3.5 x φ1.4mm,
5.9 x φ2.2 mm
Laminated ceramic
capacitor
0603, 1005, 1608, 2012, 3216, 3225, 4532, 5750
(5632)
Tantalum chip capacitor 3216, 3528, 6032, 7343
Aluminum electrolytic
capacitor Height:
6.0 mm or less
Chip film capacitor
Variable trimmer capacitor,
Chip potentiometer,
trimmer
Chip ferrite beads
Chip inductor
Tape
SOT molded part 1608/2012, SOT-23,
SOT-89, SOT-143, SOT-223
SOP 8, 14, 16, 18, 20, 24, 28-pin
SOJ 16, 18, 20, 24, 26, 28-pin
PLCC 18, 20, 22, 28 (Square), 28 (Rectangle),
32, 44-pins
QFP, BQFP Lead pitch: 0.65 mm or less
□
20mm or less
BGA □20mm or less
Connector
□
20mm or less with 0.65mm or less pitch,
Laser recognition must be possible.
IC socket □20mm or less with 0.65mm or more pitch,
Laser recognition must be possible.
Tape
Stick
Note:
Four nozzles can pick up components whose size is 10 mm x 10 mm
or less simultaneously.
Two nozzles (No. 1 and 3 or No. 2 and 4: one nozzle is skipped) can
pick up components whose size is larger than 10 mm x 10 mm
simultaneously.
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Note: For the shape of chip components to be mounted
(1) For the parts whose shape is cylindrical, there is no minimum shade when turned,
and chip recognition by laser align is therefore impossible.
(2) A poor pickup or placement accuracy could result if the top surface of the
component to be placed is curved, protruded, or dented. Avoid using such
components. (Some such components may, however, be handled by changing
the nozzle number.)
<Typical pickup failures>
MO
MO
<Typical poor placement accuracy>
Pickup nozzle
Slotted groove
Embossed characters
Dented
Laser recognition