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User Manual SIPLAC E HF Series 3 Technical data Software Vers ion SR.505.xx 05/2004 US Edition 3.6 Placem ent heads 101 The star r otates ab out the star a xis with its 12 se gments. The s egments hold the s leeves. Ther…
3 Technical data User Manual SIPLACE HF Series
3.6 Placement heads Software Version SR.505.xx 05/2004 US Edition
100
PLACE Collect&Place heads turn about a horizontal axis, in contrast to conventional chip shoot-
ers. This does not simply save space: the small diameter means that substantially smaller
centrifugal forces occur in comparison to conventional chip shooters. This largely eliminates the
risk of components slipping during transportation.
And there is yet another benefit: the cycle time of the Collect& Place head is the same for all com-
ponents, which means that the placement rate is not dependent on the component size.
Checking and self-learning functions 3
The reliability of the Collect&Place head is increased by various checking and self-learning func-
tions.
– For example, vacuum checks at the nozzles indicate whether the component was picked up or
set down correctly.
– A mark on the feeder is used to determine the precise component pick-up position on the
feeder.
– A camera on the placement head determines the precise angle of each component on the noz-
zle. Any deviations from the required pick-up position are corrected before placement takes
place. When further components are picked up, the average of the deviations for the last 10
placement operations are taken into account, thus further increasing pick-up accuracy.
– The package form is also checked, and the component is not placed if the geometric data thus
determined differs from the programmed data.
– The vertical axis (Z axis) for picking up and placing the component works in sensor stop mode,
in which differences in height during pick-up and any unevenness of the PCB surface are com-
pensated during placement. The average of the deviations during the last 10 placement oper-
ations is also taken into account when adapting the further stroke and placement speeds. The
programmed placement force always remains constant.
– A component sensor may be installed on the C&P head in order to increase placement reliabil-
ity. The component sensor checks the edge ratio of the components, in addition to whether the
component is present at the nozzle. In this way it is possible to determine whether the compo-
nent was picked up by the nozzle transversely or on edge.
– The 12-segment Collect&Place head can optically center and place components from 0.6 x
0.3 mm² to 13 x 13 mm² using the optional DCA vision module. The DCA vision module opti-
mizes the speed and accuracy when placing high-speed flip-chips and bare die components
The values are shown in the table on page 102
.
3.6.2.2 Description of the functions
The 12-segment Collect&Place head has three axes - the DR or star axis, the Z axis and the DP
axis.
User Manual SIPLACE HF Series 3 Technical data
Software Version SR.505.xx 05/2004 US Edition 3.6 Placement heads
101
The star rotates about the star axis with its 12 segments. The segments hold the sleeves. There
is a nozzle seated on every sleeve, which sucks up the components, and transports them from
the pick-up/placement position (1) to the reject position (3), to the optical centering position (7) or
to the turning position (9).
The Z axis performs a vertical movement. Every sleeve that is in the bottom star position (1) is
raised or lowered by this axis, thus picking up the components from the conveyors and setting
them down on the PCB. The Z axis is an "intelligent axis". It "notes" the pick-up height of each
conveyor track and the placement height for each component. This can speed up the placement
process. The programmed placement force remains constant.
3
Fig. 3.6 - 5 Description of the functions
The DP axis rotates the optically centered component to the desired placement angle. The se-
quences of movements of the rotation and translation axes are controlled by control circuits. Po-
sition and speed sensors send the actual values for the axis movement to the axis control. The
setpoint and actual values are compared and used to determine the force and speed parameters
for the servo amplifier, and thus the axis movement to be performed. The vacuum values at the
Component camera
DP axis
Rotate component
into placement position
Remove sleeve
or insert
Z axis
Pick up component
or place it
Star axis
Star rotation
Reject component
3 Technical data User Manual SIPLACE HF Series
3.6 Placement heads Software Version SR.505.xx 05/2004 US Edition
102
nozzle are constantly checked throughout the entire pick-up and placement process in order to
keep the placement error rate as low as possible.
3.6.2.3 Technical data
3
12-segment Collect&Place head
with standard component vision
camera
12-segment Collect&Place
head with DCA camera
Range of components 0201 to PLCC44, BGA, µBGA,
flip-chip, TSOP, QFP, SO to
SO32, DRAM
0201 to flip-chip, bare die
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball bump ∅
Min. dimensions
Max. dimensions
Max. weight
6 mm
0.5 mm
0.35 mm
0.2 mm
0.6 x 0.3 mm²
18.7 x 18.7 mm²
2 g
6 mm
0.4 mm
0.2 mm
0.11 mm
0.6 x 0.3 mm²
13 x 13 mm²
2 g
Programmable set-down
force
2.4 N - 5.0 N 2.4 N - 5.0 N
Nozzle types 9 xx 9 xx
X/Y accuracy ± 60 µm/4 σ ± 55 µm/4 σ
Angular accuracy ± 0.7°/4 σ ± 0.7°/4 σ