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3 Technical data User Manual SIPLACE HF Series 3.6 Placement heads Software Version SR.505.xx 05/2004 US Edition 102 nozzle a re constan tly chec ked throug hout the entire pic k-up and placeme nt process in orde r to ke…
User Manual SIPLACE HF Series 3 Technical data
Software Version SR.505.xx 05/2004 US Edition 3.6 Placement heads
101
The star rotates about the star axis with its 12 segments. The segments hold the sleeves. There
is a nozzle seated on every sleeve, which sucks up the components, and transports them from
the pick-up/placement position (1) to the reject position (3), to the optical centering position (7) or
to the turning position (9).
The Z axis performs a vertical movement. Every sleeve that is in the bottom star position (1) is
raised or lowered by this axis, thus picking up the components from the conveyors and setting
them down on the PCB. The Z axis is an "intelligent axis". It "notes" the pick-up height of each
conveyor track and the placement height for each component. This can speed up the placement
process. The programmed placement force remains constant.
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Fig. 3.6 - 5 Description of the functions
The DP axis rotates the optically centered component to the desired placement angle. The se-
quences of movements of the rotation and translation axes are controlled by control circuits. Po-
sition and speed sensors send the actual values for the axis movement to the axis control. The
setpoint and actual values are compared and used to determine the force and speed parameters
for the servo amplifier, and thus the axis movement to be performed. The vacuum values at the
Component camera
DP axis
Rotate component
into placement position
Remove sleeve
or insert
Z axis
Pick up component
or place it
Star axis
Star rotation
Reject component
3 Technical data User Manual SIPLACE HF Series
3.6 Placement heads Software Version SR.505.xx 05/2004 US Edition
102
nozzle are constantly checked throughout the entire pick-up and placement process in order to
keep the placement error rate as low as possible.
3.6.2.3 Technical data
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12-segment Collect&Place head
with standard component vision
camera
12-segment Collect&Place
head with DCA camera
Range of components 0201 to PLCC44, BGA, µBGA,
flip-chip, TSOP, QFP, SO to
SO32, DRAM
0201 to flip-chip, bare die
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball bump ∅
Min. dimensions
Max. dimensions
Max. weight
6 mm
0.5 mm
0.35 mm
0.2 mm
0.6 x 0.3 mm²
18.7 x 18.7 mm²
2 g
6 mm
0.4 mm
0.2 mm
0.11 mm
0.6 x 0.3 mm²
13 x 13 mm²
2 g
Programmable set-down
force
2.4 N - 5.0 N 2.4 N - 5.0 N
Nozzle types 9 xx 9 xx
X/Y accuracy ± 60 µm/4 σ ± 55 µm/4 σ
Angular accuracy ± 0.7°/4 σ ± 0.7°/4 σ
User Manual SIPLACE HF Series 3 Technical data
Software Version SR.505.xx 05/2004 US Edition 3.6 Placement heads
103
3.6.3 6-segment Collect&Place head for high-speed IC placement
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Fig. 3.6 - 6 6-segment Collect&Place head - Function groups, part 1
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(1)Vacuum generator
(2)Turning station, DP axis
(3)Star with 6 sleeves - star axis
(4)Forced air valve
(5)Silencer