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User Manual SIPLAC E HF Series 3 Technical data Software Vers ion SR.505.xx 05/2004 US Edition 3.1 Descript ion of the machine 87 3 T echnical dat a 3.1 Description of the machine 3.1. 1 Overview The SMD p lacement syste…

2 Operational safety User Manual SIPLACE HF Series

2.11 ESD guidelines Software Version SR.505.xx 05/2004 US Edition

Always place the modules on a conductive surface (table with an ESD coating, conductive ESD

foam, ESD bag or container).

Do not bring modules near visual display units, monitors or televisions. Keep them at least 10 cm

away from the screen.

2.11.4 Measurements and modifications to ESD modules

Do not take measurements on such modules unless

– the measuring device is earthed (e.g. via PE conductors) or

– you discharge the measuring head just before taking measurements with a potential-free mea-

suring device (e.g. by touching an unpainted metal part of the controller casing).

Æ Always use an earthed soldering iron if you carry out any soldering work.

2.11.5 Dispatching ESD modules

Æ Always store modules and components in conductive packaging (e.g. metallized plastic bags

or metal sleeves) and dispatch them in conductive packaging.

If the packaging is not conductive, place the modules in a conductive envelope before packag-

ing. (Use ESD bags, domestic aluminum foil or paper, for example. NEVER use plastic bags

or film). 2

Æ If the module has integral batteries, ensure that the conductive packaging does not touch or

short-circuit the battery terminals and, if necessary, first cover the terminals with insulating tape

or material.

User Manual SIPLACE HF Series 3 Technical data

Software Version SR.505.xx 05/2004 US Edition 3.1 Description of the machine

3 Technical data

3.1 Description of the machine

3.1.1 Overview

The SMD placement systems from the SIPLACE HF series are characterized by their high config-

uration flexibility, excellent placement rate and maximum precision. The machines cover the SMD

spectrum of components from 0201 to 125 x 10 mm² with a high placement rate.

Two placement methods are used:

–the Collect&Place method with revolver heads for components from size 0201 to fine-pitch

–the Pick&Place method with the SIPLACE TwinHead for fine-pitch and OSC components

Fig. 3.1 - 1 HF placement machine, overview

3 Technical data User Manual SIPLACE HF Series

3.1 Description of the machine Software Version SR.505.xx 05/2004 US Edition

The placement machines are based on a torsionally-rigid and vibration-damped cast steel ma-

chine frame. This guarantees an excellent production quality and less environmental pollution for

employees since the noise of shaking and vibration are reduced to a minimum.

The HF placement machine has two gantries. The HF/3 machine is equipped with three gantries.

There is a placement head on each gantry. These can be quickly and accurately positioned by

linear motors, moving independently of one another in the X and Y directions.

According to the head modularity principle developed by Siemens, the placement heads can be

quickly and easily changed. An overview of the placement head configuration can be found in sec-

tion 3.6

, page 95.

There are four locations for feeding components. Up to four component trolleys or alternatively

one or two matrix tray changers (HF/3: one MTC) can be docked in place of component trolleys.

The placement heads fetch the components from the fixed feeders on the component trolley or

from the trays in the matrix tray changer, and place the PCBs, which are also stationary. The

placement machines from the HF series have two placement areas:

– on the single conveyor, one or two PCBs can be placed concurrently.

– on the dual conveyor, up to four PCBs can be placed concurrently.

The principle of the "stationary component supply" and "stationary PCB", which has proved most

suitable for all SIPLACE placement machines, has a number of significant advantages:

– There are no downtimes for topping up components or splicing tapes.

– The vibration-free component feeder means that even the smallest components (e.g. 0201) are

picked up reliably.

– The PCB, which does not move during the placement process, prevents the components slip-

ping.

– The combination of placement heads with nozzle changers always guarantees an optimum

nozzle configuration for every placement process, thus minimizing traversing paths and opti-

mizing the placement sequence.

High flexibility, cost-effectiveness and set-up reliability combine to ensure that the SIPLACE HF

series provides high productivity. Minimum down times increase utilization and thus help to in-

crease productivity.