SIPLACE 80 F4_EN - 第12页

11 Description Thanks to reduced non-productive times the dual PCB co nveyor can substantially i ncrease the through- put, depending on the progr am. It makes i t possible to transport two PCBs through the pl acer simult…

Description

On SIPLACE 80 F

placers the in-

line conveyor system guarantees a

quick adjustment to new PCB

widths. The change is made either

at the station via menu function or

from the line computer via the

automatic width adjustment unit.

Ceramic substrates are also trans-

ported and, if necessary, fastened

in place via the optional ceramic

substrate centering unit.

As standard, the SIPLACE place-

ment systems are available with a

single conveyor system.

PCB Conveyor:

Single Conveyor

Technical Data

PCB dimensions

50 x 50 mm to 460 x 460 mm

(optional 460 x 508 mm)

PCB thickness 0.5 to 4.5 mm

Max. PCB warp

Top: 4.5 mm - PCB thickness

Bottom: 0.5 mm + PCB thickness

PCB underside clearance

Standard: 25 mm,

Option: max. 40 mm

PCB conveyor height

830 ± 15 mm (Standard)

900 ± 15 mm (Option)

930 ± 15 mm (Option)

950 ± 15 mm (Option) SMEMA

Fixed conveyor edge On right (standard); on left (option)

Type of interface Siemens (standard); SMEMA (option)

Component-free PCB

handling edge 3 mm

PCB changing time 2.5 s

PCB Conveyor

PCB Transport

Direction

Description

Thanks to reduced non-productive

times the dual PCB conveyor can

substantially increase the through-

put, depending on the program. It

makes it possible to transport two

PCBs through the placer simulta-

neously (synchronous) or alter-

nately (asynchronous).

In the synchronous type of trans-

port it is possible, for example, to

finish the top and bottom of the

PCB in a single line without using

cluster technology.

In the asynchronous type of trans-

port a PCB is moved into the

placer in “slack time” while an-

other of the same type is being

populated. The non-productive

time caused by the PCB transport

is therefore completely eliminated.

The increase in placement speed

to be anticipated is between 10

and 30%, depending on the com-

ponents to be placed on the PCB.

The client can switch between

asynchronous and synchronous

dual conveyor with little effort. The

optional ceramic substrate center-

ing is possible, but the PCB bar

code reading process is not.

PCB Conveyor:

Dual Conveyor

Technical Data

PCB dimensions 50 x 50 mm to 460 x 216.5 mm

Fixed conveyor edge Right (standard), left (option)

Placement program per conveyor

Synchronous: same or different

Asynchronous: same

PCB width

per conveyor

Synchronous: same or different

Asynchronous: same

Ink spot recognition

Synchronous: not possible

Asynchronous: same

Automatic width adjustment

Synchronous: not possible

Asynchronous: possible

Asynchronous Dual Conveyor

Asynchronous Synchronous

Description

Due to the increasing use of ce-

ramic substrates in Flip Chip tech-

nology the demands for precise

substrate centering are growing.

The optical and mechanical ce-

ramic substrate centering units on

the SIPLACE 80 S-20 and SIPLACE

80 F

placement systems satisfy

these demands.

Like the PCB vision module, opti-

cal centering is conducted with the

aid of reference marks (fiducials).

Depending on the contrast ratio

the machine activates the standard

lighting or the oblique lighting con-

tained in the option:

On ceramic and CM blue light

(Item No 116172).

On flexible PCBs using vision

module without IF-filter infrared

light (Item No 116173).

In certain cases, mechanical cen-

tering is required, e.g., when

placement is to continue to the

substrate edge, when handling of

the edges of the substrate is to be

particularly gentle, or when sub-

strates are scribed. In this gentle,

bounce-free procedure, the sub-

strate is fixed in place in the Y-

direction between a stop rail and a

rocking lever pneumatically cen-

tered in the X-direction.

PCB Conveyor:

Ceramic Substrate Centering (Option)

Technical Data

Substrate dimensions 2" x 2" to 4" x 7"

Substrate thickness 0.5 to 1.5 mm

Substrate model

Unscribed (no difficulty)

Scribed (after test)

Contact in conveyor 2.5 mm

Optical centering:

Field of view of the PCB

vision module

Type of lighting

with light-colored pastes

with dark pastes and short di-

stance to neighboring structu-

res (>1 mm)

5.7 x 5.7 mm

PCB vision module (standard)

Oblique lighting (option)

Fiducal mark criteria

See PCB vision module position reco-

gnition

Mechanical centering

X-/Y-centering accuracy

± 0.07 mm / 4 σ

PCB underside clearance 12 mm

Compressed air connection 5.5 bar

Optical Centering via Mechanical Centering

PCB Camera

Movable

Transport Side

Y-Fixation

Fixed

Transport

Side

Fixed

Transport

Side

Stopper

Ceramic Substrate

Movable

Transport Side

X-Center-

ing