SIPLACE 80 F4_EN - 第6页

5 Description The main X-/Y-gantry features two placement heads, the 1 2-nozzle high-speed revolver pl acement head and the high-precision P ick & Place head or Fine Pitch place- ment head. With certain overl apping,…

Input Station

Screen Printer

Oven

SIPLACE 80 S-20

SIPLACE 80 F

with Waffle Pack Changer

Output

Station

Example of a SIPLACE Placement Line

Description

The modular SIPLACE design is

characterized by flexibility and

adaptability. It permits an individual

production line composition of

similar and different modules.

When performance requirements

change the individual machines

can be recombined quickly and

without complications, one of the

major reasons being their relatively

small size.

The SIPLACE family offers the

right product for each purpose -

from high-speed SMD placement

systems SIPLACE 80 S-20 to the

flexible Fine-Pitch placement

system SIPLACE 80 F

SIPLACE 80 F

is ideally suited for

fixed set-up as well as for family

set-up with optimized changeover

times. When the required capacity

is low, however, it is also suitable

as a standalone placement sys-

tem.

Line Design

Technical Data

System SIPLACE SMD placement lines

Modules

SIPLACE 80 S-20 / SIPLACE 80 F

SIPLACE HS-50 / SIPLACE S-23 HM /

SIPLACE F

Peripherals

Input/output station, screen printer,

solder oven, inspection conveyor etc.,

available from Siemens

Component range 0201* to 55 x 55 mm**

PCB conveyor

PCB dimensions

Ceramic substrate dimensions

Automatic width adjustment

50 x 50 mm to 460 x 460 mm

(optional 460 x 508 mm)

2" x 2" to 4" x 7"

Placement speed depends on layout of modules

Space required

4 m² / SIPLACE S & F modules

7.5 m² / SIPLACE HS module

* Collect & Place

** Pick & Place

Description

The main X-/Y-gantry features two

placement heads, the 12-nozzle

high-speed revolver placement

head and the high-precision Pick &

Place head or Fine Pitch place-

ment head.

With certain overlapping, each

placement head is specialized for a

specific range of components.

Therefore it is possible to option-

ally distribute the components to

be placed between the two heads.

Placement Heads

Technical Data

Placement principle

Pick & Place (Pick & Place head)

Collect & Place (Revolver head)

Components Entire SMD range

Component table:

Pick & Place head

12-nozzle revolver head

Feeder on changeover table

Waffle Pack Changer or manual trays

Feeder on changeover table

Placement Heads SIPLACE 80 F

Pick & Place Head

Collect & Place

Revolver Head

PCB Transport

Direction

Revolver Head Function

Component Pick-Up/

Placement

Segment

Removal

Point

Turning to

the Placement

Position

Component

Vision

Description

The 12-nozzle revolver head oper-

ates on the Collect & Place princi-

ple. In contrast to classic shooters

the 12 vacuum nozzles of the

SIPLACE revolver heads rotate

around a horizontal axis. Due to

the small diameter the centrifugal

forces which develop are much

lower than with chipshooters. The

results are reliable placement and

the same cycle time for all compo-

nents.

The components are picked up

and placed gently and reliably with

the aid of vacuum or blast air. A

number of vacuum tests indicate

whether the component was

picked up and set down correctly.

Different control and self-learning

functions further enhance the reli-

ability of the system:

The optical position recognition

unit for the feeder ascertains

the exact position of the com-

ponent table.

A camera on the revolver head

(component vision module) de-

termines the exact position of

each component on the nozzle.

Offsets are corrected prior to

placement and taken into ac-

count during the subsequent

component pick-up process.

In addition, the geometric form

(package form) is also checked.

If the actual geometric dimen-

sions of the component do not

correspond to those pro-

grammed, it is not placed.

Irregular PCB surfaces are eve-

ned out by the sensor stop ope-

ration while the nozzle is being

lowered and they are also

“learned”.

Components recognized as

faulty are ejected by blast air

and automatically repaired in a

repair cycle.

Placement Heads:

12-Nozzle Revolver Head for High-Speed

Technical Data

Component spectrum*

0402 to 18.7 x 18.7 mm,

incl. BGA, µBGA, Flip Chip, QFP,

TSOP, PLCC, SO to SO32, DRAM

Height*

min. lead pitch

min. dimensions

max. dimensions

6 mm

0.5 mm

0.5 x 1.0 mm

18.7 x 18.7 mm

Weight* 2 g

Stroke of Z-axis max. 16 mm

Programmable placement force 2.4 to 5.0 N

Benchmark placement rate 10,000 cph

Angle accuracy

± 0.525° / 3 σ

± 0.70° / 4 σ

± 1.05° / 6 σ

Placement accuracy

± 67.5 µm/ 3 σ

± 90 µm/ 4 σ

± 135 µm/ 6 σ

* Up to these limit values a uniformly reliably, speedy and accurate placement

guaranteed over the

entire component range. Furthermore, components can be placed if they satisfy specific basic

conditions (For other components please contact Siemens).