IPC-A-610C(电子组装件的验收条件) - 第369页
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Standards
IPC/EIA J-STD-001C Requirements for Soldered Electrical and Electronic Assemblies
This is the industry standard for commercial and high-reliability assemblies. MIL-STD-2000 has been
cancelled, leaving J-STD-001C as the sole industry-consensus standard for soldering. This standard
describes materials, methods and verification criteria for producing quality soldered interconnections
and assemblies. Co-produced with EIA.
IPC/EIA J-STD-002A Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Covers the assessment of the solderability of electronic component leads, terminations, solid wire,
stranded wire, lugs and tabs. Prescribes test methods, defect definitions, acceptance criteria and illus-
trations for suppliers and users. Co-produced with EIA.
ANSI/J-STD-003 Solderability Tests for Printed Boards
Contains industry-recommended test methods, defect definitions and illustrations for suppliers and
users to assess the solderability of printed board surface conductors, lands and plated-through holes.
Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance.
Co-produced with EIA.
ANSI/J-STD-004 Requirements for Soldering Fluxes (Includes Amendment 1)
Describes general requirements for classifying and testing of rosin, resin, organic and inorganic fluxes
for high quality interconnections. This standard is a flux characterization, quality control and procure-
ment document for solder flux and flux-containing materials of all compositions, including no-clean.
Supersedes QQ-S-571 and MIL-F-14256. Co-produced with EIA.
ANSI/J-STD-005 Requirements for Soldering Pastes
Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball,
tack and wetting of solder pastes. (This is a quality control document and is not intended to relate
directly to a material’s performance in the manufacturing process.) Supersedes QQ-S-571.
Co-produced with EIA.
ANSI/J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed
Solid Solders for Electronic Soldering Applications
Describes requirements and test methods for electronic grade solder alloys, and for fluxed and non-
fluxed bar, ribbon, and power solders other than solder paste for electronic grade solders. Supersedes
QQ-S-571 and MIL-F-14256. Co-produced with EIA.
IPC-T-50F Terms and Definitions for Interconnecting and Packaging Electronic Circuits
This standard provides descriptions and illustrations to help users and their customers speak the same
language. Also included is a section of acronyms and an index of IPC-T-50F terms by technology types.
IPC-A-600F Acceptability of Printed Boards
Contains full-color photographs and illustrations of preferred, acceptable and rejectable conditions for
plated-through holes, surface plating, solder coating, base materials, etching, conductors, mechanical
processes, flexible and multilayer boards; bow/twist, flat cable and other conditions of printed wiring
boards.
IPC-CC-830A Qualification and Performance of Electrical Insulating Compound for Printed
Board Assemblies
This is the industry standard for qualifying conformal coating. It was designed and constructed with the
intent of obtaining maximum information about the confidence in the electrical insulating compound
(conformal coating) material under evaluation with a minimum of test redundancy. Includes evaluation
of material properties and procedures to qualify a coating using the standard test board.
IPC-SM-840C Qualification and Performance of Permanent Solder Mask
Streamlines solder mask classes into two classifications: H (high reliability) and T (telecommunications).
IPC-SM-840C also integrates Bellcore requirements (class T) and provides minimum voltage break-
down, defines mask formulation latitude, adds new mask chemistries and more.
For latest pricing information, visit our website at www.ipc.org
APPLICABLE DOCUMENTS TO THE IPC-A-610