IPC-A-610C(电子组装件的验收条件) - 第5页

IPC-A610 ADOPTION NOTICE IPC-A610, "Acceptability of Electronic Assemblies", was adopted on 12-FEB-02 for use by the Department of Defense (DoD). Proposed changes by DoD activities must be submitted to the DoD …

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IPC-A610
ADOPTION NOTICE
IPC-A610, "Acceptability of Electronic Assemblies", was adopted
on 12-FEB-02 for use by the Department of Defense (DoD).
Proposed changes by DoD activities must be submitted to the DoD
Adopting Activity: Commander, US Army Tank-Automotive and
Armaments Command, ATTN: AMSTA-TR-E/IE, Warren, MI 48397-5000.
Copies of this document may be purchased from the The Institute
for Interconnecting and Packaging Electronic Circuits, 2215
Sanders Rd, Suite 200 South, Northbrook, IL 60062.
http://www.ipc.org/___________________
Custodians: Adopting Activity:
Army - AT
(Project SOLD-0060)
Army - AT
Navy - AS
Air Force - 11
Reviewer Activities:
Army - AV, MI
AREA SOLD
DISTRIBUTION STATEMENT A:
Approved for public release; distribution
is unlimited.
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of the
IPC-A-610 Task Group (7-31b) of the Product Assurance Subcommittee (7-30) are shown below, it is not possible
to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend
their gratitude.
Product Assurance
Committee
IPC-A-610
Task Group
Chair
Mike Hill
Viasystems Technologies Corporation
Technical Liaisons of the
IPC Board of Directors
Stan Plzak
Pensar Corp.
Peter Bigelow
Beaver Brook
Circuits Inc.
Co-Chairs
Constantino J. Gonzalez
ACME, Inc.
Jennifer Day
Soldering Technology International
Mel Parrish
EMPF/ACI
Members of the IPC-A-610 Task Group
Kermit Aguayo, XeTel Corporation
Michael Aldrich, Ametek Aerospace
Kari Anderson, Raytheon Technical Services Co.
Gad Arbel, IAI
Peter Ashaolu, Cisco Systems Inc.
William J. Balon, Bayer Corporation
Timothy E. Bates, Alcatel USA
Chris Beaufait, General Electric Co.
Ronald P. Belanger, M/A-COM Inc.
Craig Bennett, NSWC - Crane
Evon C. Bennett, Powerwave Technologies, Inc.
Dennis F. Bernier, Kester Solder Division
Peggi J. Blakley, NSWC - Crane
Richard W. Boerdner, EJE Research
G. L. Bogert, Bechtel Plant Machinery, Inc.
Diana Bradford, Soldering Technology International
Bruce Bryla, L-3 Communications
Carl Buchanan, U.S. Aviation & Missile Command
Terry Burnette, Motorola Inc.
William G. Butman, Circuit Technology Center Inc.
Jeff Cannis, Amkor Technology Inc.
Dennis J. Cantwell, Printed Circuits Inc.
Ken H. Carlson, Harris Corporation
Thomas A. Carroll, Hughes Space and Communications Co.
Byron Case, L-3 Communications
Alan S. Cash, Northrop Grumman Corporation
Rick Cash, CyberOptics Corporation
Gary W. Chance, Nokia Telecommunications
Dr. Bev Christian, Nortel Networks Ltd.
Ray Cirimele, Diversified Systems Inc.
Jeffrey C. Colish, Northrop Grumman Corporation
Brian Crowley, Hewlett Packard Laboratories
David D’Amore, ACT Manufacturing Inc.
Derek D’Andrade, Surface Mount Technology Centre
J. Gordon Davy, Northrop Grumman ES&SD
Jennifer Day, Soldering Technology International
Lyn Dayman, ATTEC Australia
Rodney Dehne, OEM Worldwide
Stacey DeLorenzo, Northrop Grumman Corporation
Ramon A. Diaz, Solectron Technology Inc.
Michele J. DiFranza, The Mitre Corp.
Darrin Dodson, Alcatel USA
Nick D’onofrio, CAE Electronics Ltd.
Nancy Dutcher, U.S. Assemblies Hallstead Inc.
Kathy Edsinger, MCMS
Tommy R. Etheridge, Boeing Aircraft & Missiles
Gary Falconbury, Raytheon Technical Services Co.
James E. Farrell, Atlantis Aerospace Corp.
Jeff Ferry, Circuit Technology Center Inc.
Daryl Feryance, Eaton/Cutler-Hammer
Charles D. Fieselman, Solectron Technology Inc.
Skip Forbes, Republic Technology
Daniel L. Foster, Electronics Training Advantage (ETA)
Mike Freed, Rockwell Automation/Allen-Bradley
Lionel Fullwood, WKK/Wong’s Kong King Int’l
Mahendra S. Gandhi, Raytheon Systems Company
Floyd L. Gentry, Sandia National Labs Albuquerque
John J. German, Orbital Sciences Corporation
Constantino J. Gonzalez, ACME, Inc.
Randall Goodnight, Solectron Technology Inc.
Acknowledgment
iiiIPC-A-610C January 2000