IPC-TM-650 EN 2022 试验方法-- - 第129页

IPC-TM-650 The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was vol untaril y establis hed by T echni cal Committ…

100%1 / 824
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.3.7.1
Cupric
Chloride
Etching
Method
12/94
A
5.4
Drying
Samples
may
be
air
dryed
for
subsequent
mate¬
rial
evaluations.
For
referee
testing,
an
oven
bake
for
1
hour
at
80
±
5.6℃
[176
±
10°F]
is
required.
5.5
Evaluation
Determine
and
record
whether
the
etching
procedure
resulted
in
any
unusual
events,
such
as:
a.
Dwell
time
in
etcher
necessary
for
complete
copper
removal,
if
longer
than
normal.
b.
Warpage
or
distortion
of
the
material.
c.
Discoloration
or
other
visual
changes
to
the
material.
6.0
Notes
None
IPC-TM-650
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 2
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
method
is
a
means
for
preparation
of
test
specimens
for
determination
of
bare
dielectric
material
quality
and
properties,
using
an
alkaline
etching
solution
for
removal
of
copper
cladding.
2
.0
Applicable
Documents
Method
2.3.1
.1
,
Chemical
Cleaning
of
Metal
Clad
Laminate
3
.0
Test
Specimens
The
size
of
lot
samples
or
test
speci¬
mens
shall
be
determined
by
the
inspections
or
tests
to
be
performed
after
etching
and
the
capabilities
of
the
etching
equipment.
4
.0
Apparatus
or
Material
4.1
Standard
chemical
etching
chamber
or
laboratory
equipment
suitable
to
the
etchant
chemistry.
4.2
Air
circulating
oven
capable
of
maintaining
the
specified
temperatures
and
tolerances.
4.3
Personal
safety
equipment
shall
include:
rubber
or
poly¬
ethylene
gloves,
plastic
or
coated
apron,
and
safety
goggles.
4.4
Chemicals
Chemical
Chloride
Copper
Ammonium
Hydroxide
(N&OH)
Reagent
grade
isopropyl
alcohol
(IPA)
Distilled/Deionized
Water
Concentration
1
70
grams
per
liter
1
50
grams
per
liter
5.5
M
Specific
gravity
=
1
.20
As
required
As
required
4.5
Pattern
Developing
Materials
Etch
resist
system
or
materials
capable
of
producing
the
applicable
conductor
pat¬
terns.
5
.0
Procedure
5.1
Preparation
of
Specimen
Number
2.3.7.2
Subject
Alkaline
Etching
Method
Date
Revision
12/94
A
Originating
Task
Group
MIL-P-13949
Test
Methods
Task
Group
(7-1
1b)
5.1
.1
Shear
the
material
to
the
appropriate
sample
or
speci¬
men
size
and
if
necessary
remove
the
rough
edges
from
the
specimen
by
sanding
or
other
suitable
means.
Specimens
may
be
chemically
cleaned
in
accordance
with
IPC-TM-650,
Method
2.3.1
.1
.
Specimens
may
also
be
mechanically
cleaned.
5.1.2
If
a
conductor
pattern
is
required,
prepare
the
material
by
applying
etch
resist
according
to
standard
industry
prac¬
tices.
5.2
Etching
5.2.1
Remove
the
metal
cladding
by
etching
in
a
convey¬
orized
spray
chamber
or
other
suitable
vessel
containing
22
to
23
BAUME
alkaline
etching
solution
maintained
at
51
.7
±5.6℃
[125
±10°F].
Etching
time
shall
be
minimized
to
pre¬
vent
overexposure
of
the
bare
laminate
material
to
the
etching
solution
and
yet
allow
for
complete
removal
of
the
exposed
metal
cladding,
if
the
specimens
are
etched
in
a
laboratory
environment,
vigorous
agitation
may
be
required.
5.2.2
Rinse
the
specimens
thoroughly.
5.3
Cleaning
5.3.1
If
etch
resist
has
been
used,
samples
shall
have
the
resist
or
tape
removed
by
standard
industry
practices.
5.3.2
When
electrical
testing
is
required
on
the
material,
do
not
allow
the
etched
specimens
to
dry
before
they
go
through
the
cleaning
process.
For
general
testing,
scrubbing
with
a
soft
natural
bristle
brush
under
running
tap
water
and
rinsing
with
distilled
water
or
deionized
water
may
be
adequate.
For
critical
testing
and
for
referee
testing,
laminates
shall
be
soaked
for
10
±1
minutes
in
reagent
grade
IPA
followed
immediately
by
a
10
minute
rinse
in
flowing
16
megaohm
deionized
water.
5.4
Drying
Samples
may
be
air
dryed
for
subsequent
material
evaluations.
For
referee
testing,
an
oven
bake
for
1
hour
at
80
±5.6
[176
±10°F]
is
required.
5.5
Evaluation
Determine
and
record
whether
the
etching
procedure
resulted
in
any
unusual
events,
such
as:
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2・3・7・2
Alkaline
Etching
Method
12/94
A
a.
Dwell
time
in
etcher
necessary
for
complete
copper
removal,
if
longer
than
normal.
b.
Warpage
or
distortion
of
the
material.
c.
Discoloration
or
other
visual
changes
to
the
material.
6.0
Notes
6.1
If
the
etching
time
exceeds
15
minutes
for
1
oz/sq.
ft.
copper
or
30
minutes
for
2
oz/
sq.
ft.
copper,
renew
the
etch¬
ing
solution.
6.2
Alkaline
etchant
is
toxic
and
extreme
caution
should
be
exercised.
6.3
The
time
to
etch
a
clean
pattern
with
a
minimum
of
undercutting
should
be
approximately
7
minutes
for
1
oz./sq.
ft.
copper,
and
15
minutes
for
2
oz./sq.
ft.
copper
using
a
fresh
solution.