IPC-TM-650 EN 2022 试验方法-- - 第149页
IPC-TM-650 Number Subject Date Revision Page 3 of 3 2.3.21 Plating Quality Hull Cell Method 8/97 A 6.0 Notes 6.1 Preventative Maintenance, Troubleshooting 6.1.1 Depending upon the bath chemistry as analyzed, con¬ dition …
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
Page 1 of 2
r
ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
®
221
5
Sanders
Road
Northbrook,
IL
60062-6135
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
is
an
electrogravimetric
method
for
determin¬
ing
the
purity
of
copper
foil
or
plating.
2
Applicable
Documents
None
3
Test
Specimens
Each
copper
specimen
must
weigh
approximately
five
grams
and
be
raw
copper
foil
or
plating
without
treatment.
4
Apparatus
or
Material
4.1
Electrodes
for
Electrogravimetric
Analysis
A
plati¬
num
gauze
cathode.
A
platinum
gauze
rotating
anode
or
a
spiral
platinum
wire
anode.
4.2
Reagents
4.2.1
Acid
mixture
for
dissolving
sample:
Add
300
ml
of
concentrated
H
2s
O4
slowly
with
stirring
to
750
ml
of
water.
Cool
and
add
210
ml
of
HN03.
4.2.2
For
cleaning
the
sample
use
5%
H2S04.
For
cleaning
of
the
interior
of
the
glassware
use
diluted
HN03
(one
part
acid
plus
three
parts
distilled
or
deionized
water
by
volume).
4.2.3
For
final
rinsing
use
absolute
methanol
or
equivalent.
4.2.4
Distilled
or
deionized
water.
4.3
Other
apparatus
4.3.1
Fume
hood
for
removing
fumes
from
dissolution.
4.3.2
Hot
plate
for
heating
the
test
solution
to
80-90
[176-194
°F].
4.3.3
Analytical
balance
capable
of
weighing
copper
sample
and
platinum
cathode
to
the
nearest
0.1
mg.
4.3.4
Oven
for
drying
the
specimen
and
cathode
at
approxi¬
mately
110
[230
°F].
4.3.5
Current
source
capable
of
supplying
a
current
density
based
on
the
cathode
area
of
at
least
0.6
A/dm2
[6
ASF]-
Number
2.3.15
Subject
Purity,
Copper
Foil
or
Plating
Date
Revision
05/04
D
Originating
Task
Group
Rigid
Printed
Board
Performance
Task
Group
(D-33a)
4.3.6
Tail-form
180
ml
to
300
ml
lipless
beaker
provided
with
a
close-fitting
split
cover.
5
Procedure
5.1
Test
5.1
.1
Clean
the
copper
foil
by
dipping
in
5%
H2S04
at
room
temperature,
wash
thoroughly
in
tap
water,
then
distilled
water,
rinse
in
absolute
methanol
or
equivalent,
dry
for
a
few
minutes
in
hot
air
oven
at
11
0
[230
°F]
and
cool
in
a
des¬
iccator.
Weigh
the
copper
test
specimen
to
the
nearest
0.1
mg
and
transfer
to
a
tail-form
180
ml
to
300
ml
lipless
beaker
provided
with
a
close-fitting
cover.
Place
the
beaker
into
a
fume
hood.
5.1
.2
Add
45
ml
of
H2S04-HN03
mixture
and
allow
to
stand
covered
for
a
few
minutes
until
reaction
has
nearly
ceased.
5.1.3
Heat
at
a
temperature
of
80-90
[1
76-194
°F]
until
dissolution
is
complete
and
brown
fumes
have
been
expelled.
Never
boil.
5.1.4
Cool
slightly
and
carefully
wash
down
the
cover
and
insides
of
the
beaker
with
distilled
water
and
dilute
the
solu¬
tion
sufficiently
to
cover
the
cathode
cylinder.
The
purpose
of
the
wash
is
to
make
sure
that
any
of
the
ionized
copper
that
may
be
on
the
cover
or
inside
surface
of
the
beaker
is
in
the
solution
from
which
the
copper
is
to
be
reduced
by
electro¬
plating
onto
the
platinum
cathode.
5.1.5
Allow
solution
to
cool
to
ambient
conditions.
5.1.6
Weigh
the
cathode
to
the
nearest
0.1
mg.
5.1.7
Insert
the
electrodes
in
the
solution,
cover
to
prevent
splashing
or
evaporation,
and
electrolyze
at
a
current
density
of
0.6
A/dm2
[6
ASF].
(When
a
current
density
of
0.6
A/dm2
is
used,
the
electrolysis
takes
about
16
hours
and
is
conve¬
niently
carried
on
overnight.)
5.1.8
When
the
solution
becomes
colorless,
reduce
the
cur¬
rent
density
to
about
0.3
A/dm2
[3
ASF]
and
wash
down
the
cover
glasses,
electrode
stems
and
the
inside
of
the
beaker.
IPC-TM-650
Number
Subject Date
Revision
Page 3 of 3
2.3.21
Plating
Quality
Hull
Cell
Method
8/97
A
6.0
Notes
6.1
Preventative
Maintenance,
Troubleshooting
6.1.1
Depending
upon
the
bath
chemistry
as
analyzed,
con¬
dition
of
the
panel
relative
to
uniformity,
burning,
cloud
pat¬
terns
skip
plate,
etc.,
modification
by
controlled
additions
can
be
made
to
the
Hull
Cell
plating
solution
and
procedures
can
be
repeated.
Changes
caused
by
addition
to
the
Hull
Cell
will
duplicate
results
to
be
expected
by
the
same
proportionate
additions
to
the
main
plating
bath.
6.1.2
Correlations
of
thickness
checks
in
the
controlled
time,
temperature,
amperage
cathode
panel
will
also
tell
the
optimum
plating
range
to
obtain
plating
thickness
desired.
6.1.3
Source
of
applicable
documents:
R.O.
Hull
and
Co.,
Inc.
3203
W.
71st
Cleveland,
OH
44102
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
method
is
used
to
determine
the
pres¬
ence
and
effectiveness
of
the
protective
coating
deposited
over
the
PWB
to
prevent
oxidation
and
facilitate
good
wetting
during
soldering
operations.
The
coating
is
removed
during
soldering.
2
Applicable
Documents
None
3
Test
Specimens
3.1
Any
pre-production
or
production
copper
clad
board
at
least
5
cm
x
5
cm.
The
specimen
must
either
contain
circuitry
or
be
completely
copper
clad.
An
uncoated
bare
copper
clad
specimen
must
also
be
available
for
control
purposes.
4
Equipment/Apparatus
4.1
Reagent
or
commercial
grade
ferric
chloride
(42BE')
etchant
4.2
Petrie
dishes
or
glass
trays
Number
2.3.22
Subject
Copper
Protective
Coating
Quality
Date
Revision
2/78
Originating
Task
Group
N/A
4.4
Lint-free
cloth
5
Procedure
5.1
Test
5.1.1
Place
one
drop
of
ferric
chloride
on
several
locations
on
the
test
specimens
and
the
bare
copper
control
speci¬
mens.
5.1.2
Allow
to
stand
10
seconds,
then
rinse
with
tap
water
and
wipe
dry.
5.2
Evaluation
5.2.1
Examine
specimens
and
compare
with
bare
control
specimen.
Test
specimens
must
show
no
copper
etching,
proving
the
presence
and
effectiveness
of
protective
coating.
6
Note
Slight
"mottling”
or
a
slight
attack
on
the
coated
surface
indicates
uneven
deposition
or
insufficient
solids
of
the
coating.
4.3
Stop
watch