IPC-TM-650 EN 2022 试验方法-- - 第151页

The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was voluntarily establis hed by T echni cal Committees of the IP…

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The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
method
is
used
to
determine
the
pres¬
ence
and
effectiveness
of
the
protective
coating
deposited
over
the
PWB
to
prevent
oxidation
and
facilitate
good
wetting
during
soldering
operations.
The
coating
is
removed
during
soldering.
2
Applicable
Documents
None
3
Test
Specimens
3.1
Any
pre-production
or
production
copper
clad
board
at
least
5
cm
x
5
cm.
The
specimen
must
either
contain
circuitry
or
be
completely
copper
clad.
An
uncoated
bare
copper
clad
specimen
must
also
be
available
for
control
purposes.
4
Equipment/Apparatus
4.1
Reagent
or
commercial
grade
ferric
chloride
(42BE')
etchant
4.2
Petrie
dishes
or
glass
trays
Number
2.3.22
Subject
Copper
Protective
Coating
Quality
Date
Revision
2/78
Originating
Task
Group
N/A
4.4
Lint-free
cloth
5
Procedure
5.1
Test
5.1.1
Place
one
drop
of
ferric
chloride
on
several
locations
on
the
test
specimens
and
the
bare
copper
control
speci¬
mens.
5.1.2
Allow
to
stand
10
seconds,
then
rinse
with
tap
water
and
wipe
dry.
5.2
Evaluation
5.2.1
Examine
specimens
and
compare
with
bare
control
specimen.
Test
specimens
must
show
no
copper
etching,
proving
the
presence
and
effectiveness
of
protective
coating.
6
Note
Slight
"mottling”
or
a
slight
attack
on
the
coated
surface
indicates
uneven
deposition
or
insufficient
solids
of
the
coating.
4.3
Stop
watch
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 2
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
method
provides
procedures
to
deter¬
mine
the
porosity
of
gold
plating
on
both
copper
and
nickel
surfaces
by
chemical
means.
This
method
may
also
be
used
to
test
rhodium
or
palladium.
2
Applicable
Documents
None
3
Test
Specimens
3.1
Any
test,
pre-production,
or
production
sample
of
gold-
plated
circuitry
4
Apparatus
4.1
Whatman
No.
542
filter
paper
4.2
Glass
lab
trays
4.3
Powdered
Alumina
(or
Magnesia)
4.4
Distilled
water,
4
liters
4.5
Aluminum
panels,
1
5
cm
x
1
5
cm
(high
purity)
4.6
1
2
volt
DC
power
supply
4.7
Photographic
blotting
paper
4.8
One
pint
of
10%
solution
cadmium
chloride
4.9
One
pint
of
hydrochloric
acid
(1.16
to
1.8
specific
grav¬
ity)
4.10
One
pint
of
5%
solution
sodium
sulfide
4.11
Lab
press
(or
clamps)
4.12
0.8%
solution
Nioxime
(cyclohexane
1:2
dione
dioxime)
5
Procedure
Number
2.3.24
Subject
Porosity
of
Gold
Plating
Date
Revision
2/78
Originating
Task
Group
N/A
5.1.1
The
high-purity
aluminum
panels
must
at
all
times
be
free
from
grease
and
foreign
matter
likely
to
cause
inoperative
areas
on
the
cadmium
sulfide
paper.
5.1.2
In
order
to
preserve
the
active
life
of
the
cadmium
sul¬
fide
papers,
they
should
be
stored
in
a
dark,
sealed
container.
The
shelf
life
of
the
papers
is
approximately
four
to
six
weeks.
5.1.3
After
this
test,
the
contacts
must
be
cleaned
again
as
before,
rinsed
in
hot
distilled
water,
and
carefully
dried.
The
used
cadmium
sulfide
paper
must
not
be
stored
in
contact
with
the
plated
surface
of
the
board.
5.2
Gold
on
Copper
Test
Method
5.2.1
Soak
the
Whatman
542
filter
paper
for
1
0
minutes
in
a
fresh
1
0%
solution
of
cadmium
chloride
in
distilled
water
con¬
taining
0.1%
by
volume
of
hydrochloric
acid.
5.2.2
Remove
the
excess
solution
by
blotting.
5.2.3
Allow
the
paper
to
dry
partially,
then
immerse
in
a
fresh
5%
solution
of
sodium
sulfide
in
distilled
water
for
30
seconds,
after
which
time
the
paper
must
be
of
a
uniform
yel¬
low
color
(indicating
a
complete
precipitate
of
cadmium
sul¬
fide).
5.2.4
Soak
the
photographic
blotting
paper
in
distilled
water
and
dry
to
a
degree
of
dryness
that
produces
consistent,
sharply
defined
electrograms.
5.2.5
Lightly
clean
the
gold
plating
with
powdered
alumina
(or
magnesia)
and
water
to
remove
any
extraneous
surface
contamination,
then
flush
with
distilled
water
and
dry.
The
cleaned
surfaces
must
be
kept
clean
until
the
test
is
com¬
pleted.
5.2.6
Place
a
piece
of
the
cadmium
sulfide
paper
on
the
plated
sample
(which
acts
as
the
anode)
followed
by
a
piece
of
the
photographic
blotting
paper,
the
latter
being
in
contact
with
a
freshly
cleaned
high-purity
aluminum
panel
(which
acts
as
the
cathode).
5.1
Preparation
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.3.24
Porosity
of
Gold
Plating
2/78
5.2.7
Compress
the
assembly
so
that
the
pressure
between
the
cadmium
sulfide
paper
and
the
sample
is
uniform
and
between
14
kg/cm2
and
18
kg/cm2.
5.2.8
While
the
assembly
is
under
compression,
pass
a
smooth,
ripple
free
DC
source
not
exceeding
12
volts
between
the
cathode
and
anode.
5.2.9
Set
the
current
initially
at
8
mA/cm2
of
anode
area
and
energize
for
30
seconds.
5.2.10
Allow
the
electrograms
produced
on
the
cadmium
sulfide
paper
to
dry.
5.2.11
A
corresponding
brown
stain
on
the
paper
reveals
the
presence
of
any
defect
in
the
plated
coating.
5.2.12
Visually
examine
the
specimen
at
10X
magnification.
5.3
Gold
on
Nickel
Method
5.3.1
Soak
the
Whatman
542
filter
paper
for
1
0
minutes
in
a
0.8%
solution
of
nioxime
(cyclohexane
1:2
dione
dioxime)
and
distilled
water.
5.3.2
Remove
the
excess
solution
with
blotting
paper.
The
paper
must
be
hung
up
to
dry.
5.3.3
Repeat
the
steps
in
5.2,
except
moisten
the
piece
of
nioxime
paper
with
distilled
water
and
expose
the
ammonia
vapor.
5.3.4
Remove
the
excess
by
blotting.
The
“backing
pad”
of
photographic
blotting
paper
is
to
be
used
dry.
5.3.5
Expose
the
electrograms
produced
on
the
nioxime
paper
to
ammonia
vapor,
then
allow
to
dry.
5.3.6
A
corresponding
purple-red
stain
on
the
paper
reveals
the
presence
of
any
defects
in
the
gold
plating.
5.3.7
Visually
examine
the
specimens
at
10X
magnification.