IPC-TM-650 EN 2022 试验方法-- - 第269页

IPC-TM-650 Number Subject Date Revision Page 2 of 2 2.4.9.2 Bonding Process 11/98 should be maintained until the adhesive layer cools to 100℃. Allow the test sample to cool slightly before handling. The compliant materia…

100%1 / 824
Note:
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 2
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
In
order
to
assess
the
actual
performance
of
any
given
lot
of
material,
it
is
necessary
to
apply
and
thermally
bond
the
material
between
the
substrates
of
interest.
This
method
describes
the
recommended
procedure
for
both
pre¬
tacking
and
bonding
anisotropically
conductive
films
(ACF).
This
method
describes
a
fully
manual
procedure.
2
Applicable
Documents
3
Test
Specimens
3.1
Appropriate
flex
circuit
and
test
substrate(s)
4
Apparatus
4.1
"Hot-Bar”
type
soldering
station:
Unitek
PM-4
or
equivalent
4.2
Thermode:
1
.5
mm
width
minimum;
sufficient
length
to
span
bond-line
4.3
Hot-Plate:
Pace,
Inc.,
'Hot
Spot'
or
equivalent
(optional
if
hot
bar
bonder
is
used
for
tacking
or
if
adhesive
can
be
tacked
without
applied
heat)
4.4
Razor
blade
4.5
Cotton
swab
(optional;
see
4.3)
4.6
One
roll
or
sheet
of
conductive
adhesive
4.7
Appropriate
compliant
material
(as
required)
5
Procedure
5.1
Sample
Preparation
5.1.1
Allow
the
roll
of
adhesive
to
equilibrate
at
room
tem¬
perature
before
handling.
5.1.2
Cut
the
flex
circuit
sample
to
the
appropriate
length
and
width
for
the
given
performance
test.
5.1.3
Cut
an
adhesive
sample
to
match
the
width
and
length
of
the
bond
area.
Number
2.4.9.2
Subject
Bonding
Process
Date
Revision
11/98
Originating
Task
Group
SMT
Mounting
Adhesives
Task
Group
(5-24d)
5.2
Procedure
5.2.1
Position
the
adhesive
over
the
pads
on
the
flex
circuit,
liner-side
up.
5.2.2
If
the
adhesive
requires
heat
to
tack
it,
tack
the
adhe¬
sive
in
place
on
the
flex
circuit
using
the
hot
plate
and
cotton
swab
(alternatively,
the
adhesive
can
be
tacked
using
an
appropriately
low
setting
of
the
hot
bar
equipment).
The
adhe¬
sive
should
be
easily
tackable
with
a
three
to
five
second
exposure
at
1
00℃.
A
cotton
swab
should
be
used
to
apply
mild
pressure
in
order
to
facilitate
wetting.
Allow
the
flex
circuit
to
cool
before
handling
further.
5.2.3
Peel
the
release
liner
away
from
the
flex
circuit
in
order
to
expose
the
adhesive.
The
adhesive
may
need
pre-cutting
(using
a
razor
blade)
to
separate
it
from
the
liner
along
the
starting
edge.
5.2.4
Align
the
flex
circuit
to
the
test
substrate.
In
instances
requiring
extreme
accuracy
of
alignment,
it
is
helpful
to
affix
the
flex
circuit
relative
to
the
substrate
to
prevent
misregistra¬
tion
prior
to
and
during
bonding.
This
can
be
accomplished
with
custom
fixturing.
Alternatively,
a
soldering
iron
can
be
brushed
lightly
along
the
bond-line
in
order
to
tackify
the
adhesive,
thereby
temporarily
adhering
the
flex
circuit
to
the
test
substrate.
When
a
soldering
iron
is
used,
it
should
be
powered
through
a
Variac
in
order
to
provide
temperature
control.
The
temperature/time
of
the
soldering
iron
should
be
just
high
enough
to
tackify
the
adhesive
but
not
so
high
as
to
substan¬
tially
cross-link
the
adhesive
(i.e.,
100°-130℃)
and
only
a
few
seconds
exposure
to
these
temperatures.
5.2.5
Bond
the
flex
circuit
to
the
test
substrate
using
the
hot-bar
soldering
station.
Apply
a
minimum
of
20
kg
and
a
maximum
of
40kg/sq.
cm
of
total
bond-line
area
(or
as
recom¬
mended
by
the
adhesive
vendor),
then
ramp
the
temperature
to
the
set
point.
The
thermode
set
point
needs
to
be
set
to
permit
the
adhesive
layer
to
reach
1
80℃
within
1
0
seconds
(or
as
recommended
by
the
adhesive
vendor)
of
the
time
at
which
the
thermode
reaches
its
setpoint.
The
thermode
should
remain
at
the
setpoint
for
a
time
sufficient
to
cure
the
adhesive
according
to
vendor's
specification
(typically
20
sec¬
onds).
Some
vendors
may
advise
that
the
bond
pressure
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.4.9.2
Bonding
Process
11/98
should
be
maintained
until
the
adhesive
layer
cools
to
100℃.
Allow
the
test
sample
to
cool
slightly
before
handling.
The
compliant
material
(if
one
is
used)
should
be
placed
between
the
thermode
and
flex
circuit
prior
to
bonding.
Boards
Copper Foil
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 3
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
method
is
used
to
determine
the
solderability
of
copper
foil,
copper
clad
laminate,
and
printed
boards.
This
method
does
not
specifically
relate
to
the
solderability
of
the
inter¬
nal
plating
in
holes.
2
.0
Applicable
Documents
None
3
.0
Test
Specimen
Specimen
can
be
a
scrap
edge,
a
finished
product
or
a
specially
prepared
specimen
processed
with
a
group
of
production
boards,
as
mutually
determined
between
vendor
and
user.
A
representative
sample
of
copper
foil
that
is
25
mm
[1
in]
wide
and
of
sufficient
length
to
dip
approximately
50
mm
[2
in]
into
the
solder.
4
.0
Apparatus
4.1
Solder
Pot
An
electrically
heated
thermostatically
con¬
trolled
pot
of
sufficient
size
to
accommodate
the
specimen
containing
no
less
than
five
pounds
of
solder.
4.2
Dipping
Device
A
device
as
shown
in
Figure
1
shall
be
used.
A
similar
device
may
be
used
if:
1
.
the
rate
of
immersion,
dwell
time
and
rate
by
withdrawal
are
within
the
test
limits
described
in
the
procedures;
2.
the
board
and
solder
remain
perpendicular
within
five
degrees
and
3.
wobble,
vibration
and
other
extraneous
movements,
are
eliminated.
4.3
Flux
Nonactivated
rosin
flux
having
a
nominal
composi¬
tion
of
25%
by
weight
of
water
white
gum
rosin
in
a
solvent
of
isopropyl
alcohol
99%.
The
specific
gravity
of
the
flux
shall
be
0.843
±
0.005
at
25℃
(77°F),
and
free of
additional
activators.
4.4
10%
HCL
by
volume
5
.0
Procedure
5.1
Preparation
Number
2.4.12
Subject
Solderability,
Edge
Dip
Method
Date
Revision
6/91
A
Originating
Task
Group
N/A
vent
contamination
(by
grease,
perspirants,
etc.)
of
the
sur¬
face
to
be
tested.
5.1.2
Preclean
the
specimen
using
a
15
second
immersion
in
10%
HCL
(by
volume)
followed
by
water
rinsing.
The
HCL
shall
be
maintained
at
60
±
5
℃
[140
±
10°F].
Dry
the
speci¬
men
quickly
to
avoid
excess
oxidation
of
the
sample.
Use
of
an
air
blower
or
isopropyl
alcohol
to
expedite
the
drying
is
permitted.
5.1.3
Dip
the
specimen
into
the
described
flux
and
allow
to
drain
for
60
seconds
before
proceeding
with
the
solder
dip.
5.2
Test
5.2.1
Stir,
and
skim
the
surface
of
the
molten
solder
with
a
clean
stainless
steel
paddle
to
assure
that
the
solder
is
of
a
uniform
composition
and
a
temperature
of
245
±
5
℃
(473
±
9°F).
5.2.2
Immerse
the
specimen
edgewise
into
the
molten
sol¬
der.
The
insertion
and
withdrawal
rates
shall
be
1
±
0.025
inches
per
second,
with
a
dwell
time
of
4
seconds
±
0.5
sec¬
onds.
5.2.3
Upon
withdrawal,
the
solder
shall
be
allowed
to
solidify
by
air
cooling
while
the
specimen
is
in
the
vertical
position.
5.2.4
Thoroughly
remove
the
flux
and
examine.
5.3
Evaluation
5.3.1
Examine
specimen
for
a
new
uniform
adhering
coating
of
solder.
5.3.2
An
area
of
3.2mm
[0.125
in]
width,
approximately,
from
the
edge
of
the
specimen
shall
not
be
evaluated.
6
.0
Notes
6.1
As
an
aid
to
evaluation
of
the
test
results,
see
Figure
2.
This
aid
to
be
used
primarily
to
illustrate
types
of
defects
rather
than
percentage
of
area
covered.
6.2
No
quenching
or
other
means
of
accelerating
cooling
shall
be
used.
5.1.1
The
specimen
shall
be
checked
in
an
“as
received”
condition
from
the
vendor
and
care
must
be
exercised
to
pre¬