IPC-TM-650 EN 2022 试验方法-- - 第340页

1 Scope This test m ethod is used to determine the adhe- sion quality of sold er masks used on flex ible ci rcuits. 2 Applicable Documents Double-Sided Artwork 3 Test Specimen The IPC- A-42-G-KIT artw ork package provide…

100%1 / 824
5.1.2
For preproduction qualification, test specimens are to
be cleaned using cleaning methods as recommended by the
solder resist manufacturer and standard production methods
for comparison purposes prior to solder resist application.
5.1.3
Test specimens are to be coated and cured by the
standard production method.
5.1.4
Testing is to be conducted on specimens before and
after soldering in accordance with J-STD-003, Methods A, B,
C, or D with no accelerated aging.
5.2 Test
5.2.1
Press a strip of pressure sensitive tape, 50 mm
[1.97 in] minimum in length, firmly across the surface of the
test area removing all air entrapment. The time between appli-
cation and removal of tape shall be less than one minute.
Remove the tape by a rapid pull force applied approximately
perpendicular (right angle) to the test area. An unused strip of
tape must be used for each test.
5.3 Evaluation
5.3.1
Visually examine the tape and test area for evidence of
any portion of the material tested having been removed from
the specimen.
5.3.2
The report should note any evidence of material
removed by this test.
6 Notes
6.1
Figure 1 illustrates the coupon that is used for testing.
The black squares indicate metal. The white squares indicate
the base material. Solder mask is applied over the entire con-
ductor pattern.
6.2
If foreign material (oil, grease, etc.) is present on the test
surface the results may be affected.
6.3
Certification of 3M Brand 600 1/2 inch tape to CID-A-A-
113 is not required. The 3M Brand 600 1/2 inch tape is avail-
able through most office supply stores.
Number
2.4.28.1
Subject
Solder Mask Adhesion - Tape Test Method
Date
03/07
Revision
F
IPC-TM-650
Page
2
of
2
1 Scope
This test method is used to determine the adhe-
sion quality of solder masks used on flexible circuits.
2 Applicable Documents
Double-Sided Artwork
3 Test Specimen
The IPC-A-42-G-KIT artwork package
provides the electronic Gerber information necessary for the
fabrication of the IPC B-42 test board. IPC-B-42 flexible test
patterns H1, H2, and/or H3, or production test samples with
solder mask coating. Each flexible section shall be separated
and tested independently.
4 Apparatus
3.18 ± 0.1 mm [0.125 ± 0.004 in] diameter
mandrel (metal rod).
5 Procedures
5.1 Test
5.1.1
Bend the test specimen around the mandrel so that
the ends of the test specimens are on the same side of the
mandrel and nominally parallel to each other. (The test speci-
men forms a ‘‘U’’ shape around the mandrel.) Each cycle
must be at the same point on the flexible circuit.
5.1.2
Flip the test specimen so that its opposite surface is
against the metal rod and repeat 5.1.1.
5.1.3
Repeat 5.1.1 and 5.1.2 nine times (ten cycles total) for
each of the test specimens.
5.2 Evaluation
Visually examine the flexible circuit test pat-
tern with corrected 20/20 vision without magnification for sol-
der mask delamination or cracks.
1. www.ipc.org/onlinestore
3000 Lakeside Drive, Suite 309S
Bannockburn, IL 60015-1249
IPC-TM-650
TEST METHODS MANUAL
Number
2.4.29
Subject
Solder Mask - Adhesion to Flexible Circuits
Date
03/07
Revision
C
Originating Task Group
Solder Mask Performance Task Group (5-33b)
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
®
IPC-A-42-G-KIT1
Material
/n
this
Test
Methods
Manual
was
voluntarily
established
by
Technical
Committees
of
I
PC.
This
material
/s
advisory
only
and
"s
use
or
adaptation
，
s
entirely
voluntary.
IPC
disclaims
all
liability
of
any
kind
as
to
the
use,
application,
or
adaptation
of
this
material.
Users
are
also
wholly
responsible
for
protecting
themselves
against
all
claims
or
liabilities
for
patent
infringement.
Equipment
referenced
/s
for
the
convenience
of
the
user
and
does
not
imply
endorsement
by
IPC.
Page
1
of
1
Figure 1 Falling Ball Impact Test Apparatus
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
method
is
to
determine
the
impact
resis¬
tance
of
polymer
film
circuitry
when
exposed
to
a
series
of
falling
ball
impingements.
The
method
is
used
to
evaluate
the
resistance
to
chipping,
flaking,
convolution
or
other
forms
of
separation
of
the
polymer
film
from
either
the
conductor
or
base
laminate
material
surfaces.
2
Applicable
documents
None
3
Test
specimen
IPC-B-25
Multi-Purpose
Test
Board
4
Equipment/Apparatus
4.1
A
suitable
electromagnetic
apparatus
to
precisely
con¬
trol
the
height
and
the
point
of
impact
of
the
falling
ball
(see
Figure
1)
4.2
The
test
ball
shall
be
25
mm
diameter,
67
gram
preci¬
sion
steel
ball.
Number
2.4.30
Subject
Impact
Resistance,
Polymer
Film
Date
Revision
10/86
Originating
Task
Group
N/A
4.3
When
testing
flexible
circuits,
the
test
specimen
shall
be
placed
on
a
hard
smooth
surface.
Use
of
at
least
0.6
cm
cold
rolled
steel
sheet
stock.
5
Procedure
5.1
Preparation
5.1.1
Adjust
the
fall
height
by
setting
the
solenoid
core
at
53
cm
±
0.3
cm
from
the
top
surface
of
the
test
specimen.
5.2
Test
5.2.1
Place
the
steel
ball
on
the
underside
of
the
solenoid
core
with
the
solenoid
energized.
5.2.2
Place
the
test
specimen
below
the
falling
ball
in
such
a
manner
as
to
strike
the
center
of
feature
(L)
on
test
speci¬
men
IPC-B-25.
5.2.3
Release
the
falling
ball
by
de-energizing
the
solenoid
magnet.
5.2.4
It
is
necessary
to
catch
the
ball
immediately
after
impact
so
as
not
to
permit
more
than
one
blow
at
a
time.
5.2.5
Repeat
this
procedure
for
10
cycles
and
observe
the
test
specimen
after
each
blow.
5.2.6
Perform
the
same
test
(also
for
IO
cyclesjon
any
area
of
the
test
specimen
having
no
circuitry.
5.2.7
Repeat
the
same
test
in
such
a
manner
as
to
strike
the
edge
of
the
feature
(L)
10
times.
5.3
Evaluation
Visually
examine
the
test
specimen
for
chipping,
flaking,
convolution,
or
other
forms
of
separation
of
the
polymer
film.
6
Notes
6.1
The
test
apparatus
shown
in
Figure
1
can
easily
be
assembled
using
a
standard
laboratory
stand
and
clamps,
a
12
volt
DC
Solenoid,
and
a
12
Volt
battery.