IPC-TM-650 EN 2022 试验方法-- - 第353页

IPC-2-4-53-21 B A = 0 % = 1 to 25 % = 26 to 50 % = 51 to 75 % = 76 to 100 % B C D E C D E 1 A X X X X B C D E F G H J K L M N O P Q R T U V W 2 3 4 5 6 7 8 9 10 1 1 12 13 2B 4B 3D 3D 2D 3E 3B 3B 2B 2B 14 15 16 17 18 19 2…

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IPC-2-4-53-20
A
B
C
D
E
F
G
H
J
K
L
B
Number
2.4.53
Subject
Dye and Pull Test Method (Formerly Known as Dye and Pry)
Date
8/2017
Revision
Page 9 of 11
IPC-TM-650
Figure
20
Typical
Dye
and
Pull
Separation
Locations
A.
Solder
ball
B.
Metal
pad
C.
Package
substrate
D.
Board
E.
Fracture
at
package
side
intermetallic
compound
(IMC)/solder
interface
F.
Fracture
at
board
side
IMC/solder
interface
G.
Fracture
at
package
metal/IMC
interface
H.
Package
pad
lift/crater
J.
Fracture
within
bulk
solder
K.
Board
pad
lift/crater
L.
Fracture
at
board
metal/IMC
interface
IPC-2-4-53-21
B
A
= 0 %
= 1 to 25 %
= 26 to 50 %
= 51 to 75 %
= 76 to 100 %
B
C
D
E
C D E
1
A X
X X
X
B
C
D
E
F
G
H
J
K
L
M
N
O
P
Q
R
T
U
V
W
2 3 4 5 6 7 8 9 10 11 12 13
2B 4B 3D
3D
2D
3E
3B
3B
2B
2B
14 15 16 17 18 19 20
Number
2.4.53
Subject
Dye and Pull Test Method (Formerly Known as Dye and Pry)
Date
8/2017
Revision
Page 10 of 11
IPC-TM-650
―
Figure
21
Example
of
Dye
and
Pull
Location
Type
Coverage
Mapping
IPC-TM-650
J-STD-004
J-STD-006
Commercial Item Description (CID) A-A-59551
Note:
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
Page 1 of 2
r
ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
®
221
5
Sanders
Road
Northbrook,
IL
60062-6135
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
method
is
used
to
simulate
the
proce¬
dures
for
plated-th
rough
hole
(PTH)
component
removal
and
replacement,
in
order
to
determine
the
effects
of
rework
on
the
quality
and
integrity
of
the
PTH
barrel
and
conductor
foil
on
bare
rigid
or
flexible
printed
boards.
The
five
steps
are
designed
to
simulate
initial
soldering
after
a
preconditioning
bake
and
two
subsequent
replacements.
2
Applicable
Documents
Test
Methods
Manual
2.1
.1
Microsectioning
2.1
.1.2
Microsectioning
-
Semi
or
Automatic
Technique
Microsection
Equipment
Requirements
for
Soldering
Fluxes
Requirements
for
Electronic
Grade
Solder
Alloys
and
Fluxed
and
Non-Fluxed
Solid
Solders
for
Electronic
Sol¬
dering
Applications
Wire,
Elec¬
trical,
Copper
(Uninsulated)
3
Test
Specimen
3.1
The
standard
test
sample
shall
be
as
specified
in
the
governing
specification
or
standard.
In
certain
situations,
it
may
be
necessary
to
perform
this
test
on
a
production
printed
board.
In
this
case,
a
minimum
of
three
PTHs
shall
be
selected.
For
military
printed
board(s),
the
selected
holes
shall
contain
the
maximum
number
of
internal
layer
connections,
so
that
a
complete
quality
evaluation
can
be
made.
This
is
a
destructive
test.
4
Equipment/Apparatus
4.1
A
soldering
and/or
desoldering
iron
with
temperature
control
accurate
within
±
6
[1
1
°F]
of
the
preselected
idle
temperature
of
260
[500
°F],
315
[599
。日，
or
371
[700
°F]
(see
6.2).
4.2
Tin
coated
solid
copper
wire,
conforming
to
(CID)
A-A-
59551
.
4.3
Liquid
soldering
flux
conforming
to
J-STD-004,
Flux
Designator
ROL1.
Number
2.4.36
Subject
Rework
Simulation,
Plated-Th
rough
Holes
for
Leaded
Components
Date
Revision
05/04
C
Originating
Task
Group
Rework
Simulation
Task
Group,
7-1
1c
4.4
Rosin
fluxed
solder
Sn60Pb40A
or
Sn
63Pb
37A
with
Flux
Designator
ROL1
(Rosin,
Flux
activity
Type
L1)
conform¬
ing
to
J-STD-006.
4.5
Metallographic
laboratory
facilities,
conforming
with
IPC-
TM-650,
Methods
2.1.1
or
2.
1.1.
2.
4.6
Metallograph
capable
of
up
to
200X
magnification.
4.7
Forced
air
convection
oven
capable
of
maintaining
121
to
149
[250
°F
to
300
°F].
4.8
Shear
type
wire
cutters.
4.9
System
for
solder
removal
(desoldering
braid
or
vacuum
assisted
desoldering
tool).
5
Procedure
5.1
Condition
specimens
in
a
forced
air
convection
oven
at
121
to
149
[250
°F
to
300
°F]
for
a
minimum
of
six
hours
to
remove
moisture.
After
conditioning,
allow
the
speci¬
mens
to
cool
to
room
temperature.
5.2
To
aid
in
the
addition
or
removal
of
solder,
flux
may
be
applied
to
both
sides
of
the
test
specimen.
5.3
The
hand
soldering
and
desoldering
operation
of
the
wire
shall
be
performed
as
follows:
Step
1
:
Solder
wire
into
PTH
Step
2:
Remove
(desolder)
wire
from
PTH
Step
3:
Resolder
wire
into
PTH
Step
4:
Remove
(desolder)
wire
from
PTH
Step
5:
Resolder
wire
into
PTH
During
the
desolder
and
solder
steps,
solder
every
other
PTH
in
the
row
and
allow
the
specimen
to
cool
to
room
tempera¬
ture.
Then
solder
the
remaining
PTHs.
5.4
During
the
solder
and
desoldering
steps,
the
soldering
and/or
desoldering
iron
shall
have
a
tip
temperature
as
follows
(see
6.1):
Method
A:
260
[500
°F]
-
Default
method
Method
B:
315
[599
°F]
Method
C:
371
[700
°F]