IPC-TM-650 EN 2022 试验方法-- - 第375页
The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was voluntarily establis hed by T echni cal Committees of the IP…
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.4.41.3
In-Plane
Coefficient
of
Thermal
Expansion,
Organic
Films
7/95
5.11
On
some
instruments
AL
and
AT
may
be
read
directly
from
the
recorder
chart.
On
other
instruments,
constant
fac¬
tors
(from
the
instrument
calibration
-
see
section
6.3)
may
need
to
be
applied
to
the
chart
readings
to
obtain
these
val¬
ues.
6.0
Notes
6.1
Calibration
of
the
instrument
must
be
carried
out
according
to
the
manufacturer's
recommendations.
Two
cali¬
brations
are
required,
one
to
establish
the
baseline
and
the
other
to
calibrate
the
TMA
relative
to
a
standard.
6.2
A
quartz
specimen
of
11-13
mm
in
length
(between
the
grips)
is
run
at
5
℃/min
under
inert
gas
purge
(He)
from
-20
to
400℃
to
establish
a
baseline.
The
baseline
is
used
to
elimi¬
nate
the
effects
of
grip
expansion
on
extension
measure¬
ments.
The
coefficient
of
average
thermal
expansion
of
quartz
is
0.57
x
1
0-6/℃
(16-500℃)1.
This
baseline
procedure
should
be
used
to
either
correct
the
instrument
performance
to
obtain
the
literature
stated
value
of
linear
thermal
expansion
quartz,
or,
in
the
event
the
instrument
cannot
be
adjusted
to
obtain
this
value,
obtain
an
estimated
correction
factor
which
is
then
applied
to
results
from
test
specimens.
6.3
Using
a
calibration
standard
with
dimensions
equivalent
to
the
test
specimen,
a
calibration
standard
is
run
between
-10
and
200
and
the
observed
coefficient
of
thermal
expansion
is
calculated
using
the
expression:
a°b
=
(AUAT)/L
where
L
is
the
length
of
the
test
specimen
between
the
grips.
AL
is
the
change
in
the
length
of
the
specimen
(in
the
same
units)
over
the
temperature
interval
AT,
and
AT
is
nominally
200
℃
.
The
units
of
aobare
℃
-1.
An
estimated
test
specimen
correction
factor,
C,
is
then
determined
by
dividing
aob
by
the
literature
value,
必什，
for
the
standard(s).
The
estimated
test
specimen
correction
factor
is
then
as
a
multiplcation
factor
and
applied
to
the
observed
linear
thermal
expansion
results
for
the
test
specimens.
6.4
The
maximum
temperature
used
in
this
test
should
be
at
least
25℃
below
the
glass
transition
temperature
of
the
mate¬
rial
being
studied.
Heating
above
the
glass
transition
may
alter
the
morphology
of
the
specimen
(e.g.,
change
the
molecular
orientation)
leading
to
erroneous
results.
For
materials
with
glass
transitions
below
250℃,
the
temperature
range
over
which
the
coefficient
of
linear
thermal
expansion
was
deter¬
mined
must
be
noted,
e.g.,
50
x
1
0-6/℃
(0-1
50℃).
1
.
Lange's
Handbook
of
Chemistry,
12th
edition,
J.
A.
Dean,
ed.,
McGraw-Hill,
New
York
(1979).
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
test
method
defines
the
procedure
for
determining
the
Volumetric
Thermal
Expansion
of
polymer
coatings
on
inorganic
substrates,
such
as
polyimide
on
a
sili¬
con
wafer.
The
expansion
is
measured
using
an
apparatus
designed
for
the
determination
of
the
Pressure/Volume/
Temperature
behavior
of
solid
samples.
2
.0
Applicable
Documents
None
3
.0
Test
Specimens
See
Sample
Preparation
5.1
.
4
.0
Apparatus
or
Material
GNOMIX
PVT
or
equivalent
capable
of
providing
PVT
data
over
its
pressure
range
0-200
MPa
(2000
bar
or
29,000
psi),
and
from
ambient
tempera¬
tures
to
400℃.
5
.0
Procedure
5.1
Sample
Preparation
Samples
are
prepared
by
form¬
ing
a
25
mm
thick
film
on
a
wafer
and
lifting
the
specimen
free
according
to
manufacturer's
recommendations.
Sample
is
cut
and
folded
to
fit
in
the
sample
chamber
of
the
PVT
apparatus.
Number
2.4.41.4
Subject
Volumetric
Thermal
Expansion
Polymer
Coatings
on
Inorganic
Substrates
Date
Revision
7/95
Originating
Task
Group
Deposited
Dielectric
Task
Group
(C-13a)
5.2
Test
Procedure
The
film
sample
(1
to
2
grams
mass)
is
placed
in
a
rigid
stainless
steel
cell.
The
cell
is
surrounded
by
a
“sample
cup"
which
guarantees
a
hydrostatic
state
of
stress
in
the
sample
at
all
times.
Follow
the
testing
protocol
according
to
the
PVT
Operations
Manual
for
the
measurement
of
the
volumetric
expansion.
5.3
Test
Analysis
Report
the
volumetric
expansion
of
the
material
from
room
temperature
to
300℃
and
the
tempera¬
ture
of
any
observed
transitions.
6
.0
Notes
6.1
PressureA/olume/Temperature
(PVT)
Apparatus:
One
source
is
Gnomix,
3809
Birchwood
Drive
in
Boulder,
CO
(303)
444-3395.
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
procedure
establishes
the
performance
and
test
guidelines
for
the
break-off
torque
of
adhesives
used
by
placement
equipment
to
attach
surface
mounted
devices
to
printed
wiring
boards.
2
.0
Applicable
Documents
None
3
.0
Test
Specimen
•
Apply
a
1
.25
mm
[0.05
in]
diameter
circle
of
adhesive
0.1
mm
[0.004
in]
thick
to
a
FR-4
substrate.
•
Place
a
type
1
206
resistor
firmly
onto
the
circle
of
adhesive.
•
Cure
adhesive
according
to
manufacturers
directions.
4
.0
Equipment
4.1
Torque
Tester
A
Waters
Manufacturing
torque
watch
(or
equivalent)
with
a
0
to
1
40
or
0
to
280
Nmm
scale
is
to
be
used.
The
torque
gauge
must
have
a
separate
indicator
needle
to
register
maximum
torque.
4.1.1
Torque
Fixture
Use
torque
fixture
modified
per
sample
being
tested.
5
.0
Procedure
5.1
Sample
Placement
Place
the
samples
board
in
the
test
fixture.
Number
2.4.42
Subject
Torsional
Strength
of
Chip
Adhesives
Date
Revision
2/88
Originating
Task
Group
N/A
5.1.1
Zeroing
the
Gauge
Rotate
the
face
knob
of
the
tester
per
until
the
maximum
torque
indicator
needle
is
zeroed.
5.1
.2
Testing
Sample
Using
the
thumb
and
forefinger,
and
middle
finger
of
the
right
hand
slowly
rotate
the
torque
gauge
in
a
clockwise
direction
until
the
component
breaks
off.
5.1.3
Torquing
Techniques
Components
to
be
torqued
should
be
centered
inside
the
probe.
The
component
should
not
protrude
from
the
probe
when
testing
is
begun.
5.1.4
Taking
Reading
After
the
component
has
been
torqued
off,
a
reading
of
break-off
torque
shall
be
taken
from
the
face
of
the
torque
tester.
This
reading
is
shown
by
the
maximum
torque
indicator
needle.
5.1.5
Completion
of
Torquing
Repeat
until
5
components
of
the
same
type
have
been
torqued
off.
6
.0
Notes
Do
not
raise
or
lower
the
gauge
while
turning.
If
the
gauge
is
lowered
the
increased
friction
against
the
board
will
yield
inaccurate
readings.
If
the
gauge
is
lifted
it
will
lose
contact
with
the
component
and
yield
an
inaccurate
reading
as
well.