IPC-TM-650 EN 2022 试验方法-- - 第59页
The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was vol untaril y establis hed by T echni cal Committees of the …
2) Activate the etchant with a copper solid (i.e., plated
copper/copper foil). Use a cotton swab to lightly rub a
piece of copper and return swab to solution.
3) Gently swab the surface of the microsection (outcome
based control: grain structure and plating interfaces are
slightly exposed).
4) Rinse with running tap or deionized water (quality is not
defined).
5) Rinse in suitable solvent (optional).
6) Blot dry with cloth or blow dry (outcome based control:
no nonconforming scratches caused by cloth, no oil or
debris from gas source).
b) Submersion
1) Activate the etchant with a copper solid (Using appro-
priate method).
2) Submerse microsection surface in etchant.
3) Provide a means to refresh the etchant at the surface
where the reaction is taking place (nominally 3 to 5 sec-
onds, outcome based control: grain structure and plat-
ing interfaces are slightly exposed).
4) Rinse with running tap or deionized water (quality is not
defined).
5) Rinse in suitable solvent (optional).
6) Blot dry with cloth or blow dry (outcome based control:
no nonconforming scratches caused by cloth, no oil or
debris from gas source).
5.6 Evaluation
5.6.1
Refer to the appropriate printed board performance
specification for magnification and evaluation requirements of
completed microsection.
6 Notes
6.1 Overplating
Overplating the specimen per ASTM E 3
with a layer of copper or other plating with a hardness similar
to the specimen, prior to encapsulation, provides better edge
retention, thereby providing more accurate final finish thick-
ness measurements. Plating can be done electrolytically or
with electroless solutions. Thoroughly clean the specimen sur-
face prior to plating to ensure good adhesion of the plating.
Milder cleaning treatments that involve detergents, solvents,
mild alkaline, or acidic solutions are recommended. Copper
and nickel are predominantly used in metallographic laborato-
ries. It is recommended that the plating thickness be at least
5 µm [0.0002 in]. This process is optional and is not for stan-
dard evaluation purposes.
6.2 Plating Separation Evaluation
For a more accurate
evaluation of possible internal plating separations (e.g., inner
layer interconnect and via to target land separation), the fol-
lowing procedure is recommended to remove the etch demar-
cation line and return a micro-etched sample to an
as-polished condition:
1) With the wheel in a stationary position, gently and manually
regrind the specimen using copious amounts of water and
600 grit abrasive medium. Six to eight double strokes
should be sufficient. This action will remove any copper
metal smear that may have occurred over the plating sepa-
ration during rotary polishing.
2) Rinse and dry specimen and repolish per 5.4.3.1 and
5.4.3.2, then reexamine to determine if any internal plating
separation exists.
6.3 Polishing Considerations
• The use of napped cloths can result in poor edge retention
(rounding) and relief between constituents since it exacer-
bates the varying rates of material removal (i.e., tin-lead alloy
and the softer encapsulation media are removed at a faster
rate than the copper or glass fibers in the base material); the
higher the nap, the more the effect. The user needs to mini-
mize the polishing time and use ample lubricant and light
pressure during final polishing. When using diamond com-
pounds on soft woven cloths, final polishing may extend
several minutes.
• Reduced wheel speeds of 100 to 150 rpm are generally
used during final polishing due to increased drag on the
microsection.
• Typically, 6.0 µm [236 µin] followed by 1.0 µm [39.4 µin]
diamond and a 0.04 µm [1.57 µin] colloidal silica or 0.05 µm
[1.97 µin] alumina have been used successfully. However,
other variations such as 6.0 µm [236 µin], 3.0 µm [118 µin],
and 0.25 µm [9.84 µin] diamond have also been used suc-
cessfully. Some have even used 1.0 µm and 0.3 µm [39.4
µin and 11.8 µin] alumina on napless cloths followed by 0.05
µm [1.97 µin] alumina on a soft, medium napped cloth.
NOTE: Alumina and napped cloths can be used successfully,
depending upon the skill of the metallographer, but will gener-
ally result in poorer edge retention and more relief effects than
the diamond compounds (see Section 7, Reference 1).
IPC-TM-650
Number
2.1.1
Subject
Microsectioning, Manual and Semi or Automatic Method
Date
6/15
Revision
F
Page 7 of 8
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
1.1
This
method
describes
the
procedure
required
to
exam¬
ine
materials
and/or
finished
product
for
workmanship,
which
is
the
general
quality
of
the
goods
other
than
as
specified
by
the
applicable
standard.
2
.0
Applicable
Documents
3
.0
Test
Specimens
3.1
Any
piece
of
a
lot
is
subject
to
examination.
Generally,
those
specimens
prepared
for
inspection
and/or
testing
for
specific
properties
may
be
used
to
determine
workmanship.
4
.0
Apparatus
or
Material
4.1
Referee
optical
device
-
10X
magnification.
5
.0
Procedure
Number
2.1.8
Subject
Workmanship
Date
Revision
12/94
B
Originating
Task
Group
MIL-P-13949
Test
Methods
Task
Group
(7-1
1b)
5.1.1
At
any
stage
of
product
handling,
sample
preparation,
or
specimen
conditioning,
the
product
shall
be
under
scrutiny
for
detection
of
any
defects,
flaws,
or
unusual
characteristics
other
than
those
specifically
called
out
in
the
applicable
speci¬
fication,
using
unaided
or
corrected
20/20
vision.
5.1.2
In
the
case
of
a
questionable
evaluation
with
20/20
vision,
a
referee
inspection
shall
be
made
using
the
10X
mag¬
nification.
5.2
Record
and
Report
5.2.1
Each
incidence
of
suspect
flaw
or
defect
shall
be
noted
and
documented.
The
authorized
quality
function
shall
determine
whether
the
reliability,
serviceability,
or
functionality
of
the
product
may
be
affected.
5.2.2
Record
and
report
findings,
including
photographs
of
defect,
if
deemed
necessary.
5.1
Evaluation
6.0
Notes
None
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
To
visually
locate,
and
by
feel,
evaluate
surface
scratches
during
visual
inspection.
If
more
exacting
data
is
required
for
referee
evaluations
of
microsectioning
per
IPC-TM-650,
Method
2.1
.1
shall
be
used.
2
.0
Applicable
Documents
None.
3
.0
Test
Specimen
Any
qualified
submitted
sheet(s)
or
cut
to
size
panel(s)
or
periodic
quality
conformance
specimens.
4
.0
Apparatus
Dunlop
Tortex
guitar
pick
1
.00
mm
thick¬
ness
or
equivalent.
5
.0
Procedures
5.1
Test
Number
2.1.9
Subject
Surface
Scratch
Examination
Metal-Clad
Foil
Date
Revision
5/86
Originating
Task
Group
N/A
5.1.1
Locate
scratches
visually
using
normal
or
corrected
20/20
vision.
5.1.2
Scratches
which
stop
the
pick
when
light
pressure
is
applied
are
unacceptable.
Scratches
which
can
be
felt
by
the
pick
but
do
not
stop
it
are
acceptable.
5.1.3
The
referee
test
shall
be
by
microsection
per
IPC-TM-
650,
Method
2.1.1.
5.2
Evaluation
5.2.1
Evaluate
in
the
“working
area”
of
the
sheet
or
panel.
Working
area
excludes
a
1
in.
border
on
all
four
edges.
Compare
results
with
inspection
represented
in
the
appropri¬
ate
specification.