IPC-TM-650 EN 2022 试验方法-- - 第700页

IPC-TM-650 The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was vol untaril y establis hed by T echni cal Committ…

100%1 / 824
IPC-TM-650
Page 2 of 2
Number
2.6.8
Subject
Thermal
Stress,
Plated-Through
Holes
Date
05/04
Revision
E
5.7.1
After
cleaning,
microsection
the
specimen
as
defined
in
IPC-TM-650,
Method
2.1
.1
or
Method
2.1
.1
.2.
5.7.2
Examine
the
microsection
for
compliance
of
the
plated-through
holes
to
the
applicable
performance
specifica¬
tion
requirements.
Any
nonconformities
shall
be
noted.
6.
Notes
6.1
Performance
specifications
should
specify
the
test
con¬
dition
and
any
deviations
to
this
test
method.
If
no
test
condi¬
tion
is
specified,
use
Test
Condition
A.
6.2
The
test
specimen
is
not
to
be
held
against
the
surface
of
the
molten
solder.
6.3
Do
not
physically
shock
specimen
while
the
solder
in
the
plated-through
holes
is
still
liquid.
IPC-TM-650
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
To
determine
the
resistance
of
the
laminate
to
thermal
stress
in
both
the
etched
and
unetched
state.
2
.0
Applicable
Documents
Methods
2.3.6, 2.3.7,
2.3.7.
1
3
.0
Apparatus
3.1
Solder
pot
capable
of
maintaining
the
temperature
on
the
applicable
specification
sheet
for
the
material
±
2°F
and
accepting
a
2
x
2
inch
test
specimen
or
equivalent.
3.2
Dow
Corning
Fluid
#704
or
equivalent.
4
.0
Test
Specimens
4.1
One
(1)
test
specimen
2x2
inch
will
be
cut
from
each
sample
sheet
for
the
unetched
specimen.
Number
2.6.8.
1
Subject
Thermal
Stress,
Laminate
Date
Revision
9/91
—
Originating
Task
Group
N/A
4.3
The
edges
of
the
2
x
2
inch
specimen
shall
be
sanded.
5
.0
Procedure
5.1
Etch
specimen
required
for
thermal
stress
etched
according
to
IPC-TM-650,
Methods
2.3.6, 2.3.7,
or
2.
3.7.1.
5.2
Apply
silicon
fluid
to
side
of
specimen
that
will
be
in
contact
with
solder.
5.3
Float
the
specimen
on
the
solder
for
the
time
and
at
the
temperature
specified
on
the
applicable
specification
sheet
for
the
material.
5.4
The
clad
or
unclad
surface
should
show
no
evidence
of
charring,
loss
of
surface
resin,
softening
delamination,
blister¬
ing,
or
weave
exposure.
4.2
One
(1)
test
specimen
2x2
inch
from
each
sample
sheet
for
the
etched
specimen.
IPC-6012
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
Page 1 of 1
ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
®
221
5
Sanders
Road
Northbrook,
IL
60062-6135
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
describes
a
procedure
which
may
be
conducted
to
determine
if
a
printed
wiring
board
is
con¬
structed
to
withstand
the
dynamic
vibrational
stresses
that
may
be
encountered
during
field
service.
This
test
method
provides
specific
parameters
for
one
application
in
order
to
present
the
proper
procedures.
Specific
test
conditions
must
be
agreed
upon
by
the
customer
and
the
vendor.
2
Applicable
Documents
Qualification
and
Performance
Specification
for
Rigid
Printed
Boards
3
Test
Specimen
The
preproduction
or
production
printed
wiring
board.
4
Apparatus
4.1
Vibration
A
vibration
system
capable
of
producing
an
input
of
25
G's
over
a
frequency
range
from
20
Hz
to
2000
Hz
to
20
Hz
performed
in
1
6
minutes.
4.2
Mounting
Fixtures
4.3
The
test
fixture
must
be
designed
such
that
resonant
vibration
inherent
in
the
fixture
within
the
frequency
range
specified
for
the
test
shall
be
minor.
The
magnitude
of
the
applied
vibration
should
be
monitored
on
the
test
fixture
near
the
specimen
mounting
points.
Number
2.6.9
Subject
Vibration,
Rigid
Printed
Wiring
Date
Revision
05/04
B
Originating
Task
Group
Rigid
Printed
Board
Performance
Task
Group
(D-33a)
4.4
The
test
specimen
shall
be
restrained
from
movement
by
fixturing
at
all
four
edges
and
with
the
flat
surface
of
the
boards
mounted
perpendicular
to
the
axis
of
vibration.
5
Test
Procedures
5.1
The
boards
shall
successfully
pass
the
interconnection
resistance
test
in
accordance
with
I
PC-60
12
before
and
after
the
vibration
test.
5.2
The
boards
shall
be
subjected
to
both
a
cycling
and
a
resonance
dwell
test.
5.2.1
The
cycling
test
shall
consists
of
one
sweep
from
20
Hz
to
2000
Hz
to
20
Hz
performed
in
16
minutes.
The
input
acceleration
(G's)
over
the
20-2000-20
Hz
frequency
range
shall
be
maintained
at
15
G's.
5.2.2
The
boards
shall
be
subjected
to
a
30-minute
reso¬
nance
dwell
with
25
G's
input
or
a
maximum
of
100
G's
out¬
put
measured
at
the
geometric
center
of
the
board.
5.3
Evaluation
Examine
boards
for
warp
or
delamination
and
interconnection
resistance
after
exposure
to
the
vibration
test.
6
Notes
None