IPC-TM-650 EN 2022 试验方法-- - 第705页

Figure 1 IPC-TM-650 Number Subject Date Revision Page 4 of 5 2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy 1/95 INCORRECT CORRECT INCORRECT U/S = ULTRASONIC ENERGY (TRANSDUCERS)

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IPC-TM-650
Number
Subject Date
Revision
Page 3 of 5
2.6.9.1
Test
to
Determine
Sensitivity
of
Electronic
Assemblies
to
Ultrasonic
Energy
1/95
Note:
It
is
important
that
the
IPC
receives
as
much
data
as
possible,
whether
it
be
to
support
previously
submitted
data,
add
new
data,
or
provide
conflicting
data
on
cer¬
tain
components.
All
information
received
will
be
entered
into
a
database
for
all
IPC
members
to
access.
The
database
will
prove
more
useful
as
the
volume
of
data
increases.
6.0
Notes
Contact
IPC
for
a
list
of
tested
components.
6.1
References
6.1.1
William
Vuono
and
Ayche
McClung,
"An
Update
on
an
Assessment
of
Ultrasonic
Cleaning
Techniques
for
Military
Printed
Wiring
Boards,”
presented
at
IPC
Fall
Meeting,
1990.
6.1.2
B.P.
Richards,
P.
Burton
and
P.K.
Footner,
"Does
Ultrasonic
Cleaning
of
PCBs
Cause
Component
Problems:
An
Appraisal,”
IPC
Technical
Review,
June
1990.
6.1.3
B.P.
Richards,
P.
Burton
and
P.K.
Footner,
"The
Effects
of
Ultrasonic
Cleaning
on
Device
Degradation,"
Circuit
World.
Vol
16,
No.
3.
6.1.5
B.P.
Richards,
P.
Burton
and
P.K.
Footner,
'The
Effects
of
Ultrasonic
Cleaning
on
Device
Degradation
—
Quality
Crystal
Devices,”
Circuit
World.
Vol.
18,
No.
4.
6.1.6
B.P.
Richards,
P.K.
Footner,
and
P.
Burton,
“A
Study
of
the
Effect
of
Ultrasonic
Cleaning
on
Component
Quality
—
Hybrid
Devices,”
Circuit
World.
Vol
19,
No.1
.
6.1.7
Fritz
Ehorn,
"Final
Report
on
the
Structural
Dynamic
Analysis
of
Selected
PWB
Components
Under
the
400
Khz
Ultrasonic
Cleaning
Environment,"
MEL
Ref.
MS7507,
March
6,
1991.
6.1.8
William
Puskas
and
Gary
Ferrell,
“Process
Control
Ultrasonic
Cleaning,”
presented
at
Nepcon
West,
1988.
6.1.9
Kenneth
S.
Suslick,
,4The
Chemical
Effects
of
Ultra-
sound,”
Scientific
American,
February,
1989
6.1.10
Ismail
Kashkoush,
Ahmed
Busnaina,
Frederick
Kern,
Jr.
and
Robert
Kunesh,
"Particle
Removal
Using
Ultrasonic
Cleaning,”
Institute
of
Environmental
Sciences,
1
990
Proceedings.
6.1.4
B.P.
Richards,
P.
Burton
and
P.K.
Footner,
"The
Effects
of
Ultrasonic
Cleaning
on
Device
Degradation
—
An
Update,"
Circuit
World.
Vol
17,
No.
4.
Figure 1
IPC-TM-650
Number
Subject Date
Revision
Page 4 of 5
2.6.9.1
Test
to
Determine
Sensitivity
of
Electronic
Assemblies
to
Ultrasonic
Energy
1/95
INCORRECT
CORRECT
INCORRECT
U/S
=
ULTRASONIC
ENERGY
(TRANSDUCERS)
Ultrasonic Test Data Record
Name of tester Date
Company
Address
Phone Fax
Make and model of equipment
Tank size Dimensions (cm cm x cm)
Generator output power Frequency (KHz)
No. of boards tested per trial Substrate
Exposure time
Other stress testing (pre- or post-)
Describe
Component tested No. tested Passed Failed Comments
Type Mfgr Part #
Mail to: IPC Fax to: 847-509-9798
2215 Sanders Road
Northbrook, IL 60062-6135
Attn: Ultrasonic Cleaning Task Group
IPC-TM-650
Number
Subject Date
Revision
Page 5 of 5
2.6.9.1
Test
to
Determine
Sensitivity
of
Electronic
Assemblies
to
Ultrasonic
Energy
1/95