IPC-TM-650 EN 2022 试验方法-- - 第713页

1 Scope This test method is u sed t o determine the resis- tance o f the applied so lder mask to rever ting to l iquid when exposed to high humidity at a specific time and temper ature condition. This test method evaluat…

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txTran A.
3 millgrams
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.6.10
X-Ray
(Radiography),
Multilayer
Printed
Wiring
Printed
Board
Test
Methods
8/97
A
Parallax
displacement
distortion
will
be
indicated
when
round
holes
appear
oval
or
"cats
eyed"
on
the
X-ray
image.
For
a
hole
drilled
through
a
panel
of
thickness,
t,
and
offset
from
the
center
of
the
X-ray
beam
axis
by
the
angle
A,
the
parallax
dis¬
placement
between
the
top
and
bottom
of
the
hole
will
be
equal
to
5.2
Radiographic
Quality
Standard
A
radiographic
qual¬
ity
standard
such
as
an
ASTM
Image
Quality
Indicator
or
other
agreeable
indicator
shall
be
used
on
all
radiographic
studies.
5.3
Exposure
when
film
is
used
The
necessary
X-ray
penetration
exposure
will
depend
on
the
construction
of
the
multilayer,
X-ray
source
anode
voltage,
the
anode
current,
the
distance
from
the
source
to
the
film
plane
and
the
speed
or
sensitivity
of
the
film.
The
exposure
should
be
sufficient
to
produce
an
optical
density
of
at
least
2.0
at
those
portions
of
the
film
receiving
the
highest
X-ray
exposure,
such
as,
holes
or
unattenuated
areas.
In
addition
the
conditions
of
paragraph
1
.0
with
respect
to
resolution
and
gray
scale
must
be
met.
The
exposure
apparatus
for
film
can
consist
of
an
industrial
shielded
X-ray
cabinet
with
a
nominal
anode
voltage
of
80
kilovolts,
nominal
anode
current
of
and
a
focal
spot
to
film
distance
adequate
to
avoid
parallax
distortion
of
the
X-ray
film
image.
5.4
Exposure
for
realtime
systems
The
X-ray
source
operating
parameters
must
be
matched
to
the
X-ray
camera
sensitivity
of
the
system
to
produce
an
X-ray
image
of
suffi¬
cient
quality
to
comply
with
the
conditions
of
paragraph
1
.0.
6.0
Notes
None
1 Scope
This test method is used to determine the resis-
tance of the applied solder mask to reverting to liquid when
exposed to high humidity at a specific time and temperature
condition. This test method evaluates the stability of a cured
solder mask that has been applied to a printed board under
storage (nonoperating) conditions.
2 Applicable Documents
Qualification and Performance of Permanent
Solder Mask
3 Test Specimens
Three copper clad laminates, approxi-
mately 10 cm x 10 cm [3.94 in x 3.94 in], coated with solder
mask and cured according to the supplier’s recommenda-
tions.
4 Equipment
4.1 Desiccator
At least 25 cm [9.84 in] in diameter
4.2 Potassium Sulfate
Reagent grade potassium sulfate
4.3 Cotton Swabs
4.4 Oven
Capable of maintaining temperature up to 100 °C
[212 °F]
4.5 Test Chamber
Capable of maintaining a constant tem-
perature of 97 ± 2 °C [206.6 ± 3.6 °F] with 94 ± 4% relative
humidity.
4.6 High Temperature Silicone Grease
5 Procedures
5.1 Desiccator Method
5.1.1
Prepare a saturated solution of distilled or deionized
water and potassium sulfate [35 grams per 100 mL] at a tem-
perature of 97 ± 2 °C [206.6 ± 3.6 °F]. Pour the solution into
the desiccator just below the ceramic plate. Crystals of potas-
sium sulfate should remain visible in the saturated solution
during testing.
Relative humidity is not to exceed 98%.
5.1.2
Place the three test specimens on the ceramic plate in
the desiccator so that they are not touching each other.
5.1.3
Seal the desiccator with high temperature silicone
grease and close the desiccator.
5.1.4
Place the desiccator in the oven maintained at 97 ± 2
°C [206.6 ± 3.6 °F].
5.1.5
Allow the desiccator, containing the test specimens,
to remain in the oven for 28 days (672 hours).
5.2 Chamber Method
5.2.1
Place the three test specimens in a rack so they do
not touch each other and place the rack into the test cham-
ber. Close the chamber door.
5.2.2
Set the chamber’s parameters at 97 ± 2 °C [206.6 ±
3.6 °F] and 94 ± 4% relative humidity. Activate the test cham-
ber and begin testing.
5.2.3
Allow the specimens to remain in the test chamber for
28 days (672 hours).
5.3 Evaluation
5.3.1
After the required time exposure remove the test
specimens and visually examine the specimens for evidence
of reversion as indicated by softening, chalking, blisters,
cracks, tackiness, loss of adhesion or liquefaction.
5.3.2
Touch (do not wipe) the surface of the solder mask
coating with a swab of absorbent cotton and observe for par-
ticles of the cotton adhering to the coating.
Examination and testing may be done at intervals
within the required exposure time, if there is suspicion of early
failure and evaluation time is critical.
3000 Lakeside Drive, Suite 309S
Bannockburn, IL 60015-1249
IPC-TM-650
TEST METHODS MANUAL
Number
2.6.11
Subject
Solder Mask - Hydrolytic Stability
Date
03/07
Revision
D
Originating Task Group
Solder Mask Performance Task Group (5-33b)
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
®
IPC-SM-840
Note:
Note:
Material
/n
this
Test
Methods
Manual
was
voluntarily
established
by
Technical
Committees
of
I
PC.
This
material
/s
advisory
only
and
"s
use
or
adaptation
，
s
entirely
voluntary.
IPC
disclaims
all
liability
of
any
kind
as
to
the
use,
application,
or
adaptation
of
this
material.
Users
are
also
wholly
responsible
for
protecting
themselves
against
all
claims
or
liabilities
for
patent
infringement.
Equipment
referenced
/s
for
the
convenience
of
the
user
and
does
not
imply
endorsement
by
IPC.
Page
1
of
1
IPC-CC-830
FED-STD-141
Note:
75 mm
[2.95 in]
4.7 mm
[0.185 in]
38 mm
[1.50 in]
19 mm
[0.748 in]
6.30 mm [0.248 in]
2.3
0.13 mm DIA
[0.091
0.005 in DIA]
Hole 0.75
0.08 mm DIA
[0.029
0.003 in DIA]
0.75 mm [0.029 in MIN]
0.75 mm
008 mm [0.029 in 0.003 in MIN]
0.75 mm [0.029 in MIN]
3.2 mm
[0.126 in]
25
1.5 mm
[0.984
0.059 in MIN]
3.8
0.13 mm DIA
[0.150
0.005 in DIA]
HOLE 1.3
0.08 mm DIA
[0.051
0.0031 in DIA]
Figure 1 ‘‘Y’’ Shape Pattern
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
Page 1 of 2
Number
r
ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
221
5
Sanders
Road
Northbrook,
IL
60062-6135
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
method
is
to
determine
the
resistance
of
the
applied
conformal
coating
to
reverting
to
liquid
when
exposed
to
high
humidity
at
a
specific
temperature
and
time
condition
for
each
class.
This
test
method
is
to
evaluate
the
quality
of
the
coated
printed
boards
under
storage
conditions
(nonoperating).
2
Applicable
Documents
Qualification
and
Performance
of
Electrical
Insu¬
lating
Compound
for
Printed
Board
Assemblies
Method
4061
(Dry-Through
For
Varnish,
Lac¬
quers
And
Enamels)
3
Test
Specimens
Five
coated
shape
patterns
(see
Figure
1)
containing
two
resistors,
one
with
marking
ink
and
one
with
color
code
bars,
coated
with
conformal
coating
per
the
coating
supplier's
recommendations.
2.6.11.1
(Supersedes
2.6.1
1B
for
Conformal
Coating
Test)
Subject
Hydrolytic
Stability
-
Conformal
Coating
Date
07/00
Revision
Originating
Task
Group
Conformal
Coating
Task
Group
(5-33a)
4
Equipment
4.1
Desiccator
At
least
25
cm
[9.84
in]
in
diameter
4.2
Potassium
Sulfate
Reagent
grade
potassium
sulfate
4.3
Cotton
Swabs
4.4
Oven
Capable
of
maintaining
temperature
up
to
1
00℃
[212°F]-
4.5
Test
Chamber
Capable
of
maintaining
a
constant
tem¬
perature
of
85°
±
2
℃
[185°
±
3.6°F]
with
95
±
4%
relative
humidity
4.6
Soldering
Iron
If
applicable
4.7
High
Temperature
Silicone
Grease
5
.0
Procedures
5.1
Desiccator
Method
5.1.1
Prepare
a
saturated
solution
of
distilled
or
deionized
water
and
potassium
sulfate
(35
grams
per
100
cm3)
at
a
temperature
of
85°
土
2
℃
[185°
±
3.6°F].
Pour
the
solution
into
the
desiccator
just
below
the
ceramic
plate.
Crystals
of
potassium
sulfate
should
remain
visible
in
the
saturated
solu¬
tion
during
testing.
Relative
humidity
is
not
to
exceed
98%.
5.1.2
Place
four
of
the
five
test
specimens
on
the
ceramic
plate
in
the
desiccator
so
that
they
are
not
touching
each
other.
The
fifth
specimen
is
used
as
a
control.
5.1.3
Seal
the
desiccator
with
high
temperature
silicone
grease
and
close
the
desiccator.
5.1.4
Place
the
desiccator
in
the
oven
maintained
at
85°
±
2
℃
[185°
土
3.6°F].
5.1.5
Allow
the
desiccator,
containing
the
test
specimens,
to
remain
in
the
oven
for
1
20
days.