IPC-TM-650 EN 2022 试验方法-- - 第725页

IPC J-S TD-004 IPC-TM-650 IEC 6 1 189-5 Material in this T est M ethods Manual was voluntarily establis hed by T echni cal Committees of IPC. Thi s mat erial is a dvisory only and its use or adaptation is entirely volunt…

100%1 / 824
Note:
IPC-TM-650
Page 3 of 3
Number
2.6.14.1
Revision
Subject
Electrochemical
Migration
Resistance
Test
Date
09/00
dressed
from
the
bottom
to
prevent
flux
residues
from
the
wire
attachment
from
flowing
onto
the
test
patterns.
With
mechanical
fixtures,
fixtures
should
be
to
the
side.
Insert
the
limiting
resistors
in
terminating
leads
1
,
3,
and
5
of
each
pat¬
tern.
5.2.2
Place
the
rack
approximately
in
the
center
of
the
test
chamber.
Route
the
wires
to
the
outside
of
the
chamber;
dress
the
wiring
away
from
the
test
patterns.
Ensure
that
drops
of
condensation
cannot
fall
on
the
specimens.
5.2.3
Close
the
chamber
and
allow
all
samples
to
stabilize
for
96
hours
at
the
specific
temperature
and
humidity.
After
the
96-hour
stabilization
period,
the
initial
insulation
resistance
measurements
shall
be
made
using
voltage
in
the
range
of
45
VDC
to
100
VDC.
Due
to
polarity,
measurements
should
be
made
between
terminals
1
and
2,
3
and
2,
3
and
4,
and
5
and
4,
at
the
specific
temperature
and
humidity
with
the
current
limiting
resistors
placed
in
series
with
the
test
circuit.
Termi¬
nals
2
and
4
shall
be
at
one
potential,
and
terminals
1
,
3,
and
5
at
the
opposite
potential.
5.2.4
Connect
the
samples
to
the
power
supply
with
the
current
limiting
resistors
placed
in
series
with
the
test
circuit,
and
apply
1
0
VDC
for
the
duration
of
the
test.
The
test
polar¬
ity
shall
be
the
same
as
the
measurement
polarity
used
in
section
5.2.3.
5.2.5
After
500
hours
of
applied
bias
(596
hours
total),
dis¬
connect
the
power
supply
and
repeat
the
measurements
per
5.2.3
with
the
specimens
under
test
conditions.
5.3
Data
Handling
The
average
(geometric
mean)
insula¬
tion
resistance
(IRavg)
is
calculated
from:
1
N
IRavg
=
1
。
卜
斗
3
where,
N
二
number
of
test
points
(10
minimum),
IRi
=
individual
insulation
resistance
measurements
Where
an
assignable
cause
of
low
insulation
resistance,
which
is
properly
attributable
to
the
materials
of
construction
or
to
the
process
used
to
produce
the
test
board,
can
be
found,
then
such
a
value
can
be
excluded
from
calculating
the
aver¬
age.
Such
assignable
causes
include:
•
Contamination
on
the
insulating
surface
of
the
board,
such
as
debris,
solder
splints,
or
water
droplets
from
the
condi¬
tioning
chamber
•
Incompletely
etched
patterns
that
decrease
the
insulating
space
between
conductors
by
an
amount
greater
than
that
allowed
in
the
appropriate
design
requirements
drawing
•
Scratched,
cracked,
or
obviously
damaged
insulation
between
conductors
A
minimum
of
1
0
test
measurements
is
required
for
the
test
to
be
valid.
5.4
Visual
Examination
After
completion
of
the
test,
the
test
specimens
shall
be
removed
from
the
test
chamber
and
examined,
with
back-lighting,
at
10x
magnification
for
evi¬
dence
of
electrochemical
migration
(filament
growth),
discol¬
oration,
and
corrosion.
Localized
electrochemical
migration
on
one
comb
may
be
caused
by
a
testing
anomaly.
6
Notes
6.1
Reference
Documents
6.1.1
IPC-TR-476A
Electrochemical
Migration:
Electrically
Induced
Failures
in
Printed
Wiring
Assemblies
6.1.2
IPC-9201
Surface
Insulation
Resistance
Handbook
6.1.3
Telcordia
GR-78-CORE
6.2
Specification
of
Test
Conditions
Users
of
this
test
method
will
need
to
specify
one
(1)
of
the
three
(3)
temperature/humidity
conditions
called
out
in
section
4.1
.
Note
that
IPC-TR-476A
recommends
using
65℃,
85%
RH.
IPC J-STD-004
IPC-TM-650
IEC 61189-5
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
Page 1 of 3
r
ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
®
221
5
Sanders
Road
Northbrook,
IL
60062-6135
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
method
is
designed
to
determine
the
corrosive
properties
of
flux
residues
under
extreme
environ¬
mental
conditions.
A
pellet
of
solder
is
melted
in
contact
with
the
test
flux
on
a
sheet
metal
test
piece.
The
solder
is
then
exposed
to
prescribed
conditions
of
humidity
and
the
result¬
ing
corrosion,
if
any,
is
assessed
visually.
2
Applicable
Documents
Requirements
for
Soldering
Fluxes
Test
Methods
Manual
2
.3.34
Solids
Content,
Flux
for
Fluxes
for
Soft
Soldering
Test
Methods
for
Electrical
Materials,
Intercon¬
nection
Structures
and
Assemblies
-
Part
5:
Test
Methods
for
Printed
Board
Assemblies
3
Test
Specimen
At
least
0.035
g
of
flux
solids,
0.3
g
sol¬
der
paste,
1
g
wire,
or
1
g
preform
with
an
equivalent
amount
of
solids.
Flux
solids
are
defined
as
the
residue
described
in
IPC-TM-650,
Test
Method
2.3.34,
Solids
Content,
Fluxes.
All
solvent
must
have
been
evaporated
from
the
specimen
in
a
chemical
fume
hood.
4
Apparatus
and
Reagents
4.1
Apparatus
4.1.1
Solder
pot.
4.1.2
Humidity
chamber
capable
of
achieving
40
±
3
[104
土
5.4
°F]
and
93
土
5%
relative
humidity.
4.1.3
Air
circulating
drying
oven.
4.1.4
Microscope
having
20X
minimum.
4.1.5
Analytical
balance
capable
of
weighing
0.001
g.
4.1.6
Three
50
mm
x
50
mm
x
0.5
mm
[1
.969
in
x
1
.969
in
x
0.00197
in]
99%
pure
copper
sheets.
4.1.7
19
mm
[0.748
in]
steel
ball
(approximate).
4.1.8
Laboratory
press.
Number
2.6.15
Subject
Corrosion,
Flux
Date
Revision
06/04
C
Originating
Task
Group
Flux
Specifications
Task
Group,
(5-24a)
4.1.9
Tongs.
4.2
Reagents
All
chemicals
must
be
reagent
grade
and
water
must
be
deionized
(2
megohm-cm
minimum
resistivity
recommended).
4,2,1
Ammonium
persulphate.
4.2.2
Sulfuric
acid,
relative
density
1
.84.
4.2.3
Degreasing
agent:
acetone,
or
petroleum
ether.
5
Procedures
5.1
Chemicals
5.1.1
Ammonium
persulphate
(25%
m/v
in
0.5%
v/v
sulfuric
acid).
Dissolve
250
g
of
ammonium
persulphate
in
water
and
add
cautiously
5
ml
of
5%
sulfuric
acid
(relative
density
1
.84).
Mix,
cool,
dilute
to
1
liter
and
mix.
This
solution
should
be
freshly
prepared.
5.1.2
Sulfuric
acid
(5%
v/v).
To
400
ml
of
water
cautiously
add
50
ml
of
sulfuric
acid
(relative
density
1
.84).
Mix,
cool,
dilute
to
1
liter
and
mix.
5.2
Test
Panel
5.2.1
Form
a
3.0
mm
[0.018
in]
(approximate)
deep
circular
depression
in
the
center
of
the
copper
test
panel
by
forcing
a
19.0
mm
[0.018
in]
steel
ball
into
a
25
(approximate)
mm
hole
to
form
a
cup.
5.2.2
Bend
one
corner
of
the
test
panel
up
to
facilitate
sub¬
sequent
handling
with
tongs.
5.3
Test
Panel
Pretreatment
5.3.1
Immediately
before
performing
test,
pretreat
as
follows
using
clean
tongs
for
handling.
5.3.2
Degrease
with
a
suitable
neutral
organic
solvent
such
as
acetone,
or
petroleum
ether.
Note:
IPC-TM-650
Page 2 of 3
Number
2.6.15
Subject
Corrosion,
Flux
Date
06/04
Revision
C
5.3.3
Immerse
in
5%
sulfuric
acid
(by
volume)
at
65
±
5
[149
±
9
°F]
for
one
minute
to
remove
the
tarnish
film.
5.3.4
Immerse
in
a
solution
of
25%
m/v
ammonium
persul¬
phate
(in
0.5%
v/v
sulfuric
acid)
at
23
±
2
[73.4
土
3.6
°F]
for
one
minute
to
etch
the
surface
uniformly.
5.3.5
Wash
in
running
tap
water
for
five
seconds.
Immerse
in
5%
sulfuric
acid
(by
volume)
at
23
土
2
℃
[73.4
土
3.6
°F]
for
one
minute.
5.3.6
Wash
for
five
seconds
in
running
tap
water,
then
rinse
thoroughly
in
deionized
water.
5.3.7
Rinse
with
acetone.
5.3.8
Allow
to
dry
in
clean
air.
Use
the
test
piece
as
soon
as
possible
or
store
up
to
one
hour
in
a
closed
container.
5.4
Solder
for
Liquid
or
Paste
Flux
Test
5.4.1
Weigh
a
1
.00
±
0.05
gram
specimen
of
solid
solder.
5.4.2
Degrease
the
solder
specimen
with
a
suitable
neutral
organic
solvent
such
as
acetone,
or
petroleum
ether.
5.4.3
Solder
may
be
in
the
form
of
pellets
or
tight
spirals
of
solid
solder
wire.
5.5
Test
5.5.1
Heat
solder
pot
so
that
solder
bath
stabilizes
at
235
±
5
[455
±
9
°F]-
5.5.2
Liquid
or
Paste
Flux
5.5.2.1
Place
0.035
g
of
flux
solids
into
the
depression
in
the
test
panel.
Add
the
solid
solder
pellets
or
spirals.
5.5.2.2
Using
tongs,
lower
the
test
panel
onto
the
surface
of
the
molten
solder.
5.5.2.3
Allow
the
test
panel
to
remain
in
contact
with
the
bath
until
the
solder
specimen
in
the
depression
of
the
test
panel
melts.
Maintain
this
position
for
5
±
1
seconds
before
removing
the
test
panel
from
the
bath.
Cool
the
test
panel
to
room
temperature.
5.5.3
Cored
Wire
or
Cored
Preform
5.5.3.
1
Place
1
gram
of
flux
cored
wire
or
perform
into
the
depression
in
the
test
panel.
5.5.3.2
Using
tongs,
lower
the
test
panel
onto
the
surface
of
the
molten
solder.
5.5.3.3
Allow
the
test
panel
to
remain
in
contact
with
the
bath
until
the
solder
specimen
in
the
depression
of
the
test
panel
melts.
Maintain
this
position
for
5
±
1
seconds
before
removing
the
test
panel
from
the
bath.
Cool
the
test
panel
to
room
temperature.
5.5.4
Solder
Paste
5.5.4.
1
Place
0.3
g
of
solder
paste
into
the
depression
in
the
test
panel.
5.5.4.2
Allow
the
test
panels
to
remain
in
contact
with
the
bath
until
the
solder
specimen
in
the
depression
of
the
test
panel
melts.
Maintain
this
position
for
60
±
5
seconds
before
removing
the
test
panel
from
the
bath.
Cool
the
test
panel
to
room
temperature.
5.5.4.3
Alternately,
process
the
panels
through
a
reflow
sol¬
dering
process
using
the
temperature
profile
recommended
by
the
vendor.
5.6
Humidity
Exposure
5.6.1
Carefully
examine
the
test
specimen
at
20X
magnifica¬
tion
for
subsequent
comparison
after
humidity
exposure.
Record
observations,
especially
any
discoloration
(see
8.2).
5.6.2
Preheat
test
panel
to
40
±
1
[104
±
1
.8
°F]
for
30
土
2
minutes.
5.6.3
Humidity
Soak
5.6.3.1
Place
the
test
specimen
vertically
in
a
preset
humid¬
ity
chamber
at
40
±
1
[104
±
1.8
°F]
and
93
土
2%
relative
humidity.
5.6.3.2
Alternately,
the
specimen
may
be
placed
in
a
tem¬
perature
humidity
chamber
and
heated
to
40
[1
.8
°F]
and