IPC-TM-650 EN 2022 试验方法-- - 第727页
minor major IPC-TM-650 Page 3 of 3 Number 2.6.15 Subject Corrosion, Flux Date 06/04 Revision C held for 30 minutes. The humidity should then be increased to 93%RH. 5.6.3.3 Expose specimen to the above environment for 240…
Note:
IPC-TM-650
Page 2 of 3
Number
2.6.15
Subject
Corrosion,
Flux
Date
06/04
Revision
C
5.3.3
Immerse
in
5%
sulfuric
acid
(by
volume)
at
65
±
5
[149
±
9
°F]
for
one
minute
to
remove
the
tarnish
film.
5.3.4
Immerse
in
a
solution
of
25%
m/v
ammonium
persul¬
phate
(in
0.5%
v/v
sulfuric
acid)
at
23
±
2
[73.4
土
3.6
°F]
for
one
minute
to
etch
the
surface
uniformly.
5.3.5
Wash
in
running
tap
water
for
five
seconds.
Immerse
in
5%
sulfuric
acid
(by
volume)
at
23
土
2
℃
[73.4
土
3.6
°F]
for
one
minute.
5.3.6
Wash
for
five
seconds
in
running
tap
water,
then
rinse
thoroughly
in
deionized
water.
5.3.7
Rinse
with
acetone.
5.3.8
Allow
to
dry
in
clean
air.
Use
the
test
piece
as
soon
as
possible
or
store
up
to
one
hour
in
a
closed
container.
5.4
Solder
for
Liquid
or
Paste
Flux
Test
5.4.1
Weigh
a
1
.00
±
0.05
gram
specimen
of
solid
solder.
5.4.2
Degrease
the
solder
specimen
with
a
suitable
neutral
organic
solvent
such
as
acetone,
or
petroleum
ether.
5.4.3
Solder
may
be
in
the
form
of
pellets
or
tight
spirals
of
solid
solder
wire.
5.5
Test
5.5.1
Heat
solder
pot
so
that
solder
bath
stabilizes
at
235
±
5
[455
±
9
°F]-
5.5.2
Liquid
or
Paste
Flux
5.5.2.1
Place
0.035
g
of
flux
solids
into
the
depression
in
the
test
panel.
Add
the
solid
solder
pellets
or
spirals.
5.5.2.2
Using
tongs,
lower
the
test
panel
onto
the
surface
of
the
molten
solder.
5.5.2.3
Allow
the
test
panel
to
remain
in
contact
with
the
bath
until
the
solder
specimen
in
the
depression
of
the
test
panel
melts.
Maintain
this
position
for
5
±
1
seconds
before
removing
the
test
panel
from
the
bath.
Cool
the
test
panel
to
room
temperature.
5.5.3
Cored
Wire
or
Cored
Preform
5.5.3.
1
Place
1
gram
of
flux
cored
wire
or
perform
into
the
depression
in
the
test
panel.
5.5.3.2
Using
tongs,
lower
the
test
panel
onto
the
surface
of
the
molten
solder.
5.5.3.3
Allow
the
test
panel
to
remain
in
contact
with
the
bath
until
the
solder
specimen
in
the
depression
of
the
test
panel
melts.
Maintain
this
position
for
5
±
1
seconds
before
removing
the
test
panel
from
the
bath.
Cool
the
test
panel
to
room
temperature.
5.5.4
Solder
Paste
5.5.4.
1
Place
0.3
g
of
solder
paste
into
the
depression
in
the
test
panel.
5.5.4.2
Allow
the
test
panels
to
remain
in
contact
with
the
bath
until
the
solder
specimen
in
the
depression
of
the
test
panel
melts.
Maintain
this
position
for
60
±
5
seconds
before
removing
the
test
panel
from
the
bath.
Cool
the
test
panel
to
room
temperature.
5.5.4.3
Alternately,
process
the
panels
through
a
reflow
sol¬
dering
process
using
the
temperature
profile
recommended
by
the
vendor.
5.6
Humidity
Exposure
5.6.1
Carefully
examine
the
test
specimen
at
20X
magnifica¬
tion
for
subsequent
comparison
after
humidity
exposure.
Record
observations,
especially
any
discoloration
(see
8.2).
5.6.2
Preheat
test
panel
to
40
±
1
[104
±
1
.8
°F]
for
30
土
2
minutes.
5.6.3
Humidity
Soak
5.6.3.1
Place
the
test
specimen
vertically
in
a
preset
humid¬
ity
chamber
at
40
±
1
[104
±
1.8
°F]
and
93
土
2%
relative
humidity.
5.6.3.2
Alternately,
the
specimen
may
be
placed
in
a
tem¬
perature
humidity
chamber
and
heated
to
40
[1
.8
°F]
and
minor
major
IPC-TM-650
Page 3 of 3
Number
2.6.15
Subject
Corrosion,
Flux
Date
06/04
Revision
C
held
for
30
minutes.
The
humidity
should
then
be
increased
to
93%RH.
5.6.3.3
Expose
specimen
to
the
above
environment
for
240
hours
(10
days).
M
and
H
fluxes
may
be
tested
in
the
cleaned,
as
well
as
uncleaned,
condition.
Specimens
shall
be
cleaned
per
the
manufacturers
instructions.
5.7
Evaluation
5.7.1
After
the
exposure
period,
remove
test
specimens
from
humidity
chamber,
examine
at
20X
magnification
and
compare
with
observations
noted
in
6.5
(see
8.2).
5.7.2
For
purposes
of
this
test
method,
the
following
defini¬
tion
of
corrosion
shall
prevail:
"A
chemical
reaction
between
the
copper,
the
solder,
and
the
constituents
of
the
flux
resi¬
dues,
which
occurs
after
soldering
and
during
exposure
to
the
above
environmental
conditions.*
*
Corrosion
for
this
test
is
classified
as
follows:
5.7.2.1
Minor
Corrosion
Any
initial
change
of
color,
which
may
develop
when
the
test
panel
is
heated
during
soldering,
is
disregarded.
Discrete
white
or
colored
spots
in
the
flux
resi¬
dues
or
a
color
change
to
green-blue
without
pitting
of
the
copper
or
formation
of
excrescences
is
regarded
as
corrosion.
5.7.2.2
Major
Corrosion
Any
initial
change
of
color
which
may
develop
when
the
test
panel
is
heated
during
soldering
is
disregarded.
Subsequent
development
of
green-blue
discol¬
oration
with
observation
of
pitting
of
the
copper
panel
or
excrescences
at
the
interfaces
of
the
flux
residue
and
copper
boundary,
is
regarded
as
corrosion.
6
Notes
6・1
Questionable
results
may
be
confirmed
by
analyzing
the
suspected
corrosion
via
Energy
Dispersive
X-ray
Spectros¬
copy
(EDS)
for
the
presence
of
copper.
6.2
Color
photos
before
and
after
the
test
are
valuable
tools
in
identifying
and
documenting
corrosion.
6.3
Safety
Observe
all
appropriate
precautions
on
MSDS
for
chemicals
involved
in
this
test
method.
IPC-A-600
IPC-MI-660
Note:
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
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Page 1 of 3
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
procedure
is
a
rapid
means
for
evaluating
glass
epoxy
laminate
integrity
on
different
lots
of
base
lami¬
nate
materials
before
placing
materials
on
the
production
floor,
and
thereby
reducing
the
cost
of
processing
material
which
may
later
prove
to
be
defective.
2
.0
Applicable
Documents
Acceptability
of
Printed
Boards
Guidelines
for
Incoming
Inspection
of
Raw
Mate¬
rials
3
.0
Specimens
The
samples
of
qualification
or
incoming
production
test
coupons
shall
be
4.0
inch
x
4.0
inch
x
1/16
inch
thick
(see
7.1)
and
etched
using
the
standard
commer¬
cial
practices
procedure
of
the
individual
test
facility.
The
test
coupons
can
be
taken
from
any
part
of
the
laminate.
The
test
strip
may
be
sheared,
but
the
individual
test
coupons
shall
be
sawed
and
their
edges
sanded.
4
.0
Number
of
Test
Coupons
to
be
Tested
Five
coupons
shall
be
tested
and
may
arbitrarily
contain
a
known
“pass”
and
"fail''
control
coupon.
However,
if
a
failure
mode
is
estab¬
lished,
a
second
set
of
5
samples
shall
be
tested
from
another
laminate
and
this
set
must
contain
a
pass
and
fail
control.
The
number
of
test
coupons
tested
at
any
one
time
should
be
lim¬
ited
to
the
capacity
of
the
pressure
vessel
being
used.
5
.0
Apparatus
5.1
Any
standard
laboratory
autoclave
pressure
vessel
hav¬
ing
a
6-quart
capacity.
A
commercial
household
6-quart
stain¬
less
steel
pressure
cooker
capable
of
developing
1
5
psi
pres¬
sure
(the
1
5
psi
pressure
set
at
the
location
of
the
test)
may
be
used
if
equipped
with
a
properly
calibrated
pressure
gauge
to
maintain
15
psi
±
0.5
psi
pressure.
5.2
A
laboratory
solder
pot
capable
of
maintaining
a
solder
bath
(SN
60)
at
500°F
-0°
+
10°F.
5.3
Stop
watch.
5.4
Solder
pot
containing
SN
60/40
solder.
6
.0
Test
Number
2.6.16
Subject
Pressure
Vessel
Method
for
Glass
Epoxy
Laminate
Integrity
Date
Revision
7/85
Originating
Task
Group
N/A
6.1
Preparation
6.1.1
Cut
test
coupons
only
by
sawing,
and
sand
the
edges
of
the
specimens
so
they
are
smooth.
6.1.2
Etch
specimens
to
remove
metal
foil
except
in
any
areas
which
may
have
identification
codes.
6.1.3
Apply
permanent
identification
markings
on
speci¬
mens
on
the
end
that
will
not
be
immersed
in
the
solder
pot.
6.1.4
The
specimens
will
be
placed
in
a
suitable
rack
for
suspending
in
the
pressure
vessel.
The
specimens
should
not
be
drilled
for
suspension
as
this
creates
a
path
for
moisture
incursion,
giving
false
results.
6.1.5
Pour
water
into
pressure
vessel
to
approximately
1
.0
inch
depth.
Cover
and
bring
to
a
boil
without
pressurizing.
6.2
Test
6.2.1
When
steam
is
observed
at
the
vent,
uncover
and
suspend
specimens
vertically
over
boiling
water,
being
careful
not
to
allow
specimens
to
touch
each
other
or
the
walls
of
the
pressure
vessel.
This
step
must
be
done
rapidly
to
avoid
undue
cooling
of
the
water
and
pressure
vessel.
6.2.2
The
heat-up
time
should
be
controlled
at
7
minutes
±
1
minute.
6.2.3
After
reaching
15
psi.
maintain
this
condition
for
30
minutes
+
2-0
minutes.
Other
pressure
vessel
dwell
times
may
be
agreed
upon
between
user
and
vendor.
6.2.4
At
the
end
of
the
exposure
time,
cool
and
vent
the
pressure
vessel
as
recommended
by
the
manufacturer.
6.2.5
Carefully
remove
the
hot
specimens
from
the
pressure
vessel
and
blot
dry
with
paper
towel
(see
caution
notes).
6.2.6
The
specimens
shall
be
maintained
at
ambient
tem¬
perature,
and
within
10
minutes
it
shall
be
immersed
vertically
(with
the
edge
parallel
to
the
solder
surface)
into
the
solder
bath
which
is
maintained
at
either
500°F
-0
+
10°F
for
20