IPC-TM-650 EN 2022 试验方法-- - 第798页
Figure 2 Suggested Dipping Device for Sol dera bility T est IPC-TM-650 Page 2 of 2 Number 3.10 Subject Solderability, Connectors Date 7/75 Revision A 5.3 The solder bath shall be occasionally stirred with a clean stainle…
NOTE:
Table I Test Temperatures
Condition Temperature
Figure 1 Wire Hole Termination
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 2
ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
221
5
Sanders
Road
Northbrook,
IL
60062-61
35
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
1.1
To
determine
the
solderability
of
electrical
contacts
intended
for
such
termination.
2
.0
Reference
Documents
2.1
Information
in
this
section
is
intended
to
parallel
the
test
method
described
in
EIA-RS-1
78A.
2.2
QQ-S-571
Solder;
Lead
Alloy,
Tin
Alloy,
Tin-Lead
Alloy;
Flux
Cored
Ribbon
and
Wire,
and
Solid
Form.
2.3
LLL-R-626
Rosin,
Gum;
Rosin,
Wood;
Rosin,
Tall
Oil.
3
.0
Test
Specimen
3.1
The
contacts
of
a
connector
or
individual
contacts.
For
wire-hole
contacts,
it
is
desirable
that
a
short
length
of
solid
copper
wire
of
appropriate
size
be
affixed
as
shown
in
Figure
1
.
3.2
Unless
otherwise
specified
in
the
individual
contact
or
connector
specification,
the
test
samples
shall
not
be
cleaned
by
any
means
prior
to
the
test.
Care
shall
be
exercised
to
avoid
contamination
(grease,
perspirants,
etc.)
of
the
surface
to
be
tested.
4
.0
Apparatus
and
Materials
4.1
Solder
pot,
having
a
minimum
capacity
of
2
pounds,
electrically
heated,
and
thermostatically
controlled
to
provide
and
maintain
the
solder
temperatures
required.
4.2
A
temperature
measuring
device
of
suitable
range
for
the
specified
test
condition
and
an
appropriate
stainless
steel
jacketed
thermocouple.
4.3
Dipping
device
similar
to
that
shown
in
Figure
2.
4.4
Solder
(Sn
60)
conforming
to
Federal
Specification
QQ-S-571.
Number
3.10
Subject
Solderability,
Connectors
Date
Revision
7/75
A
Originating
Task
Group
N/A
r
r
1
IPC-3-10-1
4.5
Flux
of
non-corrosive
type,
composed
of
25
percent
(by
weight)
rosin
and
75
percent
(by
weight)
alcohol.
The
rosin
shall
be
Class
A,
Type
1
,
Grade
WW
in
accordance
with
Fed¬
eral
Specification
LLL-R-626.
The
alcohol
shall
be
99
percent
isopropyl
alcohol.
The
flux
shall
be
free
of
additional
activators.
5
.0
Procedure
5.1
The
solder
pot
temperature
shall
be
adjusted
to,
and
maintained
at,
the
specified
test
temperature
shown
in
Table
1
for
a
minimum
period
of
2
hours
prior
to
test.
1
232
±
5
℃
2
271
±
5
℃
5.2
The
portion
of
the
contact
to
be
soldered
shall
be
immersed
in
flux
for
a
minimum
period
of
5
seconds
and
then
allowed
to
drain
for
a
minimum
period
of
60
seconds
prior
to
test.
Figure 2 Suggested Dipping Device for Solderability Test
IPC-TM-650
Page 2 of 2
Number
3.10
Subject
Solderability,
Connectors
Date
7/75
Revision
A
5.3
The
solder
bath
shall
be
occasionally
stirred
with
a
clean
stainless
steel
paddle
to
ensure
that
it
is
of
uniform
composi¬
tion
and
temperature
throughout.
The
surface
of
the
bath
shall
be
skimmed
immediately
prior
to
each
test
to
remove
any
dross
or
residual
unburned
flux
from
previous
tests.
5.4
The
sample
shall
be
affixed
to
the
dipping
device
shown
in
Figure
2
and
oriented
so
that
the
contact
termination
will
enter
the
solder
bath
to
the
specified
depth.
5.5
The
sample
shall
be
immersed
in
the
solder
bath
at
a
rate
of
1
.00
±
0.25
inches
per
second
and
withdrawn
at
the
same
rate.
The
dwell
time
in
the
solder
shall
be
5.0
±
0.5
sec¬
onds.
5.6
The
sample
shall
not
be
removed
from
the
dipping
device
or
otherwise
disturbed
until
the
solder
has
solidified.
5.7
The
sample
shall
be
thoroughly
cleaned
of
residual
flux
and
examined
under
10X
magnification
for
evidence
of
the
following:
A.
Dewetting
of
areas
to
be
soldered.
B.
Pinholes
or
voids
in
the
solder
coat.
C.
Incomplete
fill
of
solder
well
or
hole.
6.0
Notes
6.1
Acceptance
criteria
shall
be
established
in
terms
of
one,
or
any
combination,
of
the
following:
A.
Less
than
95%
coverage
of
flat
surfaces.
B.
Pinholes
or
small
voids
or
solder
surface
roughness
con¬
centrated
in
any
one
area
of
the
contact.
C.
Poor
filleting
around
wire
or
incomplete
fill
of
solder
well.
Table 1 Thermal Shock Test Conditions (One Cycle)
Step Temperature, °C Time
WARNING:
Notes
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 2
r
ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
2215
Sanders
Road
Northbrook,
IL
60062-6135
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
1.1
To
determine
the
effects
of
exposing
connectors
to
extremes
of
high
and
low
temperature
and
of
the
mechanical
stresses
created
by
rapid
transition
between
the
temperature
extremes.
2
.0
Reference
Documents
2.1
Information
in
this
section
is
intended
to
parallel
the
test
method
described
in
El
A-RS-364/TP-32
.
3
.0
Test
Specimen
3.1
A
connector
(plug
and
receptacle)
complete
with
all
applicable
guide,
keying
and
engaging
hardware
or
a
card¬
edge
receptacle.
3.2
The
plug
and
receptacle
shall
be
tested
in
a
configura¬
tion
normal
to
its
functional
capacity
including
mounting,
ter¬
mination,
and
mating.
3.3
The
plug
and
receptacle
or
the
card-edge
receptacle
and
a
nominal
thickness
printed
circuit
board
shall
be
mated
during
this
test,
except
as
otherwise
specified.
4
.0
Apparatus
4.1
A
dual
chamber
(or
two
separate
chambers)
capable
of
maintaining
the
applicable
temperature
within
±
2
℃
at
the
geometric
center
under
no
load
conditions,
and
a
thermal
dis¬
tribution
not
greater
than
±
5
℃
of
the
temperature
at
the
geometrical
center.
5
.0
Procedure
5.1
The
chamber(s)
shall
be
adjusted
to,
and
maintained
at,
the
high
and
low
extremes
specified
in
the
individual
connec¬
tor
specification.
Thermal
equilibrium
shall
be
attained
prior
to
the
start
of
the
test.
(See
6.3)
5.2
The
mated
test
specimen
shall
be
suspended
within
the
low
temperature
chamber
and
subjected
to
the
number
of
Number
3.11
Subject
Thermal
Shock,
Connectors
Date
Revision
7/75
A
Originating
Task
Group
N/A
continuous
thermal
shock
cycles
specified
in
the
individual
connector
specification.
One
complete
cycle
of
thermal
shock
is
defined
by
Table
1
.
(See
6.4)
1
Low
extreme
(+0,
-5℃)
30
min.
(min.)
2
25℃
(+10,
-5℃)
2
min.
(max.)
3
High
extreme
(+5,
-0℃)
30
Min.
(min.)
4
25℃
(+10,
-5℃)
2
min.
(max.)
BOTH
THE
HIGH
AND
LOW
TEMPERATURE
EXTREMES
USED
DURING
THIS
TEST
WILL
CAUSE
SEVERE
BURNS.
USE
INSULATED
GLOVES
WHEN
HAN¬
DLING
THE
TEST
SPECIMEN.
5.3
After
completion
of
the
specified
number
of
cycles
and
attaining
room
ambient
temperature,
the
sample
shall
be
visu¬
ally
examined
for
evidence
of
the
following:
A.
Excessive
permanent
dimensional
changes
(distortion).
B.
Cracking
or
delamination
of
finishes
or
dielectric
materials.
C.
Opening
of
seals
or
seams.
D.
Hardening
or
softening
of
dielectric
materials.
5.4
Unless
otherwise
specified
in
the
individual
connector
specification,
the
test
specimen
shall
be
subjected
to
the
with¬
standing
voltage
test,
(3.13).
6.0
6.1
Acceptance
criteria
shall
be
established
in
terms
of
one,
or
any
combination,
of
the
following:
A.
Visible
evidence
of
damage
or
significant
material
change.
B.
A
deterioration
in
withstanding
voltage
occasioned
by
internal
fissures
in
the
dielectric
with
or
without
the
accompanying
entrapment,
of
moisture.
6.2
The
test
chambers
shall
be
of
the
forced
(circulating)
air
type
to
insure
even
temperature
distribution.