三星贴片机说明书.pdf - 第38页
Samsung C omponent Placer SM42 1 Intr oductio n 1-6 1.2.4. PC B Nozzle 1.2.4.1. : 1608 chip IPC 1.2.4.1.1. …
1-5
1.2.3.
1-4.
Specification (XY: mm, θ: °)
Chip 0402 XY : ±0.05 , : ±5.0 , Cp≥1.0FOV16mm (Flying)
Chip 0603 XY : ±0.08 , : ±5.0 , Cp≥1.0FOV25mm (Flying)
Chip 1005 XY : ±0.10 , : ±5.0 , Cp≥1.0
FOV25mm (Flying)
QFP100 0.5 P
XY : ±0.06 , : ±0.25 , Cp≥
1.0
FOV 35, 45mm (Stage)
QFP168 0.3 P XY : ±0.03 , : ±0.2 , Cp≥1.0FOV 35mm (Stage)
QFP256 0.4 P XY : ±0.05 , : ±0.1 , Cp≥1.0FOV 35, 45mm (Stage)
FOV 35mm (Stage)
MFOV
QFP304 0.5 P
XY : ±0.06 , : ±0.1 , Cp≥1.0
FOV 45mm (Stage)
FOV25mm (Flying)
BGA256 1.0 P
XY : ±0.10 , : ±0.4 , Cp≥1.0
FOV 35, 45mm (Stage)
BGA 12mm 0.5 P XY : ±0.06 , : ±0.3 , Cp≥1.0FOV 35, 45mm (Stage)
FOV25mm (Flying)
BGA 17mm 0.75 P XY : ±0.10 , : ±0.4 , Cp≥1.0
FOV 35, 45mm (Stage)
FOV 35mm (Stage)
MFOV
BGA 52mm 1.27 P XY : ±0.10 , : ±0.3 , Cp≥1.0
FOV 45mm (Stage)
Connector 75mm 1.27 P
XY : ±0.18 , : ±0.25 , Cp≥
1.0
FOV 45mm (Stage)
MFOV
R
Samsung Component Placer SM421 Introduction
1-6
1.2.4.
PCB
Nozzle
1.2.4.1.
: 1608 chip
IPC
1.2.4.1.1.
1-5.
SM421
Chip 21,000 CPH (1608)
15,000 CPH (SOP16)
IPC(Pick Up)
5,500 CPH (QFP100)
IC
5,500 CPH (BGA256)
IPC(Pick Up)
(1 msec ).
PCB
C/S Center( - STS)
2-1
2.
2.1.
2.1.1.
: 1,650 mm
: 1,680 mm
(PCB 900mm)
Cover: 1,530 mm
Signal Light : 2,090 mm
: 1,800 kg
: 1,650 mm
: 1,680 mm
Signal Light :
2,090 mm
Cover:
1,530 mm