MIRTEC_MS-11e_3D_SPI_Series_Data_Sheet-REV11.pdf
Exc lu si ve1 5MP / 25 MP Co aXP res s Ca me ra Sys te m Dual Projection Shadow Free M oiré Technology Precision Compound Telecentric Camera Lens Automated Z-Height Calibration System Automated PCB Under Board Support Sy…

Exclusive15MP/25MPCoaXPress Camera System
Dual Projection Shadow Free Moiré Technology
Precision Compound Telecentric Camera Lens
Automated Z-Height Calibration System
Automated PCB Under Board Support System
Precision PCB Warpage Compensation
Closed Loop Communication With Screen Printer
Absolute Repeatability and Reproducibility
INTELLISYS
®
Industry 4.0 Intelligent Factory Automation System
www.mirtecusa.com
PREMIER INSPECTION

Standard Features:
Options:
System Specifications:
Option 1 Pixel Resolution: 15 um 32.17 mm x 32.17 mm (1.27” x 1.27”)
Option 2 Pixel Resolution: 10 um 24.13 mm x 24.13 mm (0.95” x 0.95”)
Option 1 Pixel Resolution: 15 um 58.56 mm x 58.56 mm (2.31” x 2.31”)
Option 2 Pixel Resolution: 10 um 39.04 mm x 39.04 mm (1.54” x 1.54”)
Option 1 Pixel Resolution: 7.7 um 39.42 mm x 39.42 mm (1.55” x 1.55”)
950 Kg (2,094 lbs.)
1.030 Kg (2,270.76 lbs)
870 Kg (1,918.02 lbs)
Air Requirements
5 Kgf / cm² (0.5 Mpa); (71 PSI)
PCB Thickness Range
Standard: 0.5 mm - 5 mm
Robot Positioning System
Precision Closed Loop AC Servo Drive, Resolution: 1 um / Repeatability: ±10 um
Power Requirements
Single Phase 200~240V 50~60Hz; 1.1 KW, Breaker Capacity: 25 Amp
PCB Edge Clearance
Top-Edge Clearance: 3 mm / Bottom-Edge Clearance: 3.5 mm
Maximum PCB Warpage
±2 mm
Maximum PCB Weight
Standard: 4 Kg (8.82 Lbs.)
Lens Configuration
Precision Telecentric Compound Lens Design
Lighting System
Advanced High-Intensity RGB LED Lighting System.
PCB Surface Clearance
Top-Side Clearance: 20 mm / Bottom-Side Clearance: 50 mm
Height Accuracy on Calibration Fixture
± 1%
50 mm x 50 mm to 510 mm x 460 mm (2.0" x 2.0" to 20.1" x 18.1")
Height Resolution
±1 um
MS-11e (Extended PCB Size)
50 mm x 50 mm to 510 mm x 510 mm (2.0" x 2.0" to 20.1" x 20.1")
MS-11em (Small-Footprint)
50 mm x 50 mm to 330 mm x 280 mm (2.0" x 2.0" to 12.99 " x 11.02")
4MP CameraLink: (2,048 x 2,048 @ 180 fps)
Repeatability on Calibration Fixture
ePM-SPI CAD Import Software. ODB++ Import Module Sold Separately (Requires ePM SPI).
2D Bar Code Reader Options: Gun Type, Camera Type and External Mount.
MS-11DL Shuttle Conveyor Options: Input Shuttle Conveyor, Output Shuttle Conveyor.
Remote PC - Software Purchased Separately.
Total Remote Management Software (TRMS) - Requires Server Software for Remote PC and Client Software on All Machines.
INTELLI-TRACK
®
Process Control Software - Requires Server Software for Remote PC and Client Software on All Machines.
Remote Software: Statistical Process Control (SPC) Software,
SVN Multi-System Version Control Software - Requires Separate PC Server.
Auto-Focus Moveable Z-Axis System with Automatic PCB Warpage Compensation.
MS-11DL (Dual Lane)
Single Lane: 50 mm x 50 mm to 460 mm x 590 mm (2.0" x 2.0" to 20.1" x 23.23") /
Dual Lane: 50 mm x 50 mm to 460 mm x 300 mm (2.0" x 2.0" to 20.1" x 11.81")
25MP CoaXPress: (5,120 x 5,120 @ 72 fps)
KTL - Calibration Target Fixture.
Statistical Process Control (SPC) Software (Local System Software).
4MP CameraLink / 15MP CoaXPress / 25MP CoaXPress Top-Down Camera System (See Specifications).
PCB Inspection Area
MS-11e
15MP CoaXPress: (3,904 x 3,904 @ 120 fps)
Inspection Technology
3D Inspection Technology
2D Inspection Technology
4MP CameraLink / 15MP CoaXPress / 25MP CoaXPress Camera System
Additional Specifications
Solder Deposition: Height, Volume / Area, Solder Bridge, X/Y Offset, Shape Deformity, etc.
3D Inspection Item
Machine Dimensions and Weight
MS-11e
Vision System (FOV Size)
MS-11DL
900 mm L x 1,290 mm W x 1,660 mm H ( 35.43" x 50.79" x 65.35")
Dual Projection Shadow Free Moiré Phase Step Image Processing
MS-11em
1,080 mm W x 1,470 mm D x 1,500 mm H (42.5" x 57.87" x 59.1")
1,080 mm L x 1,610 mm W x 1,610 mm H (42.5" x 63.39" x 63.39")
Height: ± 1% / Volume: ± 2%
Inspection Height
Maximum: 500 um / Minimum: 40um
MS-11e 3D SPI Series Specifications
Intel
®
Multi-Core PC, 32” Flat Screen LCD Monitor, Windows 10
TM
OS, HDD, Mouse & Keyboard, Network LAN Card.
Single Stage High-Speed Conveyor System with Programmable Width Control and Automatic PCB Support.
Advanced High-Intensity RGB LED Lighting System.
ePM-SPI Gerber Programming Software (One Seat Included with Purchase).
(Subject to change without prior notice)