88226623-01-05 - Flex Neo PPiX Tech Spec - 第11页
11 DEK FLEX NeoHorizon P PiX Machine P roductivit y Options Process Specification Print Metho d ProFlow® ATx Stinger Printing En vironment Control Contact PM Recommended Stencil Frame VectorGuar d Adjustabl e Width Sten …
10
DEK FLEX NeoHorizon PPiX
Machine Productivity Package (included)
Process
Specification
Paste Control
Paste Dispenser (APDII or Jar Dispenser)
Paste Roll Height Monitor (PRHM 2)
Under Stencil Cleaning
Typhoon Standard or iUSC. Specify length (300mm,
400mm, 520mm)
Transport
Specification
Substrate Support
Vacuum tooling capability
Vacuum tooling sensor
Vacuum cups
Data Capture
Specification
Product Data Capture
Verification & Traceability (Software only)
ProDEK closed loop (Software only)
Software & Communications
Specification
Software & Communications
Network files
Statistical Process Control
On board, reported via operator interface (QC-CALC)
Vision & Verfication
Specification
HawkEye® 1700 Paste on Pad
Verification
Enabled
11
DEK FLEX NeoHorizon PPiX
Machine Productivity Options
Process
Specification
Print Method
ProFlow® ATx
Stinger
Printing Environment Control
Contact PM
Recommended Stencil Frame
VectorGuard
Adjustable Width Stencil Mount (AWSM)
Frame variants – Fully adjustable to accommodate
frame sizes in the range of 381mm to 736mm (15” to
29”) by 38mm height.
Image position: Centre / Front / Custom
Under Stencil Cleaning
Interchangeable Under Stencil (iUSC) cleaner, fully
programmable with wet/dry/vacuum wipe with external
solvent tank. Specify length (300mm, 400mm, 520mm)
Vacuum Assist for Under Stencil
Cleaning
On board vacuum unit 35 litres/sec airflow
Handling & Cleaner Options
Specification
Substrate Handling Size (maximum)
620mm (X) x 508.5mm (Y) – Long Board Option
Under Stencil Cleaning
Typhoon Under Stencil Cleaner (620mm, poly blade
insert only)
Software & Communications
Specification
Substrate Handling
Flexible boards
Selective print pass through
Software & Communications
GEM on TCP/IP
12
DEK FLEX NeoHorizon PPiX
Machine Productivity Options
Transport
Specification
Substrate Support
Grid-Lok® tooling
Substrate Transport
3-Stage High Throughput Conveyor with DSM
Single piece conveyor with flat belts (heavy boards)
Remote board stop (for use with heavy board option)
Substrate Fixture
All Purpose Clamping (APC) system*
Snuggers (edge clamping)
Foil-less clamps
* Can only be used with Modular single stage rail system – for availability contact product manager
Vision & Verfication
Specification
HawkEye® Bridging
Enabled
Data Capture
Specification
Product Data Capture
Verification - handheld barcode reader
Traceability - remote barcode reader