DECAN_S2_Admin(Chi_Ver4.5) - 第11页

本说明书的构成 3 6.7. Block PCB ...................................................................................................... 6 - 44 第 7 章 . 元件的登记 . .....................................................................…

Advanced Chip Shooter DECAN S2 Administrator’s Guide

3.6.1. Explorer ............................................................................................ 3 - 17

3.6.2. Calculator ......................................................................................... 3 - 17

3.6.3. Paint ................................................................................................. 3 - 17

3.6.4. Notepad ............

................................................................................ 3

- 17

3.7. 退出（Exit） .................................................................................................. 3 - 18

第 4 章 . Tools 简化操作 (shortcut) 菜单 ................................................................... 4 - 1

4.1. 初始化 (Return To Origin) ............................................................................... 4 - 1

4.2. 查看

SMVision 显示窗 .................................................................................... 4 - 2

4.2.1. SMVision 构造 .................................................................................... 4 - 2

4.3. ANC 设定 ....................................................................................................... 4 - 8

4.4. 操作模式切换 (Operation Mode Change) .................................................... 4 - 10

4.5. 传送

部分 (Conveyor) .................................................................................... 4 - 11

4.5.1. PCB 进入 / 输出功能 ....................................................................... 4 - 12

4.5.2. Manual Control 功能 ......................................................................... 4 - 13

4.6. 当前位置 ....................................................................................................... 4 - 16

4.7. Manual To

ol .................................................................................................. 4 - 19

4.7.1. 轴移动对话框 .................................................................................... 4 - 19

4.7.2. 头 TAP 对话框 .................................................................................. 4 - 24

4.8. Dump Info

rmation(Place Error Information) ................................................. 4 - 25

4.9. 抛掉

所有零件 (Part Dump All) ..................................................................... 4 - 26

4.10. 飞达车 (Docking Cart) .................................................................................. 4 - 26

4.11. PM Manager .................................................................................

................ 4 - 26

4.12. 数据

记录 (Data Logging) ............................................................................... 4 - 26

第 5 章 . Help 简化操作 (shortcut) 菜单 ..................................................................... 5 - 1

5.1. 语言 (Language) ............................................................................................. 5 - 1

5.2. 信息 ................................................................................................................ 5 - 2

5.3. 帮助 (

Help) ..................................................................................................... 5 - 2

Programming Reference

第 6 章 . Board 定义 ..................................................................................................... 6 - 1

6.1. 基本设定 (Basic Setup) ................................................................................... 6 - 1

6.2. Array PCB 设定 ............................................................................................... 6 - 9

6.3. 基准符号 (Fiducial Mark) 设定 ....................................................................... 6 - 16

6.3.1. 基准

标设置顺序 ................................................................................ 6 - 24

6.3.2. 基准标记 (Fiducial Mark) 的设置 ....................................................... 6 - 25

6.4. Bad Mark 设定 ............................................................................................... 6 - 27

6.5. 接受标记 (Accept Mark) 设置 ......................................................................... 6 - 33

6.6. 2D Barcode ................................................................................................... 6 - 36

6.6.1. 环境

设置 ........................................................................................... 6 - 36

6.6.2. Barcode Position .............................................................................. 6 -

6.6.3. Manual 2D Barcode Confirm 对话

框 ................................................ 6 - 42

本说明书的构成

6.7. Block PCB ...................................................................................................... 6 - 44

第 7 章 . 元件的登记 ..................................................................................................... 7 - 1

7.1. 新部件的登记 ................................................................................................... 7 - 7

7.1.1. 共同 Align Data ................................................................................. 7

- 23

7.1.2. CHIP 部品数据的设定 ....................................................................... 7 - 38

7.1.3. IC 部品的数据设定 ............................................................................ 7 - 54

7.1.4. User IC 部品的数据设定 .................................................................... 7 - 59

7.1.5. Hemt 部品的数据设定 ....................................................................... 7 - 73

.1.6. Connector 部品的数据设定 ............................................................... 7 - 73

7.1.7. BGA 部品的数据设定 ........................................................................ 7 - 74

7.1.8. FLIP CHIP 部品的数据设定 ............................................................... 7 - 81

第 8 章 . 供应装置的设置 .............................................................................................. 8 - 1

8.1. 喂料器（Feeder） [F4

] .................................................................................... 8 - 1

8.1.1. 喂料器基座（Feeder Base） ............................................................. 8 - 1

8.1.2. 杆式（Stick Unit） ........................................................................... 8 - 13

8.1.3. 盘状喂料器（Tray Feeder） ............................................................. 8 - 19

第 9 章 . Step Programming ........................................................................................ 9 - 1

第 10 章 . Optimization ................................................................................................. 10 - 1

10.1. Tape Feeder .................................................................................................. 10 - 1

10.2. Nozzle ............................................................................................................ 10 - 3

10.3. Feeder Lane ................................................................................................... 10 - 5

10.4. Parameter ...................................................................................................... 10 - 6

10.5. 优化

器 (Optimizer) 的执行 ............................................................................ 10 - 11

10.6. Optimizer Dialog .......................................................................................... 10 - 12

10.7. Optimization Result ...................................................................................... 10 - 14

第 11 章 . 定期检查 (cycle check) ............................................................................... 11 - 1

11.1. 定期检查 (cycle check) ................................................................................... 11 - 1

第 12 章 . LED 贴装作业 ............................................................................................... 12 - 1

12.1. 基准标记的定义 .............................................................................................. 12 - 1

12.1.1. 基准标记 (Fiducial Mark) 的设置 ....................................................... 12 - 1

12.2. LED 元件的登记 ............................................................................................. 12 - 2

12.3. 供料

器及贴装点的登记 ................................................................................... 12 - 9

12.4. Optimization ................................................................................................. 12 - 11

12.4.1. 优化 ............................................................................

..................... 1

2 - 11

12.4.2. Tape Feeder ................................................................................... 12 - 13

12.4.3. Nozzle ............................................................................................. 12 - 15

12.4.4. Feeder Lane .................................................................................... 12 - 18

12.4.5. Parameter ..................

..................................................................... 1

2 - 19

第 13 章 . Production Setup ......................................................................................... 13 - 1

13.1. Product Main .................................................................................................. 13 - 2

13.1.1. Product Monitor ................................................................................. 1

3 - 2

Advanced Chip Shooter DECAN S2 Administrator’s Guide

13.1.2. 运行设定 ........................................................................................... 13 - 8

13.1.3. 带式喂料器监控 .............................................................................. 13 - 13

13.1.4. 我的 PCB ........................................................................................ 13 - 17

13.2. 开始（Start） [F2] ..................................................................................... 13 - 18

13.3. 停止

（Stop） [F3] ...................................................................................... 13 - 18

13.4. 继续生产（Cont.） [F4] ............................................................................. 13 - 18

13.5. 完成（Finish） [F5] ................................................................................... 13 - 19

13.6. T/F 数量 [F6] ................................................................................................ 13 - 19

13.7. PCB 下载

[F7] .............................................................................................. 13 - 21

13.8. 生产数据 [F8] ............................................................................................... 13 - 21

13.9. Flux. [F9] ..................................................................................................... 13 - 21

Calibration & Setup

第 14 章 . Machine Calibration .................................................................................... 14 - 1

14.1. Head [F2] ....................................................................................................... 14 - 1

14.1.1. Head TAP 对话框 ............................................................................. 14 - 1

14.1.2. < 朝向偏移 > TAP 对话框 ....................

............................................. 1

4 - 3

14.1.3. <R 轴 > TAP 对话框 ......................................................................... 14 - 5

14.1.4. < 飞行固定偏移 > TAP 对话框 .......................................................... 14 - 6

14.1.5. < 计数偏移 > TAP 对话框 ................................................................. 14 - 7

14.2. 摄像机（Camera） [F5] ................................................................................ 14 - 9

14.3. 校正

[F9] ...................................................................................................... 14 - 12

14.3.1. 原点刻度 ......................................................................................... 14 - 13

14.3.2. 歪斜修正 ......................................................................................... 14 - 18

14.3.3. 基准照相机测量 .............................................................................. 1

4 - 19

14.3.4. Common XY Calibration ................................................................. 14 - 23

14.3.5. Conveyor Calibration ...................................................................... 14 - 26

14.3.6. X-XY Compensation ....................................................................... 14 - 35

14.3.7. Gantry Thermal Mappin

g ................................................................ 1

4 - 37

14.3.8. Gantry Mapping .............................................................................. 14 - 40

14.3.9. ANC Pos. Scan .............................................................................. 14 - 43

14.3.10.Head & Camera Calibration ........................................................... 14 - 44

14.3.11.Bo

ard Position Calibration .............................................................. 14 - 77

第 15 章 . 系统设置 ....................................................................................................... 15 - 1

15.1. 传达装置 (Conveyor) [F3] .............................................................................. 15 - 2

15.2. Position [F4] .................................................................................................. 15 - 8

15.2.1. < 进给

基础 > TAP 对话框 ................................................................. 15 - 8

15.2.2. < 系统堆存处 > TAP 对话框 ............................................................ 15 - 10

15.3. 外围设备 (Peripherals) [F6] ......................................................................... 15 - 14

15.3.1. <Dump Box> TAP 对话框 ............................................................... 15 - 14

5.3.2. <Tray Feeder> TAP 对话框 ........................................................... 15 - 16