ePM 中文操作說明 - 第3页
Programmer ’ s Manual | 3 目錄總覽 目錄 ............................................................. .............................................................. 3 圖示列表 ......................................................…
2 | Chapter 2. ePM-SPI
TM
3DSolderPasteInspectionSystem
Version 1.0
KOH YOUNG TECHNOLOGY. INC.
軟體版本
Date Revision Writer Comments
28. Nov. 2008 1.0 Draft
Programmer’s Manual | 3
目錄總覽
目錄...........................................................................................................................3
圖示列表 ..................................................................................................................8
關於 ePM-SPI ......................................................................................................9
1. ePM-SPI 介紹..............................................................................................11
2. ePM-SPI 安裝..............................................................................................12
2.1. 步驟1. ePM-SPI 工具安裝.......................................................................................12
2.2. 步驟2. JRE (“Java SE Runtime Environment＂).................................................15
2.3. 步驟3. HASP 系統管理運作時間設定...................................................................16
3. ePM-SPI 主架構 .............................................................................................20
3.1. 選單列表....................................................................................................................21
3.1.1. 檔案選單.........................................................................................................................22
3.1.2. 編輯選單.........................................................................................................................22
3.1.3. 瀏覽選單.........................................................................................................................23
3.1.4. 設定選單.........................................................................................................................23
3.1.5. 工具選單.........................................................................................................................24
3.1.6. 桌面選單.........................................................................................................................25
3.1.7. 幫助選單.........................................................................................................................25
3.2. 圖示集........................................................................................................................27
3.3. 標題定位與附屬項目...............................................................................................28
3.4. 訊息集........................................................................................................................29
3.5. 工作視窗....................................................................................................................30
3.6. 程式集........................................................................................................................30
3.7. 自動搜尋視窗............................................................................................................31
4 | Chapter 2. ePM-SPI
TM
3DSolderPasteInspectionSystem
Version 1.0
KOH YOUNG TECHNOLOGY. INC.
4. ePM-SPI 操作流程.........................................................................................32
4.1. Type A.........................................................................................................................36
4.1.1. 輸入 Gerber....................................................................................................................36
4.1.2. 機板尺寸.........................................................................................................................38
4.1.3. 產生MaskPin後自動Teaching.......................................................................................38
4.1.4. 定位點 (選配)................................................................................................................39
4.1.5. 連版排列 (選配)............................................................................................................40
4.1.6. 輸出.................................................................................................................................42
4.2. Type B.........................................................................................................................43
4.2.1. 輸入 Gerber....................................................................................................................43
4.2.2. 旋轉與鏡射.....................................................................................................................44
4.2.2.1. A ...................................................................................................................................45
4.2.2.2. B....................................................................................................................................45
4.2.3. 機板尺寸 & 工作區域.................................................................................................46
4.2.4. 機板原點.........................................................................................................................47
4.2.5. 工作範圍.........................................................................................................................48
4.2.6. 產生 Mask Pin...............................................................................................................49
4.2.7. 自動教導元件 .................................................................................................................50
4.2.8. 連版排列 (選配)............................................................................................................51
4.2.9. 定位點 (選配)................................................................................................................53
4.2.10. 輸出.................................................................................................................................55
4.3. Type C.........................................................................................................................56
4.3.1. 輸入Gerber.....................................................................................................................56
4.3.2. 旋轉與鏡射 ...................................................................................................................57
4.3.2.1. A ...................................................................................................................................58
4.3.2.2. B....................................................................................................................................59
4.3.3. 輸入CAD X-Y ...............................................................................................................59
4.3.4. 圖檔整合.........................................................................................................................62
4.3.5. 機板尺寸........................................................................................................................63
4.3.6. 機板原點........................................................................................................................64
4.3.7. 工作範圍........................................................................................................................65
4.3.8. 產生Mask Pin................................................................................................................66
4.3.9. 產生Footprint.................................................................................................................67