1OM-1625-004_w.pdf - 第178页

1OM-1603 4-1 1. Specications : Chap.4 1012-005 1. Specications 1.1 Specications of SIGMA-G5 Chip Mounter Item Description 1. Model Name SIGMA-G5 High-Speed Head Multi-Functional Head 2. Throughpu t 70,000 CPH / module…

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1OM-1603
0908-002 4-B
1OM-1603
4-1
1. Specications : Chap.4
1012-005
1. Specications
1.1 Specications of SIGMA-G5 Chip Mounter
Item Description
1. Model Name SIGMA-G5
High-Speed Head Multi-Functional Head2. Throughput
70,000 CPH / module
Note : The PCB transition time under
optimum conditions is
excluded.
Components : 14,500 CPH / 2 heads
Note : The PCB transition time under
optimum conditions is
excluded.
High-Speed Head Multi-Functional Head3. Placement
Accuracy
0603 / 0402 : 40μm (3 σ) IC : 30μm (3 σ)
4. PCB
Transition Time
Approx. 2 seconds (PCB Length : 260 mm or less)
(Under Optimum Conditions)
5. Machine Scope
This machine uses the double-sided operation system on the front and rear of
the machine and single PCB transfer method is used.
6. PCB Flow
Direction and
Transfer Reference
PCB Flow Direction : From Left to Right/From Right to Left
(Selected when shipped from the factory)
Transfer Reference
: Rear Left/Rear Right/Front Left/Front Right
(Selected when shipped from the factory)
T1E1-1
1OM-1603
4-2
1. Specications : Chap.4
1007-004
Item
Description
7. Applicable PCB Size : 50 × 50 to 610 × 460 mm
(Four Corners : R1 to R1.5 mm)
Thickness : 0.3 to 5.0 mm
Warpage : The following two requirements should be met.
• 0.2 mm or less per 50 mm (unit length)
Example: The warpage must be 0.8 mm or less when the PCB
size is 200 mm.
• Max. 1.0 mm
Example: The warpage must be 1.0 mm or less when the PCB
size exceeds 250 mm.
Warpage
F1E2
Mass : Max. 2.5 kg (completed PCB)
However, for the size X of 260 mm or less, the max. mass is 1.5
kg (for a completed PCB)
Material : Glass Epoxy
Ceramic (Option)
Notes : (a) Consult our marketing department or sales agency for Glass
Epoxy with light color.
(b) Depending on the PCB material, shape, warpage, mass or surface
condition (gloss), etc., it should be tested whether or not the PCB
can be transferred, or the components can be placed normally, to
confirm.
T1E1-2