1OM-1625-004_w.pdf - 第184页

1OM-1603 4-7 1. Specications : Chap.4 1007-004 Item Description High-Speed Head Multi-Functional Head (1) Applicable Components Size : 0.4 × 0.2 to 44 × 44 mm Thickness : Max. 12.7 mm Lead Pitch : 0 .3 mm pitch or more …

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1OM-1603
4-6
1. Specications : Chap.4
1007-004
Item
Description
11. Component
Placeable Range
Unit : mm
F1E9
Notes : (a) The above figure shows that the vacuum nozzles are not
protruding from the outer shapes of components.
(b) Components cannot be placed in the shadowed area.
Components cannot be placed in the range (0.5 mm) around the
opening such as a hole.
(c) This size is the max. possible placement height including the
placed component height from the PCB.
T1E1-6
1OM-1603
4-7
1. Specications : Chap.4
1007-004
Item
Description
High-Speed Head Multi-Functional Head
(1) Applicable Components
Size : 0.4 × 0.2 to 44 × 44 mm
Thickness : Max. 12.7 mm
Lead Pitch : 0.3 mm pitch or
more
Lead Width : Min. 0.1 mm
Lead Length : Min. 0.20 mm
Note : Some components cannot be
used due to the mechanical
characteristics, shapes, etc.
(1) Applicable Components
Size : 1.0 × 0.5 to 55 × 55 mm
Thickness : Max. 25.4 mm
Lead Pitch : 0.3 mm pitch or
more
Connector : Max. 100 × 26 mm
Note : Some components cannot be
used due to the mechanical
characteristics, shapes, etc.
12. Applicable
Components
Applicable Components for Reference
• Cylindrical Components
Resistors, Capacitors, Diodes, and Other similar-shaped components
• Square Components
Resistors, Film Capacitors, Coils, Chip Ceramic Filters, and Other
similar-shaped components
• Deform Components
Semi-Fixed Variable Resistors, Trimmer Capacitors, and Other similar-
shaped components
• ICs
Mini-Flat ICs, Plastic Chip Carrier with Leads, and Other similar-
shaped components
• Leaded Components
Mini-Mold Transistors, Mini-Power Transistors, Filters, LEDs,
Diodes, Coils, Tantalum Capacitors, Aluminum Electrolytic
Capacitors, and Other similar-shaped components
• Connectors
Connectors for FFC / FPC, PCB-to-PCB Connectors, Wire-to-PCB
Connectors, PLCC Sockets, and Other Similar-Shaped Components
• BGA/CSP Components (Option)
BGA, CSP, LGA, and Other Similar-Shaped Components
Size : Max. 44 × 44 mm
Ball Diameter : Min. φ 0.13 mm
Ball Pitch : 0.25 mm pitch or more
T1E1-7
1OM-1603
4-8
1. Specications : Chap.4
1007-004
Item Description
(2) Packaged Posture Standards
Taped Components JIS or its equivalent
v Paper Tapes (Width : 8 mm)
v Embossed Tapes (Width : 8 to 72 mm)
v Reel Outer Diameter : F382 mm or less
Note : Some taping sizes are limited.
Some taped components cannot be used due to the mechanical
characteristics.
Stick Components
v Carrier Stick :
Width 8 to 60 mm × Thickness 3 to 16 mm × Length 400 to 600 mm
Tray Components
v Tray : 100 s 100 to 323 s 136 mm
(In the case of using the JEDEC multi-layer tray feeder)
100 s 100 to 330 s 230 mm
(In the case of using the full size multi-layer tray feeder)
T1E1-8