1OM-1625-004_w.pdf - 第185页
1OM-1603 4-8 1. Specications : Chap.4 1007-004 Item Description (2) Packaged Posture Standards Taped Components JIS or its equi valent v Paper Tap es (Wi dth : 8 m m) v Emb os sed T ape s (W idt h : 8 t o 7 2 mm ) v Ree…
1OM-1603
4-7
1. Specications : Chap.4
1007-004
Item
Description
High-Speed Head Multi-Functional Head
(1) Applicable Components
Size : 0.4 × 0.2 to 44 × 44 mm
Thickness : Max. 12.7 mm
Lead Pitch : 0.3 mm pitch or
more
Lead Width : Min. 0.1 mm
Lead Length : Min. 0.20 mm
Note : Some components cannot be
used due to the mechanical
characteristics, shapes, etc.
(1) Applicable Components
Size : 1.0 × 0.5 to 55 × 55 mm
Thickness : Max. 25.4 mm
Lead Pitch : 0.3 mm pitch or
more
Connector : Max. 100 × 26 mm
Note : Some components cannot be
used due to the mechanical
characteristics, shapes, etc.
12. Applicable
Components
Applicable Components for Reference
• Cylindrical Components
Resistors, Capacitors, Diodes, and Other similar-shaped components
• Square Components
Resistors, Film Capacitors, Coils, Chip Ceramic Filters, and Other
similar-shaped components
• Deform Components
Semi-Fixed Variable Resistors, Trimmer Capacitors, and Other similar-
shaped components
• ICs
Mini-Flat ICs, Plastic Chip Carrier with Leads, and Other similar-
shaped components
• Leaded Components
Mini-Mold Transistors, Mini-Power Transistors, Filters, LEDs,
Diodes, Coils, Tantalum Capacitors, Aluminum Electrolytic
Capacitors, and Other similar-shaped components
• Connectors
Connectors for FFC / FPC, PCB-to-PCB Connectors, Wire-to-PCB
Connectors, PLCC Sockets, and Other Similar-Shaped Components
• BGA/CSP Components (Option)
BGA, CSP, LGA, and Other Similar-Shaped Components
Size : Max. 44 × 44 mm
Ball Diameter : Min. φ 0.13 mm
Ball Pitch : 0.25 mm pitch or more
T1E1-7
1OM-1603
4-8
1. Specications : Chap.4
1007-004
Item Description
(2) Packaged Posture Standards
Taped Components JIS or its equivalent
v Paper Tapes (Width : 8 mm)
v Embossed Tapes (Width : 8 to 72 mm)
v Reel Outer Diameter : F382 mm or less
Note : Some taping sizes are limited.
Some taped components cannot be used due to the mechanical
characteristics.
Stick Components
v Carrier Stick :
Width 8 to 60 mm × Thickness 3 to 16 mm × Length 400 to 600 mm
Tray Components
v Tray : 100 s 100 to 323 s 136 mm
(In the case of using the JEDEC multi-layer tray feeder)
100 s 100 to 330 s 230 mm
(In the case of using the full size multi-layer tray feeder)
T1E1-8
1OM-1603
4-9
1. Specications : Chap.4
1012-005
Item
Description
High-Speed Head Multi-Functional Head13. Placement Heads
Equipped with 2 heads / 2 beams
Vacuum Nozzle: Max. 15 nozzles on
each head
Ref. : Number of Component Picks:
Component Size
No. of
Component
Picks
4.2 × 4.2 mm or less 15
to 8 × 8 mm or less 7
to 9 × 9 mm or less 5
to 10 × 10 mm or less 4
to 12 × 12 mm or less 3
to 20 × 20 mm or less 2
to 44 × 44 mm or less 1
Note : There are high-speed nozzle
and middle-size odd shaped
nozzle for vacuum nozzle
types.
Although the high-speed
nozzles and middle-size odd
shaped nozzles can be
arranged together on a single
head, the middle-size odd
shaped nozzles must be
attached, leaving one out of
two pitches empty due to the
locations of the diffusion
plates.
High-Speed Nozzle :
The diameter should
be 6 mm or less.
This nozzle is used for
0402 component up to
the size 20
× 20 mm.
Middle-Size Odd Shaped
Nozzle :
The diameter is 12
mm or less. The
nozzle tip is processed
according to the
applicable
components.
The nozzle can be
used for the
component size of up
to 44 × 44 mm.
Equipped with 2 heads / 2 beams
Vacuum Nozzle: Max. 3 nozzles on
each head
Ref. : Number of Component Picks:
Component Size
26.2 × 26.2 mm or less 3
to 55 × 55 mm or less 2
Note : For components not within
the above ranges, the number
of components to be picked
up should be "1".
(In the case of connector 100
× 26 mm, etc.)
T1E1-9