IPC J-STD-003B - 第23页
otherwise agreed upon between vendor and user the reflow parameters shall be per T able 4-2. 4.2.5.4 Procedure Place the stencil/screen on a surface termination area of interest, apply solder paste (see 3.2.1) onto the st…
process controls, incline, board preheat temperature and
solder temperature. The application of solder shall meet the
requirements of the applicable wave solder equipment, spe-
cifically for depth of contact, angle of contact, and duration
of contact. Solder temperature shall be235±5°C[455 ±
9 °F] unless another temperature is agreed upon by vendor
and user. Prior to examination, all test specimens shall
have the flux removed using a cleaning agent in accordance
with 3.2.3.
4.2.4.4 Evaluation
4.2.4.4.1 Magnification
Test specimens shall be exam-
ined at 10X using the equipment specified in 3.3.3.
4.2.4.4.2 Surface Evaluation – Accept/Reject Criteria
An area of 3.0 mm [0.118 in] width from the trailing edge
of each test specimen shall not be evaluated. Areas con-
tacted by fixtures shall not be evaluated. A minimum of
95% of each of the surfaces (i.e., each pad) being tested
shall exhibit good wetting. The balance of the surface may
contain only small pin holes, dewetted areas, and rough
spots provided such defects are not concentrated in one
area. For less critical applications, a smaller percent cover-
age may be determined between vendor and user. There
shall be no nonwetting or exposed base metal within the
evaluated area.
4.2.4.4.3 Plated-Through Hole Evaluation Only plated-
through holes that are at least 5.0 mm [0.197 in] from any
surface or fixturing structure supporting the test specimen
during the test will be evaluated.
Accept/Reject Criteria:
• Class 1 and 2 Product – Solder shall fully wet the wall
area of the plated-through holes, and plug holes less than
1.5 mm [0.0591 in] diameter (complete filling is not nec-
essary).
• Class 3 Product – The test specimen has soldered suc-
cessfully if solder has risen in all plated-through holes.
The solder shall have fully wetted the walls of the hole.
There shall be no nonwetting or exposed base metal on
any plated-through hole.
Accept/reject criteria for board thicknesses of <3.0 mm
[<0.118 in] shall be in accordance with 5.2 and Figures 4-5
and 4-6. The solder must have wetted over the knee of the
hole and out onto the land around the top of the hole,
except for boards whose thickness exceeds 3.0 mm [0.118
in].
On thick boards, i.e., greater than 3.0 mm [0.118 in], the
capillary action forces may not be large enough to over-
come forces exerted on the solder by the weight of the sol-
der. This may prevent solder from filling the plated-through
hole and wetting over the knee of the hole and out onto the
land area around the top of the hole.
4.2.5 Test E – Surface Mount Process Simulation Test
Tin/Lead Solder
This test simulates actual surface mount
printed board performance in a reflow process.
4.2.5.1 Apparatus
4.2.5.1.1 Stencil/Screen
A stencil or screen with pad
geometry openings that are appropriate for the test speci-
men shall be used. Unless otherwise agreed upon between
vendor and user the nominal stencil thickness shall be per
Table 4-1.
4.2.5.1.2 Paste Application Tool A rubber or metal
squeegee device shall be used to distribute paste across the
stencil/screen.
4.2.5.2 Test Specimen The test specimen shall be in
accordance with 1.7. The test specimen shall be tested in
the condition that it would normally experience at the time
of assembly soldering. The test specimen surfaces to be
tested shall be handled in such a manner as not to cause
contamination, nor shall the surfaces being tested be
wiped, cleaned, scraped or abraded.
4.2.5.3 Reflow Equipment An IR/convection reflow
oven, vapor phase reflow system, or storage oven capable
of reaching the reflow temperature of the paste shall
beused. The temperatures listed in Table 4-2 correspond to
the temperature/time duration for the solder paste. Addi-
tional time may be required to allow the test specimen
itself to reach the temperatures listed in Table 4-2. Unless
Table 4-2 Reflow Parameter Requirements
Reflow Type Temperature Time
Vapor Phase Reflow 215-219 °C [419-426 °F] 30-60 seconds dwell at reflow
IR/Convection Reflow
Preheat 150-170 °C [302-338 °F] 50-70 seconds
Reflow 215-230 °C [419-446 °F] 50-70 seconds
Oven 215-230 °C [419-446 °F] 2-5 minutes (until reflow is assured)
Table 4-1 Stencil Thickness Requirements
Nominal
Stencil Thickness Pitch
0.10 mm [0.00394 in] <0.50 mm [<0.0197 in]
0.15 mm [0.00591 in] 0.50-0.65 mm [0.0197-0.0256 in]
0.20 mm [0.00787 in] >0.65 mm [>0.0256 in]
IPC J-STD-003B March 2007
12
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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otherwise agreed upon between vendor and user the reflow
parameters shall be per Table 4-2.
4.2.5.4 Procedure Place the stencil/screen on a surface
termination area of interest, apply solder paste (see 3.2.1)
onto the stencil/screen and print the stencil pattern onto the
test substrate by wiping paste over the stencil/screen in one
smooth motion using a rubber or metal squeegee. Remove
the stencil/screen carefully so as to avoid smearing the
paste print. Place test substrate on applicable reflow equip-
ment and conduct reflow process. After reflow, carefully
remove test specimen and allow to cool to room tempera-
ture. Prior to examination, all test specimens shall have the
flux removed using a cleaning agent in accordance with
3.2.3.
4.2.5.5 Evaluation
4.2.5.5.1 Magnification
Test specimens shall be exam-
ined at 10X using the equipment specified in 3.3.3.
4.2.5.5.2 Surface Evaluation – Accept/Reject Criteria
A minimum of 95% of each of the surfaces (i.e., each pad)
being tested shall exhibit good wetting. The balance of the
surface may contain only small pin holes, dewetted areas,
and rough spots provided such defects are not concentrated
in one area. For less critical applications, a smaller percent
coverage may be determined between vendor and user.
There shall be no nonwetting or exposed base metal within
the evaluated area.
March 2007 IPC J-STD-003B
13
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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4.2.6 Test A1 – Edge Dip Test Lead-Free Solder This
test is for edge dip testing of surface conductors and attach-
ment lands.
4.2.6.1 Apparatus
4.2.6.1.1 Solder Pot/Bath
A solder vessel that meets the
requirements of 3.3.2 shall be used. The solder shall meet
the requirements of 3.2.1. Solder bath temperatures and
solder contamination control shall be in accordance with
3.5.1 and 3.5.2.
4.2.6.1.2 Dipping Device A dipping device as shown in
Figure 4-1 shall be used. A similar device may be used
providing: the rate of immersion, dwell time, and rate of
withdrawal are within the test limits; perpendicularity of
board and solder surface are maintained; wobble, vibration,
and other extraneous movements are eliminated.
4.2.6.2 Test Specimen The test specimen shall be a rep-
resentative portion of the board, or a full board, whichever
is smaller, not to exceed 50 x 50 mm [1.97 x 1.97 in], or a
test specimen that is representative of the common board
features. Figures 4-2 and 4-3 are suggested test specimen
styles. Test specimen preparation shall be in accordance
with 3.4.
4.2.6.3 Procedure Dross and burned/residual flux shall
be completely removed from the surface of the molten
solder immediately prior to dipping. After fluxing and
draining per 4.1, the test specimen shall be immersed into
the molten solder edgewise to a depth of 25±2mm[0.984
± 0.08 in]. The dwell time in the molten solder shall be 3.0
± 0.5 seconds. Immersion and emersion rates shall be 25 ±
2 mm [0.984 ± 0.08 in] per second. After withdrawal, the
solder shall be allowed to solidify by air cooling while the
board is maintained in a vertical position. Prior to exami-
nation, all test specimens shall have the flux removed using
a cleaning agent in accordance with 3.2.3.
4.2.6.4 Evaluation
4.2.6.4.1 Magnification
Test specimens shall be exam-
ined at 10X using the equipment specified in 3.3.3.
4.2.6.4.2 Surface Evaluation – Accept/Reject Criteria
A minimum of 95% of each of the surfaces (i.e., each pad)
being tested shall exhibit good wetting. The balance of the
surface may contain only small pin holes, dewetted areas,
and rough spots provided such defects are not concentrated
in one area. For less critical applications, a smaller percent
coverage may be determined between vendor and user.
There shall be no nonwetting or exposed base metal with-
in the evaluated area. An area of 3.2 mm [0.126 in] width
from the bottom edge of each test specimen shall not
be evaluated. Areas contacted by fixtures shall not be
evaluated.
4.2.7 Test B1 – Rotary Dip Test Lead-Free Solder This
test is for rotary dip testing of plated-through holes, surface
conductors and attachment lands.
4.2.7.1 Apparatus A device shall be used to move the
test specimen in a circular path so that the flat surface of
the test specimen will contact the solder at a constant speed
without stopping. The distance between the center of rota-
tion and the center of the test specimen shall be 100 mm
[3.937 in] minimum. An example of a test specimen holder
is shown in Figure 4-4. Those parts of the holder including
the retaining spring (if fitted) which come into contact with
the test specimen and/or the solder should have low ther-
mal capacity and conductivity. The time of contact between
any point of the test face of the test specimen and the mol-
ten solder shall be determined by a timer. The timer shall
start when the face of the test piece is parallel to the solder
surface. A strip of 50 mm [1.97 in] wide polytetrafluoroet-
hylene (PTFE) or equivalent shall precede the test speci-
men in the test cycle in order to remove oxide or flux resi-
due from the solder surface immediately before the test
specimen is introduced.
4.2.7.2 Test Specimen The test specimen shall be in
accordance with 1.7. The test specimen shall either be a
full board, a section of a board, or a suggested test speci-
men (see Figures 4-2 and 4-3). The test specimen shall be
of such a width as to allow 13 mm [0.512 in] clearance
from the solder pot sides. The minimum number of termi-
nations (plated-through holes or attachment lands) per test
specimen shall be six. If plated-through holes are to be
tested, then the minimum number of holes to be tested is
30 per test lot. This would require a minimum of five test
specimens (six holes per test specimen, 30 holes total). The
test specimen shall be representative of the product. The
exposed length of test specimen test face in the direction of
travel shall be25±5mm[0.984 ± 0.20 in]. Test specimen
preparation shall be in accordance with 3.4.
4.2.7.3 Procedure Dross and burned/residual flux shall
be completely removed from the surface of the molten sol-
der immediately prior to dipping. After fluxing and drain-
ing, per 4.1, mount the test specimen to be tested in the test
equipment test specimen holder. Adjust the test equipment
to immerse the test specimen into the solder bath to a
maximum of 50% of the test specimen thickness unless
otherwise specified. Activate the test equipment to expose
the test specimen to solder. After the test specimen has
cleared the solder bath, allow all the solder to solidify in
the position in which the machine stops before removing
from the test specimen holder. Care must be taken so that
solder does not flow over the upper face of the test speci-
men. This may be impacted by the width of the test speci-
men. Dwell time at the maximum depth shall be 3.0 ± 0.5
IPC J-STD-003B March 2007
14
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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