IPC J-STD-003B - 第37页

APPENDIX D Test Protocol for Wetting Balance Gauge Repeatability and Reproducibility (GR&R) Using Copper Foil Coupons 1. All coupons for these tests shall be prepared individu- ally just prior to testing. Do NOT batc…

APPENDIX C

Informative Annex

C.1 Test Equipment Sources

The equipment sources described below represent those

currently known to the industry. Users of this document are

urged to submit additional source names as they become

available, so that this list can be kept as current as possible.

C.1.1 Edge Dip Solderability Test Apparatus

GEN3 Systems Limited (Formerly Concoat Systems) Unit

B2, Armstrong Mall, Southwood Business Park, Farnbor-

ough, Hampshire GU14 0NR England. 011 44 12 5252

1500, www.gen3systems.com

HMP Soldermatics, P.O. Box 948, Canon City, CO 81212,

(719) 275-1531.

Robotic Process Systems, 23301 E. Mission Ave., Liberty

Lake, WA 99019, (509) 891-1680.

Solderability Testing and Solutions Inc., 18 Wildrose Dr.,

Edgewood, KY 41017, (859) 331-0598), www.wetting-

balance.com

C.1.2 Rotary Dip Test Apparatus

Robotic Process Systems, 23301 E. Mission Ave., Liberty

Lake, WA 99019, (509) 891-1680.

C.1.3 Wetting Balance Test Apparatus

GEN3 Systems Limited (Formerly Concoat Systems) Unit

B2, Armstrong Mall, Southwood Business Park, Farnbor-

ough, Hampshire GU14 0NR England. 011 44 12 5252

1500, www.gen3systems.com

Malcomtech 26200 Industrial Blvd, Hayward CA 64545,

510-293-0580, www.malcomtech.com

Metronelec, 54, Route de Sartrouville - Le Montreal 78232

Le PECO Cedax, France (USA Distributor/Solderability

Testing and Solutions Inc., 18 Wildrose Dr., Edgewood,

KY 41017, (859) 331-0598), www.wettingbalance.com

Robotic Process Systems, 23301 E. Mission Ave., Liberty

Lake, WA 99019, (509) 891-1680.

C.2 Consumable Product Sources

C.2.1 Test Flux Product Sources

The Test Flux product sources described below represent

those currently known to the industry. Users of this docu-

ment are urged to submit additional product source names

as they become available, so that this list can be kept as

current as possible.

AIM Solder {www.aimsolder.com} - Standard Flux #1

Product ID: RMA 202-25

GEN3 Systems Limited {www.gen3systems.com} - Prod-

uct ID’s: SMNA - Standard Flux #1: Actiec2/-Standard

Flux #2: Actiec 5

Kester {www.kester.com} - Standard Flux #1 Product ID:

182

Qualitek International, Inc. {www.qualitek.com} - Stan-

dard Flux #1 Product ID: 285-25

Solderability Testing and Solutions Inc. {www.wettingbal-

ance.com} - Standard test ﬂux 0.2% and Standard test ﬂux

0.5%

C.2.2 Gage R&R Test Coupon Product Sources

The copper coupons required for the Gage R&R testing in

Appendix D shall be acid copper electroplated foil, HTE

grade (conforms to IPC-4562/3 - CU-E3), but they shall

have NO conversion coatings applied.

(NOTE: The coupons will/should look stained and oxi-

dized.)

The copper coupon can be of any of the three following

dimensions, AABUS:

• 10 mm x 10 mm X 35µµm thick foil (1 oz nominal)

• 5 mm x 10 mm x 35 µm thick foil (1 oz nominal)

• 2 mm X 10 mm X 35 µm thick foil (1 oz nominal)

Solderability Testing and Solutions Inc. {www.wettingbal-

ance.com} is one source of these Gage R&R test coupons.

IPC J-STD-003B March 2007

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\

APPENDIX D

Test Protocol for Wetting Balance Gauge Repeatability

and Reproducibility (GR&R) Using Copper Foil Coupons

1. All coupons for these tests shall be prepared individu-

ally just prior to testing. Do NOT batch clean the

samples.

2. Copper foil of 35 microns nominal thickness (‘‘1 oz’’

copper) shall be used for the test.

3. The copper foil shall have NO surface treatment and

is expected to have an oxidized appearance upon

receipt from the supplier. Do not use the copper foil if

it is bright and shinny. This is indicative of surface anti

tarnish treatments being used. Surface treatments/

preservatives can interfere with the ability to make a

consistent ‘‘known good coupon’’ necessary for this

test.

4. The copper foil coupons shall be die cut to ensure

repeatability of the samples being tested and shall be

of the following width dimensions;

a. 2 mm

b. 5 mm

c. 10 mm

5. Create a ﬁle for each foil width and for each individual

person that is involved performing the GR&R.

6. Test parameters shall be:

a. Solder temperature shall be the as recommended

for the alloy and the speciﬁcation being used, i.e.,

for SnPb and ANSI-J-STD-003 it shall be 235 °C,

for ANSI-J-STD-002 it shall be 245 °C. For SAC

305 it shall be 255 °C, regardless of the speciﬁca-

tion.

b. Immersion depth shall be 0.4 mm.

c. Immersion speed shall be 2 mm/sec.

d. Dwell time in the solder shall be 10 seconds.

e. Immersion angle shall be 90 degrees incident to the

solder.

f. No preheat shall be used.

7. Sample preparation for the ‘‘known good coupon’’

shall be as follows:

a. Use a tweezers to immerse a foil sample into a bea-

ker of Acetone and gently agitate for 20 seconds.

b. Remove sample and blot both sides dry with ‘‘Kim

wipes’’ or other suitable lab tissue.

c. Again using a tweezers, immerse the above sample

into a 20% v/v Nitric acid solution and gently agi-

tate for 20 seconds.

d. Immerse the sample immediately into DI water and

gently agitate for 20 seconds.

e. Blot the sample dry as in step ‘‘b’’ above.

8. Dip sample into the ‘‘standard activated ﬂux’’ nor-

mally used for solderability testing for 5 seconds.

9. Holding the samples vertically, blot to remove excess

ﬂux.

10. Place sample into tool holder.

11. Run the test.

12. Repeat ten times for each foil width and each test per-

son. It is recommended that three people should be

used for the GR&R study.

13. For ease of data manipulation it is recommended to

convert the wetting forces obtained into mN/mm of

wettable length. For the 10 mm coupon for example,

the wettable length is 2 times 10 mm plus 2 times

0.035 mm for a total length of 20.07 mm.

14. For the ‘‘standard activated’’ ﬂux of nominal 0.2%

activation, the wetting force used for the calculations

shall be 0.31 mN/mm. If a more active ﬂux is being

used, a large sample shall be run to obtain the mean

value and this used for the calculations.

15. Calculate the standard deviation for each of the foil

widths and the people running the test.

16. Multiply the standard deviation value by 6 (this repre-

sents the plus - minus 3 standard deviations of a nor-

mal distribution)

17. Divide this number by 0.31 and multiply by 100 to

obtain a percentage value.

18. Tabulate the three values per person.

19. For an acceptable GR&R, the values obtained should

be below 10%.

20. There should be excellent R&R results with the 10 mm

coupon the ﬁrst time this protocol is performed with an

increasing spread test person to test person when using

the smaller coupons. You may have to repeat the test

or allow the individuals some ‘‘practice time’’ prior to

running the full GR&R.

21. In addition to testing the individual, this protocol also

tests the machine and will show linearity and any bias

if it exists. Because the wetting forces have been nor-

malized to mN/mm, the readings for each coupon

width should be the same. If they are clearly different

but the standard deviations produced by the individual

test people are below 10%, then there is a problem

with the wetting balance and you should contact the

manufacturer.

March 2007 IPC J-STD-003B

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\

APPENDIX E

J-STD-002/J-STD-003 Activated Solderability

Test Flux Rationale Committee Letter

The current J-STD-002/J-STD-003 speciﬁcation includes a

departure in the test ﬂux methodology used in past solder-

ability testing. The table in 3.2.2 Flux is:

The J-STD-002/J-STD-003 committees understood that

any proposed change to the use of ROLO (formerly desig-

nated type R) would be heavily scrutinized and would

require test data showing the applicability of using a stan-

dard activated ﬂux composition. The J-STD-002/J-STD-

003 has spent signiﬁcant resources working this ﬂux

change issue, discussing the chemistry details and conduct-

ing multi-company Design of Experiment investigations.

The J-STD-002 committee chairmen, Dave Hillman [Rock-

well Collins], Doug Romm [Texas Instruments], Mark

Kwoka [Intersil], Jack McCullen [Intel], feel that the com-

mittee has compiled a signiﬁcant data set and held through

topic discussions supporting the proposed ﬂux material

change. The four rationales for proposing/supporting the

ﬂux change are summarized below:

1) A Proactive Solderability Testing Approach To The

Implementation of Non-Tin Finishes

A number of industry studies (1996 NEMI Surface Fin-

ishes Task Group Report, 1997 NCMS Lead-Free Solder

Project, 2000 National Physical Laboratory CMMT (A)

284 Report) have shown that an incompatibility of ‘‘R

type’’ ﬂux with non-tin surface ﬁnishes such as palla-

dium, organic solderability preservatives (OSPs), and

immersion gold. The introduction of these various

metallic surface ﬁnishes on components and printed wir-

ing boards is no longer the exception but has/is quickly

becoming the norm. The use of a ‘‘R type’’ ﬂux contain-

ing only naturally occurring activators has resulted in

producing ‘‘false negative’’ solderability test results

which impact both the component/board fabricator and

the assembler negatively in terms of cost and schedule.

2) Reduced Solderability Test Variability

The J-STD-002/003 solderability committees enlisted

the assistance of Dr. Carol Handwerker and the

resources of the National Institute of Standards & Tech-

nology (NIST) to investigate/compare a standard acti-

vated ﬂux composition versus the ‘‘R type’’ ﬂux compo-

sition. A detailed statistical analysis by Bill Russell,

Raytheon Systems, and NIST statisticians revealed the

use of a standard activated ﬂux composition greatly

reduced the amount of solderability test variation. One

of the major goals of the J-STD-002/003 solderability

committees is to develop test methods and standards

which promote consistency across the industry.

3) Concerns of A Loss of Solderability Assessment

Safety Margin

The two major historical rationale for using an ‘‘R

type’’ ﬂux: 1) colophony or rosin contains only naturally

occurring ﬂux activator constituents and thus is not sub-

jected to the problems/complications of chemistry for-

mulas by the ﬂux supplier; 2) it was an accepted indus-

try acknowledged fact that if a component or printed

wiring board surface was found to have acceptable sol-

derability test results using ‘‘R type’’ ﬂux then the more

active ﬂux formulations used in the assembly process

would produce acceptable solder process results. This

solderability assessment safety margin was a self

imposed, industry consensus decision. The J-STD-002/

003 committees understood the historical relevance

behind the decision to use ‘‘R type’’ ﬂux and had a

equally strong desire to maintain a solderability assess-

ment safety cushion. However, committees ﬁelded a

number of industry inputs to reassess the solderability

ﬂux composition based on the technology improvements

in surface ﬁnishes, improvements in the ﬂux chemistry

formulations from ﬂux suppliers, and the desire to not

have excessive safety margin which would impact cost

and schedule in an non-value added manner. The com-

mittees conducted a number of tests (Wenger, Kwoka,

ACI) demonstrating, using a speciﬁc standard level of

activation on real world, industry supplied component

and printed wiring board cases, that the occurrence of a

‘‘false acceptable’’ solderability test result was

extremely low. There was no case that exhibited a ‘‘pass

ROL1 test - fail ROL0 test - Fail during board assembly

‘‘sequence. In fact the use of both ROL1 and ROL0 are

more likely to create a ‘‘false reject ‘‘dip and look sol-

derability test result when compared to board level sol-

dering performance.

4) Standardization of Solderability Test Flux Composi-

tion On A Global Scale

A second major goal of the J-STD-002/003 solderability

committees is to develop test methods and standards

Table 3-1 Flux Composition

Constituent

Composition by

Weight Percent

Flux #1 Flux #2

Colophony 25 ± 0.5 25 ± 0.5

Diethylammonium hydrochloride

(CAS 660-68-4)

0.15 ± 0.01 0.39 ± 0.01

Isopropyl Alcohol (IPA) Balance Balance

Weight of Chlorine as % of solids 0.2 0.5

IPC J-STD-003B March 2007

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\