Condenso_Series - 第19页

19 Loadin gConcept The possib ilities of CondensoX -Line 3-chamber system forflux-freeprocesscontrol–whichisarstintheworldof vapour phase soldering systems! Controlled, rapid assembly cooling can be achiev…

Condenso series

CondensoX-Line

Reliable and repeatable

The CondensoX-Line enables vacuum condensation solde-

ring processes to be easily integrated into standard SMD

lines. This allows void-free solder joints to be manufactured

in a completely inert process environment (<100ppm O2),

whether they are standard modules with BGA devices or DCB

substrates for power electronics.

By building a 3-chamber system, low cycle times can be

achievedforinertsolderingprocesses.Thenalgas-tight

cooling chamber provides for controlled and rapid cooling

of the assemblies by means of adjustable convection with

less than 100 ppm residual oxygen in the atmosphere. The

CondensoX-Line meets the highest demands of mass pro-

duction in the power electronics.

 Idealfortheprocessingofmassiveassemblies(IGBT,Heatsinks)

 ReliablecondensationsolderingprocessforSMDmanufacturinginacontinuousprocess

 Horizontaltransportofthemodulesoftheentireprocess

 Inertprocessatmosphereduringtheentiresolderingprocess

 Coolingsectioncanbeusedwith<100ppmresidualoxygen

 Void-freesolderingwiththeuseofvacuumforbestresults

LoadingConcept

The possibilities of CondensoX-Line

3-chamber system

forflux-freeprocesscontrol–whichisarstintheworldof

vapour phase soldering systems! Controlled, rapid assembly

cooling can be achieved with less than 100 ppm residual

oxygen in the atmosphere using controllable convection in

thenal,gas-tightcoolingchamber.Inthisway,void-reduced

soldered joints can be made in a completely inert process

environment, irrespective of whether this is with standard

assemblies with BGA components or a DCB substrate for

power electronics.

The CondensoX-Line is set up as a 3-chamber system to

achieve low cycle times with inline soldering processes. The

rstchamberprovidesaprotectivenitrogenatmospherefor

the products (pre-inerting) before it is transported to the ac-

tual soldering process. The second process chamber that is

suitable for vacuum can be flooded with nitrogen or forming

gases and provides an inert or activating and void-reducing

process atmosphere throughout the whole soldering pro-

cess. In addition, formic acid can be used as an option here

Construction of the 3-chamber system of the CondensoX-Line

1. Loading

2. Pre-chamber/Pre-inerting

3. Soldering/Vacuum

4. Cooling

5. Unloading

3.

5.

4.

Cooling chamber

Pre chamber

Process chamber

Innovativesoftware

Big data and process management

Integratinghighlyspecialisedsoftwareinmodernmanufacturewillbecomemoreand

morecommoninfuture.Systemsandprocessesaremanaged,monitored,analysedand

optimised.Theorder,productdata,eciencyandstatusdata,speciedsettings,archived

prolesandcurrentvaluesareincorporatedintothemachinecontrolsystemproduct

documentationandanalysis.

With ViCON Condenso, Rehm offers a clear software package for the Condenso series that

is intuitive to use with its touchscreen interface. All messages, commands and parameters

arevisibleataglanceonthemainscreenwithitsmachineview.Simpleprolingwithclearly

structured process stages is therefore possible – with or without the vacuum option.

With numerous other features, such as a favourites bar that can be set up as required, struc-

tured grouping of parameters and individual process monitoring and documentation, ViCON

offers you optimal support for your manufacturing processes.